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1. 发明申请

US20110315355A1 IMMERSION-COOLING APPARATUS AND METHOD FOR AN ELECTRONIC SUBSYSTEM OF AN ELECTRONICS RACK 有权
标题翻译：电子机架的电子子系统的冷却冷却装置和方法
公开(公告)号：US20110315355A1
公开(公告)日：2011-12-29
申请号：US12825756
申请日：2010-06-29
申请人： Levi A. CAMPBELL , Richard C. CHU , Michael J. ELLSWORTH, Jr. , Madhusudan K. IYENGAR , Robert E. SIMONS
发明人： Levi A. CAMPBELL , Richard C. CHU , Michael J. ELLSWORTH, Jr. , Madhusudan K. IYENGAR , Robert E. SIMONS
IPC分类号： F28D15/00 , F25B41/00
CPC分类号： H05K7/20809 , F28D15/02
摘要： Cooling apparatus and method are provided for immersion-cooling of an electronic subsystem of an electronics rack. The cooling apparatus includes a housing at least partially surrounding and forming a sealed compartment about the electronic subsystem and a dielectric fluid disposed within the sealed compartment, with the electronic subsystem being immersed within the dielectric fluid. A liquid-cooled vapor condenser is provided which includes a plurality of thermally conductive condenser fins extending within the sealed compartment in an upper portion of the compartment. The condenser fins facilitate cooling of dielectric fluid vapor rising to the upper portion of the compartment. A filler material is disposed within the sealed compartment to reduce the amount of dielectric fluid required within the compartment to achieve immersion-cooling of the electronic subsystem, and the filler material includes a shaped surface to direct dielectric fluid vapor within the compartment towards the condenser fins.
摘要翻译：提供冷却装置和方法用于电子机架的电子子系统的浸没冷却。冷却装置包括至少部分围绕电子子系统和形成密封隔室的外壳，以及设置在密封室内的电介质流体，电子子系统浸没在电介质流体内。提供了一种液体冷却的蒸汽冷凝器，其包括在隔室的上部中在密封隔室内延伸的多个导热冷凝器翅片。冷凝器翅片有助于冷却上升到隔室上部的介质流体蒸气。填充材料设置在密封隔室内以减少隔室内所需的介电流体的量以实现电子子系统的浸没冷却，并且填充材料包括成形表面，以将隔室内的介质流体蒸气导向冷凝器翅片。

2. 发明申请

US20090223234A1 MONITORING METHOD AND SYSTEM FOR DETERMINING AIRFLOW RATE THROUGH AND HEAT REMOVAL RATE OF AN AIR-CONDITIONING UNIT 有权
标题翻译：用于通过空气调节单元确定气流速率和加热去除速率的监测方法和系统
公开(公告)号：US20090223234A1
公开(公告)日：2009-09-10
申请号：US12031982
申请日：2008-02-15
申请人： Levi A. CAMPBELL , Richard C. CHU , Michael J. ELLSWORTH, Jr. , Madhusudan K. IYENGAR , Robert E. SIMONS
发明人： Levi A. CAMPBELL , Richard C. CHU , Michael J. ELLSWORTH, Jr. , Madhusudan K. IYENGAR , Robert E. SIMONS
IPC分类号： F28F27/00 , F25B49/00 , G05D23/00 , G06F1/20
CPC分类号： F24F11/0001 , G06F1/20 , H05K7/20836
摘要： Monitoring method and system are provided for dynamically determining airflow rate through and heat removal rate of an air-conditioning unit, such as a computer room air-conditioning unit. The method includes: sensing inlet and outlet temperatures of fluid passing through a heat exchanger associated with the air-conditioning unit; sensing air temperature at an air inlet side of the heat exchanger; automatically determining at least one of airflow rate through or heat removal rate of the air-conditioning unit, the automatically determining employing the sensed inlet temperature and outlet temperature of fluid passing through the heat exchanger, and the sensed air temperature at the air inlet side of the heat exchanger; and outputting the determined airflow rate through or heat removal rate of the air-conditioning unit. In one embodiment, the heat exchanger is an auxiliary air-to-air heat exchanger, and in another embodiment, the heat exchanger is the air-to-liquid heat exchanger of the air-conditioner.
摘要翻译：提供监测方法和系统，用于动态地确定诸如计算机室空调单元之类的空调单元的空气流量和排热率。该方法包括：检测通过与空调单元相关联的热交换器的流体的入口和出口温度; 感测热交换器的空气入口侧的空气温度; 自动确定空气调节单元的气流速率或排热速率中的至少一个，使用感测到的通过热交换器的流体的入口温度和出口温度以及感测到的空气入口侧的空气温度的自动确定热交换器; 并输出所确定的空气流量通过或所述空调单元的除热率。在一个实施例中，热交换器是辅助空气 - 空气热交换器，在另一个实施例中，热交换器是空调器的空气 - 液体热交换器。

3. 发明申请

US20090086428A1 DOCKING STATION WITH HYBRID AIR AND LIQUID COOLING OF AN ELECTRONICS RACK 审中-公开
标题翻译：电子机架混合空气和液体冷却的锁定站
公开(公告)号：US20090086428A1
公开(公告)日：2009-04-02
申请号：US11862346
申请日：2007-09-27
申请人： Levi A. CAMPBELL , Richard C. CHU , Michael J. ELLSWORTH, Jr. , Madhusudan K. IYENGAR , Robert E. SIMONS
发明人： Levi A. CAMPBELL , Richard C. CHU , Michael J. ELLSWORTH, Jr. , Madhusudan K. IYENGAR , Robert E. SIMONS
IPC分类号： H05K7/20
CPC分类号： H05K7/2079
摘要： A docking station is provided for cooling an electronics rack of a data center. The docking station includes an enclosure having at least one wall, a cover coupled to the at least one wall, and a central opening sized to receive the electronics rack therein. The enclosure is separate and freestanding from the electronics rack and surrounds the electronics rack, and facilitates establishing a closed loop airflow path passing through air inlet and outlet sides of the rack and through an air return pathway of the enclosure. The docking station further includes an air-to-liquid heat exchange assembly, disposed within the air return pathway for cooling circulating air passing through the closed loop airflow path, and at least one modular cooling unit, disposed within the enclosure for providing system coolant to the air-to-liquid heat exchange assembly and to at least one electronics subsystem of the electronics rack.
摘要翻译：提供对接站用于冷却数据中心的电子机架。对接站包括具有至少一个壁的壳体，耦合到至少一个壁的盖以及尺寸适于在其中容纳电子机架的中心开口。外壳与电子机架分开独立，并且围绕电子机架，并且有助于建立通过机架的空气入口侧和出口侧以及通过外壳的空气返回路径的闭环气流路径。对接站还包括空气 - 液体热交换组件，其设置在空气返回路径内，用于冷却通过闭环气流路径的循环空气，以及设置在外壳内的至少一个模块化冷却单元，用于将系统冷却剂提供给空气 - 液体热交换组件和电子机架的至少一个电子子系统。

4. 发明申请

US20110058637A1 PRESSURE CONTROL UNIT AND METHOD FACILITATING SINGLE-PHASE HEAT TRANSFER IN A COOLING SYSTEM 审中-公开
标题翻译：压力控制单元和方法在冷却系统中实现单相热传递
公开(公告)号：US20110058637A1
公开(公告)日：2011-03-10
申请号：US12556019
申请日：2009-09-09
申请人： Levi A. CAMPBELL , Richard C. CHU , Michael J. ELLSWORTH, Jr. , Madhusudan K. IYENGAR , Robert E. SIMONS
发明人： Levi A. CAMPBELL , Richard C. CHU , Michael J. ELLSWORTH, Jr. , Madhusudan K. IYENGAR , Robert E. SIMONS
IPC分类号： G21C9/004 , G21C15/00
CPC分类号： F28D15/00 , G05D16/202
摘要： A pressure control unit and method are provided for facilitating single-phase heat transfer within a liquid-based cooling system. The pressure control unit includes a pressure vessel containing system coolant, and a pressurizing mechanism associated with the pressure vessel. A coolant line couples system coolant in the pressure vessel in fluid communication with the coolant loop of the cooling system, and a regulator mechanism couples to the pressurizing mechanism to maintain pressure within the pressure vessel at or above a defined pressure threshold, thus maintaining pressure within the coolant loop above the pressure threshold. The defined pressure threshold is set to facilitate system coolant within the coolant loop remaining single-phase throughout an operational temperature range of the system coolant within the coolant loop. More particularly, the pressure threshold is set to ensure pressure of system coolant within the coolant loop remains above the coolant's saturation pressure at maximum operational temperature.
摘要翻译：提供了一种压力控制单元和方法，用于促进在液体冷却系统内的单相热传递。压力控制单元包括容纳系统冷却剂的压力容器和与压力容器相关联的加压机构。冷却剂管线将压力容器中的系统冷却剂与冷却系统的冷却剂回路流体连通，并且调节器机构联接到加压机构，以将压力容器内的压力维持在或高于限定的压力阈值，从而保持在冷却剂回路高于压力阈值。设定的压力阈值被设定为便于在冷却剂回路内的系统冷却剂的整个工作温度范围内，冷却剂回路内的系统冷却剂保持单相。更具体地，设定压力阈值以确保冷却剂回路内的系统冷却剂的压力在最大工作温度下保持高于冷却剂的饱和压力。

5. 发明申请

US20090086432A1 DOCKING STATION WITH CLOSED LOOP AIRLFOW PATH FOR FACILITATING COOLING OF AN ELECTRONICS RACK 审中-公开
标题翻译：带有闭环式空气通道的锁紧站，用于促进电子货架的冷却
公开(公告)号：US20090086432A1
公开(公告)日：2009-04-02
申请号：US11862328
申请日：2007-09-27
申请人： Levi A. CAMPBELL , Richard C. CHU , Michael J. ELLSWORTH, Jr. , Madhusudan K. IYENGAR , Robert E. SIMONS
发明人： Levi A. CAMPBELL , Richard C. CHU , Michael J. ELLSWORTH, Jr. , Madhusudan K. IYENGAR , Robert E. SIMONS
IPC分类号： H05K7/20 , F28D15/00
CPC分类号： H05K7/20754
摘要： A docking station is provided for cooling an electronics rack of a data center. The docking station includes an enclosure having at least one wall, a cover coupled to the at least one wall, and a central opening sized to receive the electronics rack therein through an access opening in the wall. The enclosure is separate and freestanding from the electronics rack, and when the electronics rack is operatively positioned within the central opening, the enclosure surrounds the electronics rack and facilitates establishing a closed loop airflow path passing through air inlet and outlet sides of the rack and through an air return pathway of the enclosure. The docking station further includes an air-to-liquid heat exchange assembly disposed within the air return pathway of the enclosure for cooling circulating air passing through the closed loop airflow path.
摘要翻译：提供对接站用于冷却数据中心的电子机架。对接站包括具有至少一个壁的壳体，耦合到至少一个壁的盖，以及大小适于通过壁中的进入开口将电子机架接纳到其中的中心开口。外壳与电子机架分开独立，并且当电子机架可操作地定位在中央开口内时，外壳围绕电子机架，并有助于建立通过机架的空气入口和出口侧的闭环气流路径，并通过外壳的空气返回路径。对接站还包括设置在外壳的空气返回路径内的空气 - 液体热交换组件，用于冷却通过闭环气流路径的循环空气。

6. 发明申请

US20080307806A1 COOLING SYSTEM AND METHOD UTILIZING THERMAL CAPACITOR UNIT(S) FOR ENHANCED THERMAL ENERGY TRANSFER EFFICIENCY 失效
标题翻译：使用热电偶单元（S）的冷却系统和方法，以提高热能传递效率
公开(公告)号：US20080307806A1
公开(公告)日：2008-12-18
申请号：US11762822
申请日：2007-06-14
申请人： Levi A. CAMPBELL , Richard C. CHU , Michael J. ELLSWORTH, Jr. , Madhusudan K. IYENGAR , Robert E. SIMONS
发明人： Levi A. CAMPBELL , Richard C. CHU , Michael J. ELLSWORTH, Jr. , Madhusudan K. IYENGAR , Robert E. SIMONS
IPC分类号： F28C1/00 , F28D15/00 , H05K7/20
CPC分类号： F28D20/021 , F24F5/0017 , H05K7/2079 , H05K7/20836 , Y02E60/145 , Y02E60/147
摘要： A cooling system and method are provided which include a facility cooling unit, a cooling tower, and one or more thermal capacitor units. The facility cooling unit, which includes a heat dissipation coolant loop, facilitates thermal energy extraction from a facility, such as a data center, for expelling of the energy to coolant within the heat dissipation coolant loop. The cooling tower is in fluid communication with the coolant loop, and includes a liquid-to-air heat exchanger for expelling thermal energy from coolant of the heat dissipation coolant loop to the surrounding environment. The thermal capacitor unit is in fluid communication with the heat dissipation coolant loop to facilitate efficient thermal energy transfer from coolant with in the coolant loop to the surrounding environment with variation in ambient temperature about the cooling tower.
摘要翻译：提供了一种冷却系统和方法，其包括设备冷却单元，冷却塔和一个或多个热电容器单元。包括散热冷却剂回路的设备冷却单元有助于从诸如数据中心的设备的热能提取，以将能量排出到散热冷却剂回路内的冷却剂。冷却塔与冷却剂回路流体连通，并且包括用于将热能从散热冷却剂回路的冷却剂排出到周围环境的液体 - 空气热交换器。热电容器单元与散热冷却剂回路流体连通，以便在冷却剂回路中的冷却剂与围绕冷却塔周围环境温度变化的周围环境有效的热能传递。

7. 发明申请

US20110067842A1 FLUID ENCAPSULATED HEAT TRANSFER VESSEL AND METHOD 审中-公开
标题翻译：流体密封式传热容器及方法
公开(公告)号：US20110067842A1
公开(公告)日：2011-03-24
申请号：US12564199
申请日：2009-09-22
申请人： Levi A. CAMPBELL , Richard C. CHU , Michael J. ELLSWORTH, Jr. , Madhusudan K. IYENGAR , Robert E. SIMONS
发明人： Levi A. CAMPBELL , Richard C. CHU , Michael J. ELLSWORTH, Jr. , Madhusudan K. IYENGAR , Robert E. SIMONS
IPC分类号： F28D15/00 , A47J36/00 , B21D53/02
CPC分类号： A47J36/00 , F28D15/02 , Y10T29/4935 , Y10T29/49353
摘要： A heat transfer vessel is provided which facilitates heating of a substance when disposed therein. The vessel is a partially hollow structure which includes a chamber formed between an outer shell and an inner shell, in base and sidewall portions of the vessel. A heat transfer fluid is disposed within the chamber to facilitate transfer of heat from the outer shell to the inner shell, and therefore, to a substance when disposed within the vessel. The heat transfer fluid is a two-phase encapsulated fluid with a liquid state which undergoes boiling with the application of heat to the outer shell and a vapor state which condenses with contact to the inner shell, thereby facilitating transfer of heat from the outer shell to the inner shell, and hence to the substance when disposed within the vessel.
摘要翻译：提供了一种传热容器，其有助于物质在其中放置时的加热。容器是部分中空的结构，其包括形成在外壳和内壳之间的室，在容器的基部和侧壁部分中。传热流体设置在腔室内，以便于将热量从外壳传递到内壳，并因此传送到置于容器内的物质。传热流体是具有液体状态的两相包封的流体，其通过向外壳施加热而经历沸腾，并且与外部壳体接触而冷凝的蒸气状态，从而有助于将热量从外壳传递到内壳，因此在物体内置于容器内时。

8. 发明申请

US20100103618A1 APPARATUS AND METHOD FOR FACILITATING PUMPED IMMERSION-COOLING OF AN ELECTRONIC SUBSYSTEM 有权
标题翻译：用于促进电子系统的泵送冷却冷却的装置和方法
公开(公告)号：US20100103618A1
公开(公告)日：2010-04-29
申请号：US12256628
申请日：2008-10-23
申请人： Levi A. CAMPBELL , Richard C. CHU , Michael J. ELLSWORTH, Jr. , Madhusudan K. IYENGAR , Robert E. SIMONS
发明人： Levi A. CAMPBELL , Richard C. CHU , Michael J. ELLSWORTH, Jr. , Madhusudan K. IYENGAR , Robert E. SIMONS
IPC分类号： H05K7/20 , F25D23/12
CPC分类号： H05K7/20236 , H05K7/20772
摘要： Apparatus and method are provided for facilitating pumped, immersion-cooling of an electronic subsystem having multiple different types of components to be immersion-cooled. The apparatus includes a container sized to receive the electronic subsystem, and a coolant inlet port and a coolant outlet port for facilitating ingress and egress of coolant through the container. The apparatus further includes a coolant pump assembly coupled in fluid communication with the coolant inlet and outlet ports of the container for facilitating active pumping of coolant through the container. When the electronic subsystem is operatively inserted into the container and coolant is pumped through the container, the multiple different types of components of the electronic subsystem are immersion-cooled by the coolant. In one embodiment, a filler element is disposed within the container, and is sized to reduce the amount of coolant within the container, while still maintaining the components of the electronic subsystem immersion-cooled.
摘要翻译：提供了一种装置和方法，用于促进具有多种不同类型待组件的电子子系统的浸入式冷却。该设备包括一个容纳电子子系统的容器，以及一个冷却剂入口和一个冷却剂出口，用于促进冷却剂通过容器的进出。该装置还包括与容器的冷却剂入口和出口流体连通地联接的冷却剂泵组件，用于促进冷却剂通过容器的主动泵送。当电子子系统可操作地插入容器中并且冷却剂被泵送通过容器时，电子子系统的多种不同类型的部件被冷却剂浸没冷却。在一个实施例中，填充元件设置在容器内，并且其尺寸设计成减小容器内的冷却剂的量，同时仍保持电子子系统的部件浸没冷却。

9. 发明申请

US20100103614A1 APPARATUS AND METHOD FOR IMMERSION-COOLING OF AN ELECTRONIC SYSTEM UTILIZING COOLANT JET IMPINGEMENT AND COOLANT WASH FLOW 有权
标题翻译：使用冷却剂喷射冲击和冷却液洗涤流的电子系统进行冷却冷却的装置和方法
公开(公告)号：US20100103614A1
公开(公告)日：2010-04-29
申请号：US12256631
申请日：2008-10-23
申请人： Levi A. CAMPBELL , Richard C. CHU , Michael J. ELLSWORTH, Jr. , Madhusudan K. IYENGAR , Robert E. SIMONS
发明人： Levi A. CAMPBELL , Richard C. CHU , Michael J. ELLSWORTH, Jr. , Madhusudan K. IYENGAR , Robert E. SIMONS
IPC分类号： H05K7/20
CPC分类号： H05K7/20809
摘要： Apparatus and method are provided for facilitating pumped, immersion-cooling of an electronic system having multiple different types of electronic components. The apparatus includes a container sized to receive the electronic system, a coolant inlet port and a coolant outlet port for facilitating ingress and egress of coolant through the container, and a manifold structure associated with the container. The manifold structure includes a coolant jet plenum with an inlet opening in fluid communication with the coolant inlet port, and one or more jet orifices in fluid communication with the coolant jet plenum. The jet orifices are positioned to facilitate cooling of at least one electronic component of the multiple different types of electronic components by jet impingement of coolant thereon when the electronic system is operatively positioned within the container for immersion-cooling thereof.
摘要翻译：提供了用于促进具有多种不同类型的电子部件的电子系统的抽吸，浸没冷却的装置和方法。该装置包括容纳尺寸以容纳电子系统的容器，冷却剂入口和冷却剂出口，用于促进冷却剂通过容器的入口和出口，以及与容器相关联的歧管结构。歧管结构包括具有与冷却剂入口端口流体连通的入口开口的冷却剂喷射增压室和与冷却剂喷射气室流体连通的一个或多个喷射孔。喷射孔定位成当电子系统可操作地定位在容器内以进行浸入冷却时，通过喷射冲击其上的冷却剂来促进对多种不同类型电子部件的至少一个电子部件的冷却。

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