专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US07971347B2 Method of interconnecting workpieces 有权
标题翻译：互连工件的方法
公开(公告)号：US07971347B2
公开(公告)日：2011-07-05
申请号：US12215550
申请日：2008-06-27
申请人： Leonel Arana , Rob Nickerson , Lim Chong Sim , Edward Prack , Yoshihiro Tomita
发明人： Leonel Arana , Rob Nickerson , Lim Chong Sim , Edward Prack , Yoshihiro Tomita
IPC分类号： H05K3/30
CPC分类号： H01L23/49816 , H01L21/563 , H01L23/3128 , H01L24/16 , H01L24/73 , H01L25/0657 , H01L25/105 , H01L25/50 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/48227 , H01L2224/73203 , H01L2224/73204 , H01L2224/73265 , H01L2225/0651 , H01L2225/1023 , H01L2225/1058 , H01L2924/01079 , H01L2924/14 , H01L2924/1433 , H01L2924/15321 , H01L2924/18161 , H01L2924/3511 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49147 , Y10T29/49165 , Y10T29/49172 , Y10T29/4919 , H01L2924/00012
摘要： Embodiments of an apparatus and methods of forming a package on package interconnect and its application to the packaging of microelectronic devices are described herein. Other embodiments may be described and claimed.
摘要翻译：本文描述了在封装互连上形成封装的装置和方法及其在微电子器件的封装上的应用的实施例。可以描述和要求保护其他实施例。

2. 发明申请

US20090320281A1 Apparatus and methods of forming package-on-package interconnects 有权
标题翻译：形成封装在封装互连上的装置和方法
公开(公告)号：US20090320281A1
公开(公告)日：2009-12-31
申请号：US12215550
申请日：2008-06-27
申请人： Leonel Arana , Rob Nickerson , Lim Chong Sim , Edward Prack , Yoshihiro Tomita
发明人： Leonel Arana , Rob Nickerson , Lim Chong Sim , Edward Prack , Yoshihiro Tomita
IPC分类号： H01R9/00
CPC分类号： H01L23/49816 , H01L21/563 , H01L23/3128 , H01L24/16 , H01L24/73 , H01L25/0657 , H01L25/105 , H01L25/50 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/48227 , H01L2224/73203 , H01L2224/73204 , H01L2224/73265 , H01L2225/0651 , H01L2225/1023 , H01L2225/1058 , H01L2924/01079 , H01L2924/14 , H01L2924/1433 , H01L2924/15321 , H01L2924/18161 , H01L2924/3511 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49147 , Y10T29/49165 , Y10T29/49172 , Y10T29/4919 , H01L2924/00012
摘要： Embodiments of an apparatus and methods of forming a package on package interconnect and its application to the packaging of microelectronic devices are described herein. Other embodiments may be described and claimed.
摘要翻译：本文描述了在封装互连上形成封装的装置和方法及其在微电子器件的封装上的应用的实施例。可以描述和要求保护其他实施例。

3. 发明申请

US20060286768A1 Method of supporting microelectronic wafer during backside processing 审中-公开
标题翻译：在背面处理中支撑微电子晶片的方法
公开(公告)号：US20060286768A1
公开(公告)日：2006-12-21
申请号：US11155751
申请日：2005-06-16
申请人： Leonel Arana , Edward Prack , Michael Newman
发明人： Leonel Arana , Edward Prack , Michael Newman
IPC分类号： H01L21/30
CPC分类号： H01L21/78 , H01L21/304 , H01L21/306 , H01L21/6835
摘要： A method of supporting a microelectronic wafer during backside processing. The method comprises: selecting a rigid carrier, an adhesive, and a radiation source to emit radiation at a predetermined wavelength range; forming a wafer-carrier stack by providing the adhesive between the wafer and the carrier and curing the adhesive to bond the wafer to the carrier; subjecting the wafer in the wafer-carrier stack to backside processing; and removing the carrier and the adhesive from the wafer-carrier stack comprising detackifying the adhesive by irradiating the wafer-carrier stack from a carrier side thereof with radiation from the radiation source. The carrier is adapted to transmit therethrough at least some of the radiation from the radiation source. and the adhesive is adapted to absorb substantially all radiation transmitted through the carrier and is further adapted to be detackified as a result of absorbing said substantially all radiation.
摘要翻译：背面处理中支撑微电子晶片的方法。该方法包括：选择刚性载体，粘合剂和辐射源以发射预定波长范围的辐射; 通过在晶片和载体之间提供粘合剂并固化粘合剂以将晶片结合到载体上来形成晶片载体堆叠; 对晶片载体叠层中的晶片进行背面处理; 以及从所述晶片载体堆叠中移除所述载体和所述粘合剂，其包括通过用来自所述辐射源的辐射从其载体侧照射所述晶片载体叠层而使所述粘合剂脱胶。载体适于透射来自辐射源的至少一些辐射。并且粘合剂适于吸收透射穿过载体的基本上所有的辐射，并且还适于由于吸收所述基本上所有的辐射而被去胶化。

4. 发明申请

US20070004171A1 Method of supporting microelectronic wafer during backside processing using carrier having radiation absorbing film thereon 审中-公开
标题翻译：在背面处理中使用其上具有辐射吸收膜的载体支撑微电子晶片的方法
公开(公告)号：US20070004171A1
公开(公告)日：2007-01-04
申请号：US11173857
申请日：2005-06-30
申请人： Leonel Arana , Edward Prack , Sudhakar Kulkarni
发明人： Leonel Arana , Edward Prack , Sudhakar Kulkarni
IPC分类号： H01L21/30 , H01L21/00
CPC分类号： H01L21/67132 , H01L21/67092 , H01L21/67115 , H01L21/6835 , H01L2221/6834 , H01L2221/68363 , H01L2224/16 , H01L2924/01019
摘要： A method of supporting a microelectronic wafer during backside processing. The method comprises: selecting a rigid carrier including a radiation absorbing film thereon, an adhesive, and a radiation source to emit radiation at a predetermined wavelength range; forming a wafer-carrier stack by providing the adhesive between the wafer and the carrier and curing the adhesive to bond the wafer to the carrier; subjecting the wafer in the wafer-carrier stack to backside processing; and removing the carrier and the adhesive from the wafer-carrier stack comprising detackifying the adhesive by irradiating the wafer-carrier stack from a carrier side thereof with radiation from the radiation source. The carrier is adapted to transmit therethrough at least some of the radiation from the radiation source. and the radiation absorbing film is adapted to absorb substantially all radiation transmitted through the carrier and is further adapted to be heated to detackify the adhesive as a result of absorbing said substantially all radiation.
摘要翻译：背面处理中支撑微电子晶片的方法。该方法包括：选择其上包括辐射吸收膜的刚性载体，粘合剂和辐射源以发射预定波长范围的辐射; 通过在晶片和载体之间提供粘合剂并固化粘合剂以将晶片结合到载体上来形成晶片载体堆叠; 对晶片载体叠层中的晶片进行背面处理; 以及从所述晶片载体堆叠中移除所述载体和所述粘合剂，其包括通过用来自所述辐射源的辐射从其载体侧照射所述晶片载体叠层而使所述粘合剂脱胶。载体适于透射来自辐射源的至少一些辐射。并且辐射吸收膜适于吸收透射穿过载体的基本上所有辐射，并且还适于被加热以由于吸收所述基本上所有的辐射而使粘合剂脱胶。

5. 发明申请

US20070077728A1 Adhesive system for supporting thin silicon wafer 有权
标题翻译：用于支撑薄硅晶片的粘合系统
公开(公告)号：US20070077728A1
公开(公告)日：2007-04-05
申请号：US11241499
申请日：2005-09-30
申请人： Sudhakar Kulkarni , Leonel Arana , Edward Prack
发明人： Sudhakar Kulkarni , Leonel Arana , Edward Prack
IPC分类号： H01L21/30 , H01L21/46
CPC分类号： H01L21/78 , H01L21/6835 , H01L2221/68327 , H01L2221/6834 , H01L2221/68381
摘要： In some embodiments, an adhesive system for supporting thin silicon wafer is presented. In this regard, a method is introduced to bond a silicon wafer to a translucent carrier through the use of an adhesive. Other embodiments are also disclosed and claimed.
摘要翻译：在一些实施例中，呈现用于支撑薄硅晶片的粘合系统。在这方面，引入了通过使用粘合剂将硅晶片粘合到半透明载体上的方法。还公开并要求保护其他实施例。

6. 发明授权

US09006887B2 Forming sacrificial composite materials for package-on-package architectures and structures formed thereby 有权
标题翻译：形成用于封装封装结构和由此形成的结构的牺牲复合材料
公开(公告)号：US09006887B2
公开(公告)日：2015-04-14
申请号：US12380957
申请日：2009-03-04
申请人： Rajasekaran Swaminathan , Leonel Arana , Yoshihiro Tomita , Yosuke Kanaoka
发明人： Rajasekaran Swaminathan , Leonel Arana , Yoshihiro Tomita , Yosuke Kanaoka
IPC分类号： H01L23/498 , H01L21/48 , H01L25/10 , H05K3/34 , H01L21/768
CPC分类号： H01L24/16 , H01L21/4853 , H01L23/3157 , H01L23/49816 , H01L23/49894 , H01L24/11 , H01L24/13 , H01L24/14 , H01L25/0657 , H01L25/105 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/11849 , H01L2224/16012 , H01L2224/16147 , H01L2224/16225 , H01L2225/06513 , H01L2225/06527 , H01L2225/1058 , H01L2924/00014 , H01L2924/181 , H05K3/3452 , H05K3/3484 , H05K2203/043 , H05K2203/083 , H05K2203/1476 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： Methods of forming a microelectronic packaging structure are described. Those methods may include forming a solder paste comprising a sacrificial polymer on a substrate, curing the solder paste below a reflow temperature of the solder to form a solid composite hybrid bump on the conductive pads, forming a molding compound around the solid composite hybrid bump, and reflowing the hybrid bump, wherein the sacrificial polymer is substantially decomposed.
摘要翻译：描述形成微电子封装结构的方法。这些方法可以包括在衬底上形成包含牺牲聚合物的焊膏，将焊膏固化在焊料的回流温度以下，以在导电焊盘上形成固体复合混合凸块，在固体复合混合凸块周围形成模塑料，并且回流混合凸块，其中牺牲聚合物基本分解。

7. 发明申请

US20100224993A1 Forming sacrificial composite materials for package-on-package architectures and structures formed thereby 有权
标题翻译：形成用于封装封装结构和由此形成的结构的牺牲复合材料
公开(公告)号：US20100224993A1
公开(公告)日：2010-09-09
申请号：US12380957
申请日：2009-03-04
申请人： Rajasekaran Swaminathan , Leonel Arana , Yoshihiro Tomita , Yosuke Kanaoka
发明人： Rajasekaran Swaminathan , Leonel Arana , Yoshihiro Tomita , Yosuke Kanaoka
IPC分类号： H01L23/498 , H01L21/768
CPC分类号： H01L24/16 , H01L21/4853 , H01L23/3157 , H01L23/49816 , H01L23/49894 , H01L24/11 , H01L24/13 , H01L24/14 , H01L25/0657 , H01L25/105 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/11849 , H01L2224/16012 , H01L2224/16147 , H01L2224/16225 , H01L2225/06513 , H01L2225/06527 , H01L2225/1058 , H01L2924/00014 , H01L2924/181 , H05K3/3452 , H05K3/3484 , H05K2203/043 , H05K2203/083 , H05K2203/1476 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： Methods of forming a microelectronic packaging structure are described. Those methods may include forming a solder paste comprising a sacrificial polymer on a substrate, curing the solder paste below a reflow temperature of the solder to form a solid composite hybrid bump on the conductive pads, forming a molding compound around the solid composite hybrid bump, and reflowing the hybrid bump, wherein the sacrificial polymer is substantially decomposed.
摘要翻译：描述形成微电子封装结构的方法。这些方法可以包括在衬底上形成包含牺牲聚合物的焊膏，将焊膏固化在焊料的回流温度以下，以在导电焊盘上形成固体复合混合凸块，在固体复合混合凸块周围形成模塑料，并且回流混合凸块，其中牺牲聚合物基本分解。

8. 发明申请

US20130140014A1 METHODS OF PROCESSING A THERMAL INTERFACE MATERIAL 有权
公开(公告)号：US20130140014A1
公开(公告)日：2013-06-06
申请号：US13754071
申请日：2013-01-30
申请人： Lakshmi Supriya , Jessica A. Weninger , Leonel Arana , Lateef Mustapha
发明人： Lakshmi Supriya , Jessica A. Weninger , Leonel Arana , Lateef Mustapha
IPC分类号： F28F7/00
CPC分类号： F28F7/00 , H01L23/3735 , H01L23/3737 , H01L23/433 , H01L24/30 , H01L24/33 , H01L2224/73253 , H01L2924/01006 , H01L2924/01012 , H01L2924/01033 , H01L2924/01056 , Y10T156/10 , Y10T428/31663
摘要： Methods are disclosed to process a thermal interface material to achieve easy pick and placement of the thermal interface material without lowering thermal performance of a completed semiconductor package. One method involves applying a non-adhesive layer on one or more surfaces of the thermal interface material, interfacing the thermal interface material with one or more components to interface the non-adhesive layer therebetween, and applying heat to alter the non-adhesive layer to increase thermal contact between the thermal interface material and the interfacing component(s).

9. 发明申请

US20070241448A1 ELECTRICALLY-ISOLATED INTERCONNECTS AND SEAL RINGS IN PACKAGES USING A SOLDER PREFORM 审中-公开
标题翻译：使用焊接前提的包装中的电气隔离互连和密封圈
公开(公告)号：US20070241448A1
公开(公告)日：2007-10-18
申请号：US11765969
申请日：2007-06-20
申请人： Leonel Arana , John Heck
发明人： Leonel Arana , John Heck
IPC分类号： H01L23/12
CPC分类号： B23K3/0623 , B23K2101/38 , H01L2224/17
摘要： Embodiments include electronic assemblies and methods for forming electronic assemblies. One embodiment includes a method of forming a MEMS device assembly, including forming an active MEMS region on a substrate. A plurality of bonding pads electrically coupled to the active MEMS region are formed. A seal ring wetting layer is also formed on the substrate, the seal ring wetting layer surrounding the active MEMS region. A single piece solder preform is positioned on the bonding pads and on the seal ring wetting layer, the single piece solder preform including a seal ring region and a bonding pad region. The seal ring region is connected to the bonding pad region by a plurality of solder bridges. The method also includes heating the single piece solder preform to a temperature above the reflow temperature, so that the bridges split and the solder from the preform accumulates on the seal ring wetting layer and the bonding pads. A lid is coupled to the solder. In certain embodiments the lid may include vias having conductive material therein for providing electrical contact to the MEMS device. Other embodiments are described and claimed.
摘要翻译：实施例包括用于形成电子组件的电子组件和方法。一个实施例包括形成MEMS器件组件的方法，包括在衬底上形成有源MEMS区域。形成电耦合到有源MEMS区域的多个接合焊盘。密封环润湿层也形成在衬底上，围绕有源MEMS区域的密封环润湿层。单块焊料预制件位于接合焊盘和密封环润湿层上，单件焊料预制件包括密封环区域和焊盘区域。密封圈区域通过多个焊接桥连接到焊盘区域。该方法还包括将单件焊料预制件加热到高于回流温度的温度，使得桥接器分裂，并且来自预制件的焊料积聚在密封环润湿层和接合焊盘上。盖子与焊料相连。在某些实施例中，盖可以包括其中具有导电材料的通孔，用于提供与MEMS器件的电接触。描述和要求保护其他实施例。

10. 发明授权

US08163598B2 Clipless integrated heat spreader process and materials 有权
标题翻译：无夹杂散热器整体加工和材料
公开(公告)号：US08163598B2
公开(公告)日：2012-04-24
申请号：US13006541
申请日：2011-01-14
申请人： George Kostiew , Raj Bahadur , James Mellody , George Vakanas , Leonel Arana
发明人： George Kostiew , Raj Bahadur , James Mellody , George Vakanas , Leonel Arana
IPC分类号： H01L21/50 , H01L21/48 , H01L21/44
CPC分类号： H01L23/42 , H01L21/50 , H01L23/10 , H01L2224/16225 , H01L2224/32225 , H01L2224/32245 , H01L2224/73204 , H01L2224/73253 , H01L2924/01079 , H01L2924/15311 , H01L2924/00
摘要： In one or more embodiments, a method comprising applying thermo compression to a package assembly including a lid, a die, and a package substrate to assemble the package assembly is disclosed. The method may include assembling the package assembly without coupling a biasing mechanism to the lid. Heat may be applied to a bond head coupled with a pick and place tool. Heat may be applied to a bond stage coupled to a carrier for holding the package assembly during processing. An adhesive applied to the lid or package substrate may be allowed to at least partially cure. The method may further include, in an oven, reflowing a thermal interface material (TIM) coupled to the lid and the die, curing the TIM, and/or curing the adhesive, without using clips.
摘要翻译：在一个或多个实施例中，公开了一种方法，其包括将热压力应用于包括盖子，模具和封装基板的封装组件以组装封装组件。该方法可以包括组装封装组件而不将偏压机构耦合到盖子。可以将热量施加到与拾取和放置工具耦合的结合头。可以将热量施加到在加工期间联接到用于保持包装组件的载体的接合台。施加到盖子或封装基底上的粘合剂可以被允许至少部分固化。该方法还可以包括在烘箱中回流耦合到盖子和模具的热界面材料（TIM），固化TIM和/或固化粘合剂，而不使用夹子。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式