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    • 1. 发明申请
    • Scaling of functional assignments in packages
    • 软件包功能分配的缩放
    • US20070114644A1
    • 2007-05-24
    • US11283340
    • 2005-11-18
    • Leah MillerJeffrey Hall
    • Leah MillerJeffrey Hall
    • H01L23/02
    • H01L23/49816H01L23/49838H01L2224/16H01L2924/15174H01L2924/15192H01L2924/15311
    • A family of package substrates adapted to receive a family of integrated circuits having different sizes and provide electrical connections between the integrated circuits and a circuit board. Each package substrate in the family includes a package substrate having a die side and a circuit board side. The package substrate has a size that is consistent for all of the package substrates in the family of package substrates. The die side has integrated circuit contacts disposed in a pattern designed to make electrical connections to a given integrated circuit in the family of integrated circuits for which the package substrate is designed, as defined by locations of contacts on the given integrated circuit. The circuit board side has circuit board contacts disposed in a pattern and with functional assignments that are consistent for all of the package substrates in the family of package substrates.
    • 一组封装衬底,适于接收具有不同尺寸的集成电路系列,并提供集成电路和电路板之间的电连接。 家族中的每个封装衬底包括具有管芯侧和电路板侧的封装衬底。 封装衬底的尺寸对于封装衬底系列中的所有封装衬底是一致的。 模具侧具有集成电路触点,其设计成图案,其被设计成与集成电路系列中的给定集成电路进行电连接,集成电路系列由集成电路设计,如由给定集成电路上的触点位置所限定。 电路板侧具有以图案布置的电路板触点,并且具有与封装衬底系列中的所有封装衬底一致的功能分配。