专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US07532484B1 Electronic component assembly 有权
标题翻译：电子元器件组装
公开(公告)号：US07532484B1
公开(公告)日：2009-05-12
申请号：US12069469
申请日：2008-02-11
申请人： Steven L. Sailor , Hugh R. Hunkeler , Lee R. Hinze
发明人： Steven L. Sailor , Hugh R. Hunkeler , Lee R. Hinze
IPC分类号： H01R9/00
CPC分类号： H01G2/06 , H01G2/103 , H01R12/585 , H05K3/301 , H05K3/308 , H05K3/325 , H05K2201/10325 , H05K2201/1059 , H05K2201/10651
摘要： An electronic component assembly includes an electrical component assembled to a base and mounted to a support. The component electrical leads protrude through holes, along a channel, and make contact with connectors on the base. The base is formed of a polymeric material and contains protrusions for mechanically supporting the electrical component. When the base is mounted to the support, the connectors complete the electrical connection between the electrical component and the support.
摘要翻译：电子部件组件包括组装到基座并安装到支撑件的电气部件。部件电气引线沿着通道突出穿过孔，并与基座上的连接器接触。基座由聚合物材料形成并且包含用于机械地支撑电气部件的凸起。当基座安装到支撑件上时，连接器完成电气部件和支撑件之间的电气连接。

2. 发明授权

US07791901B2 Stand-off mounting apparatus for discrete electrical components 有权
标题翻译：用于分立电气部件的支架安装装置
公开(公告)号：US07791901B2
公开(公告)日：2010-09-07
申请号：US11805603
申请日：2007-05-24
申请人： Steven L. Sailor , Hugh R. Hunkeler , Lee R. Hinze
发明人： Steven L. Sailor , Hugh R. Hunkeler , Lee R. Hinze
IPC分类号： H05K7/02 , H05K7/04
CPC分类号： H05K3/301 , H01G2/04 , H01G4/38 , H05K1/141 , H05K3/308 , H05K7/12 , H05K2201/10015 , H05K2201/10303 , H05K2201/10325 , H05K2201/10462 , H05K2201/10515 , H05K2201/10568 , H05K2201/10583 , H05K2201/10606 , H05K2201/2036
摘要： A stand-off mounting apparatus includes an insulative carrier for off-board mounting of leaded or surface-mount components, particularly large temperature-sensitive discrete components such as capacitors. The carrier has a component-mounting surface that is elevated relative to the circuit board, and is positioned with respect to the circuit board such that the circuit board area under the mounting surface of the carrier is available for the placement of smaller non-temperature-sensitive components. The off-board components are mounted on the component-mounting surface of the carrier, and the carrier may include support features for providing additional mechanical support for the components. Electrical leads for electrically coupling the elevated components to the circuit board may be insert-molded in the carrier, or may be inserted into plated through-holes in the carrier.
摘要翻译：一种悬挂式安装装置包括一个绝缘载体，用于使板状或表面安装部件脱离安装，特别是大的温度敏感的分立元件如电容器。载体具有相对于电路板升高的部件安装表面，并且相对于电路板定位，使得载体安装表面下方的电路板区域可用于放置较小的非温度 - 敏感组件。脱离板部件安装在载体的部件安装表面上，并且载体可以包括用于为部件提供额外的机械支撑的支撑特征。用于将升高的部件电耦合到电路板的电引线可以嵌入成型在载体中，或者可以插入载体中的电镀通孔中。

3. 发明授权

US07735920B2 Child seat and method for monitoring installation of the child seat 有权
标题翻译：儿童座椅和儿童座椅安装方法
公开(公告)号：US07735920B2
公开(公告)日：2010-06-15
申请号：US11961220
申请日：2007-12-20
申请人： Lee R. Hinze , Hugh R. Hunkeler
发明人： Lee R. Hinze , Hugh R. Hunkeler
IPC分类号： B60N2/28
CPC分类号： B60N2/2806 , B60N2/2812 , B60N2002/2815
摘要： A child seat and a method for monitoring installation of the child seat are provided. The child seat includes a child seat frame configured to receive a child occupant. The child seat frame is configured to receive a seat belt webbing for securing the child seat frame to a vehicle seat. The child seat further includes a first bladder configured to contact the seat belt webbing. The first bladder has a fluid therein. The child seat further includes a first pressure sensor fluidly communicating with the fluid in the first bladder. The first pressure sensor is configured to output a first signal indicative of an amount of pressure in the first bladder. The child seat further includes a controller coupled to the child seat frame configured to receive the first signal and to compute a first tension value based on the first signal. The controller is further configured to generate a second signal to induce a first device disposed on the child seat frame to indicate when the first tension value is less than a first predetermined tension value.
摘要翻译：提供儿童座椅和监视儿童座椅安装的方法。儿童座椅包括一个儿童座椅框架，该儿童座椅框架被配置为接收一个小孩的乘客。儿童座椅框架被配置为接收用于将儿童座椅框架固定到车辆座椅上的安全带织带。儿童座椅还包括构造成接触座椅安全带织带的第一囊。第一膀胱在其中具有流体。儿童座椅还包括与第一气囊中的流体流体连通的第一压力传感器。第一压力传感器被配置为输出指示第一气囊中的压力量的第一信号。儿童座椅还包括耦合到儿童座椅框架的控制器，其被配置为接收第一信号并且基于第一信号计算第一张力值。控制器还被配置为产生第二信号以诱导设置在儿童座椅框架上的第一装置，以指示第一张力值何时小于第一预定张力值。

4. 发明申请

US20090160232A1 CHILD SEAT AND METHOD FOR MONITORING INSTALLATION OF THE CHILD SEAT 有权
标题翻译：儿童座椅和儿童座椅安装监控方法
公开(公告)号：US20090160232A1
公开(公告)日：2009-06-25
申请号：US11961220
申请日：2007-12-20
申请人： Lee R. Hinze , Hugh R. Hunkeler
发明人： Lee R. Hinze , Hugh R. Hunkeler
IPC分类号： B60N2/26
CPC分类号： B60N2/2806 , B60N2/2812 , B60N2002/2815
摘要： A child seat and a method for monitoring installation of the child seat are provided. The child seat includes a child seat frame configured to receive a child occupant. The child seat frame is configured to receive a seat belt webbing for securing the child seat frame to a vehicle seat. The child seat further includes a first bladder configured to contact the seat belt webbing. The first bladder has a fluid therein. The child seat further includes a first pressure sensor fluidly communicating with the fluid in the first bladder. The first pressure sensor is configured to output a first signal indicative of an amount of pressure in the first bladder. The child seat further includes a controller coupled to the child seat frame configured to receive the first signal and to compute a first tension value based on the first signal. The controller is further configured to generate a second signal to induce a first device disposed on the child seat frame to indicate when the first tension value is less than a first predetermined tension value.
摘要翻译：提供儿童座椅和监视儿童座椅安装的方法。儿童座椅包括一个儿童座椅框架，该儿童座椅框架被配置为接收一个小孩的乘客。儿童座椅框架被配置为接收用于将儿童座椅框架固定到车辆座椅上的安全带织带。儿童座椅还包括构造成接触座椅安全带织带的第一囊。第一膀胱在其中具有流体。儿童座椅还包括与第一气囊中的流体流体连通的第一压力传感器。第一压力传感器被配置为输出指示第一气囊中的压力量的第一信号。儿童座椅还包括耦合到儿童座椅框架的控制器，其被配置为接收第一信号并且基于第一信号计算第一张力值。控制器还被配置为产生第二信号以诱导设置在儿童座椅框架上的第一装置，以指示第一张力值何时小于第一预定张力值。

5. 发明申请

US20080291653A1 Stand-off mounting apparatus for discrete electrical components 有权
标题翻译：用于分立电气部件的支架安装装置
公开(公告)号：US20080291653A1
公开(公告)日：2008-11-27
申请号：US11805603
申请日：2007-05-24
申请人： Steven L. Sailor , Hugh R. Hunkeler , Lee R. Hinze
发明人： Steven L. Sailor , Hugh R. Hunkeler , Lee R. Hinze
IPC分类号： H05K7/02
CPC分类号： H05K3/301 , H01G2/04 , H01G4/38 , H05K1/141 , H05K3/308 , H05K7/12 , H05K2201/10015 , H05K2201/10303 , H05K2201/10325 , H05K2201/10462 , H05K2201/10515 , H05K2201/10568 , H05K2201/10583 , H05K2201/10606 , H05K2201/2036
摘要： A stand-off mounting apparatus includes an insulative carrier for off-board mounting of leaded or surface-mount components, particularly large temperature-sensitive discrete components such as capacitors. The carrier has a component-mounting surface that is elevated relative to the circuit board, and is positioned with respect to the circuit board such that the circuit board area under the mounting surface of the carrier is available for the placement of smaller non-temperature-sensitive components. The off-board components are mounted on the component-mounting surface of the carrier, and the carrier may include support features for providing additional mechanical support for the components. Electrical leads for electrically coupling the elevated components to the circuit board may be insert-molded in the carrier, or may be inserted into plated through-holes in the carrier.
摘要翻译：一种悬挂式安装装置包括一个绝缘载体，用于使板状或表面安装部件脱离安装，特别是大的温度敏感的分立元件如电容器。载体具有相对于电路板升高的部件安装表面，并且相对于电路板定位，使得载体安装表面下方的电路板区域可用于放置较小的非温度 - 敏感组件。脱离板部件安装在载体的部件安装表面上，并且载体可以包括用于为部件提供额外的机械支撑的支撑特征。用于将升高的部件电耦合到电路板的电引线可以嵌入成型在载体中，或者可以插入载体中的电镀通孔中。

6. 发明授权

US5603620A Integrated printed circuit connector and ground clip assembly 失效
标题翻译：集成印刷电路连接器和接地夹组件
公开(公告)号：US5603620A
公开(公告)日：1997-02-18
申请号：US511423
申请日：1995-08-04
申请人： Lee R. Hinze , Eric J. Thomas
发明人： Lee R. Hinze , Eric J. Thomas
IPC分类号： H01R12/50 , H01R13/658 , H01R4/66
CPC分类号： H01R23/6873 , H01R13/65802
摘要： A U-shaped ground clip and I/O pins are attached to a connector or header of a printed circuit board. The clip has leads which extend into the circuit board for connection to a ground plane and a spring portion which is biased against a metal case to afford a ground connection. The header securely positions the clip during soldering to assure a proper final configuration and to add stiffness to the clip to insure adequate force against the case.
摘要翻译： U形接地夹和I / O引脚连接到印刷电路板的连接器或接头。夹子具有延伸到电路板中的引线，用于连接到接地平面，弹簧部分被偏压抵靠金属壳体以提供接地连接。焊头在焊接期间将夹子牢固地定位，以确保适当的最终构造，并为夹子增加刚度，以确保足够的力抵抗外壳。

7. 发明授权

US5421601A Trailer hitch cover 失效
标题翻译：拖车挂车盖
公开(公告)号：US5421601A
公开(公告)日：1995-06-06
申请号：US131154
申请日：1993-10-04
申请人： Lee R. Hinze , Daniel L. McBride
发明人： Lee R. Hinze , Daniel L. McBride
IPC分类号： B60D1/60
CPC分类号： B60D1/60 , Y10T70/5867 , Y10T70/5982
摘要： A trailer hitch cover includes a removable hollow housing and a latch for securing the enclosure to the hitch so that it will remain in place while it is installed on the hitch. The hollow housing has an enclosed body and a tubular neck connected to and protruding from one wall of the enclosed body and being open at its outer end. The neck has a cross sectional size substantially smaller than that of the body. The enclosed body is formed by a pair of identical halves hinged together. Mating parts of the latch are mounted to identical halves of the tubular neck. The halves of the hitch cover are thus releasably secured together in a clam-shell fashion over the hitch so as to be mounted to a portion of the hitch at only the hollow neck of the housing.
摘要翻译：挂车挂车盖包括可拆卸的中空壳体和用于将外壳固定到搭接件的闩锁，使得它将在其安装在搭接上时保持在适当位置。中空壳体具有封闭体和连接到封闭体的一个壁并从其突出并且在其外端开口的管状颈部。颈部的截面尺寸基本上小于身体的截面尺寸。封闭体由铰链在一起的一对相同的一半形成。闩锁的配合部分安装到管状颈部的相同的两半。搭接盖的一半因此以蛤壳式的方式可拆卸地固定在搭接上，以便仅在壳体的中空颈部处安装到搭接部分。

8. 发明授权

US07724526B2 Electronic module with heat sink 有权
标题翻译：带散热片的电子模块
公开(公告)号：US07724526B2
公开(公告)日：2010-05-25
申请号：US12287560
申请日：2008-10-10
申请人： Lee R. Hinze , G. Venkata Krishnan , Scott E. Wilson
发明人： Lee R. Hinze , G. Venkata Krishnan , Scott E. Wilson
IPC分类号： H05K7/20
CPC分类号： H05K7/20409 , H01L23/367 , H01L23/4006 , H01L2023/4068 , H01L2023/4087 , H01L2924/0002 , H05K7/20445 , H01L2924/00
摘要： An electronic module includes a printed circuit board with a heat producing electrical component assembled in an insulating housing. The component is adjacent a thermally conducting heat sink with a thermally conductive material disposed therebetween. Integral with the heat sink is a thermally conductive runner, partially encased in the housing wall, connecting the heat sink to a thermally conductive port. The port is coupled to a base structure when the housing is attached to the base, forming a heat conduction path from the component to the base. This conductive path may also provide an electrical ground path from the printed circuit board to the base.
摘要翻译：电子模块包括具有组装在绝缘壳体中的发热电气部件的印刷电路板。该部件与导热散热器相邻，导热散热器之间设置有导热材料。与散热器成一体是导热流道，部分地封装在壳体壁中，将散热器连接到导热端口。当壳体附接到基座时，端口连接到基部结构，形成从部件到基部的热传导路径。该导电路径还可以提供从印刷电路板到底座的电接地路径。

9. 发明申请

US20090059541A1 Electronic assembly having housing with embedded conductor connecting electrical component 审中-公开
标题翻译：具有外壳的电子组件，带有连接电气部件的嵌入式导体
公开(公告)号：US20090059541A1
公开(公告)日：2009-03-05
申请号：US11897316
申请日：2007-08-30
申请人： Lee R. Hinze
发明人： Lee R. Hinze
IPC分类号： H05K1/18
CPC分类号： H05K5/064 , H05K1/18 , H05K3/284 , H05K3/308 , H05K5/0247 , H05K2201/09754 , H05K2201/0999 , H05K2201/10015 , H05K2201/10295 , H05K2201/105 , H05K2201/1059 , H05K2201/10962
摘要： An electronic assembly includes a printed circuit board and an electrical component arranged within a housing. The component is mounted in a lower region of the housing, and the printed circuit board is supported over the component. The housing is formed of a electrically insulating material and includes embedded conductors connecting the component to the printed circuit board. Potting material is disposed on the printed circuit board within the housing. A fill hole may be provided in the board over the component to allow the potting material to flow onto the electrical component for mechanical stabilization.
摘要翻译：电子组件包括布置在壳体内的印刷电路板和电气部件。该部件安装在壳体的下部区域中，印刷电路板被支撑在部件上。壳体由电绝缘材料形成，并且包括将部件连接到印刷电路板的嵌入导体。灌封材料设置在外壳内的印刷电路板上。填充孔可以设置在板上的部件上，以允许灌封材料流到电气部件上用于机械稳定。

10. 发明授权

US07048564B1 Sealed electronic module with fastenerless circuit board support post 失效
标题翻译：密封电子模块与无紧固件电路板支撑柱
公开(公告)号：US07048564B1
公开(公告)日：2006-05-23
申请号：US11139796
申请日：2005-05-27
申请人： Lee R. Hinze
发明人： Lee R. Hinze
IPC分类号： H01R13/52
CPC分类号： H05K5/064 , B60R16/0239 , H01R13/5213 , H01R13/6658 , H05K5/006 , H05K7/142
摘要： A sealed electronic module includes a housing having an open end and a circuit board that is both peripherally and centrally supported within the housing, where potting material applied to the exposed face of the circuit board peripherally and centrally affixes the circuit board to the housing and also environmentally seals the module. The central support for the circuit board is provided by a support post that is integral with the housing. A reduced size tip of the support post extends through an opening formed in a central area of the circuit board, and potting material applied to the exposed face of the circuit board for sealing the module also flows into the circuit board opening around the tip of the support post. The cured potting material structurally bonds the periphery of the circuit board to the housing walls and the central area of the circuit board to the housing support post.
摘要翻译：密封电子模块包括具有开口端的外壳和电路板，其外围和中心地支撑在壳体内，其中灌封材料外围地施加到电路板的暴露面并且将电路板中心地固定到壳体，并且还环境密封模块。电路板的中心支撑由与壳体成一体的支撑柱提供。支撑柱的减小的尖端延伸穿过形成在电路板的中心区域中的开口，并且施加到用于密封模块的电路板的暴露面的灌封材料也流入围绕电路板的尖端的电路板开口支持帖子。固化的灌封材料将电路板的周边结构地结合到壳体壁和电路板的中心区域到壳体支撑柱。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式