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1. 发明申请

US20050280162A1 THERMAL INTERPOSER FOR THERMAL MANAGEMENT OF SEMICONDUCTOR DEVICES 失效
标题翻译：用于半导体器件热管理的热插拔器
公开(公告)号：US20050280162A1
公开(公告)日：2005-12-22
申请号：US10874297
申请日：2004-06-18
申请人： Lawrence Mok , Evan Colgan , Minhua Lu , Da-Yuan Shih
发明人： Lawrence Mok , Evan Colgan , Minhua Lu , Da-Yuan Shih
IPC分类号： H01L23/427 , H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L24/31 , H01L23/427 , H01L2224/16225 , H01L2224/73253 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/0132 , H01L2924/01322 , H01L2924/09701 , H01L2924/10158 , H01L2924/14 , H01L2924/15311 , H01L2924/01026 , H01L2924/01028
摘要： A thermal interposer is provided for attachment to the back surface of a semiconductor device so as to give a very low thermal resistance. In one preferred embodiment, the thermal interposer has two plates containing wick structures such as grooves. The thermal interposer is integrated with a semiconductor device so as to form a vapor chamber. In particular, the back surface of the semiconductor chip is in direct contact with the interior sealed volume of the vapor chamber, so as to greatly reduce the thermal resistance from the combination of the chip and the vapor chamber. Further, the upper plate is thermally coupled to a heat-sinking fixture such as a heat sink or a cold plate.
摘要翻译：提供了一种用于附接到半导体器件的背表面的热插入件，以便提供非常低的热阻。在一个优选实施例中，热插入件具有两个板，其中包含芯结构例如凹槽。热插入件与半导体器件集成以形成蒸气室。特别地，半导体芯片的背面与蒸发室的内部密封容积直接接触，从而大大降低了芯片与蒸气室的组合的热阻。此外，上板热耦合到诸如散热器或冷板之类的散热固定装置。

2. 发明申请

US20050280128A1 Thermal interposer for thermal management of semiconductor devices 失效
标题翻译：用于半导体器件热管理的热插入器
公开(公告)号：US20050280128A1
公开(公告)日：2005-12-22
申请号：US10872575
申请日：2004-06-18
申请人： Lawrence Mok , Evan Colgan , Minhua Lu , Da-Yuan Shih
发明人： Lawrence Mok , Evan Colgan , Minhua Lu , Da-Yuan Shih
IPC分类号： H01L23/02 , H01L23/427
CPC分类号： H01L23/427 , H01L2224/16 , H01L2224/16225 , H01L2224/73253 , H01L2924/01019 , H01L2924/01078 , H01L2924/01322 , H01L2924/09701 , H01L2924/10158 , H01L2924/15311
摘要： A thermal interposer is provided for attachment to a surface of a semiconductor device. In one embodiment, the thermal interposer includes an upper plate having a bottom surface with a plurality of grooves and made of a material having high thermal conductivity, and a lower plate having a top surface with a plurality of grooves and made of a material having a coefficient of thermal expansion that is substantially the same as the coefficient of thermal expansion of the material of a semiconductor device that is bonded to the bottom surface of the lower plate. The bottom surface of the upper plate is hermetically bonded to the top surface of the lower plate so that a vapor chamber is formed by the upper and lower plates, and walls of the grooves on the top surface of the lower plate extend to within less than 250 microns from walls of the grooves on the bottom surface of the upper plate comprise a plurality of second walls the first walls.
摘要翻译：提供了用于附接到半导体器件的表面的热插入件。在一个实施例中，热插入件包括具有多个凹槽并由具有高导热性的材料制成的底表面的上板，以及具有多个凹槽的顶表面的下板，并由具有热膨胀系数与结合到下板的底面的半导体器件的材料的热膨胀系数基本相同。上板的底面与下板的顶面密封，从而通过上板和下板形成蒸气室，下板顶表面上的槽的壁延伸到小于在上板的底表面上的槽的壁250微米包括多个第二壁和第一壁。

3. 发明申请

US20070210446A1 Apparatus and Methods For Cooling Semiconductor Integrated Circuit Chip Packages 有权
标题翻译：用于冷却半导体集成电路芯片封装的装置和方法
公开(公告)号：US20070210446A1
公开(公告)日：2007-09-13
申请号：US11735155
申请日：2007-04-13
申请人： Paul Andry , Evan Colgan , Lawrence Mok , Chirag Patel , David Seeger
发明人： Paul Andry , Evan Colgan , Lawrence Mok , Chirag Patel , David Seeger
IPC分类号： H01L23/34
CPC分类号： H01L23/473 , H01L25/0657 , H01L2224/16225 , H01L2224/32245 , H01L2224/73253 , H01L2225/06517 , H01L2225/06589 , H01L2924/00011 , H01L2924/00014 , H01L2924/01019 , H01L2924/15311 , H01L2224/0401
摘要： Apparatus and methods are provided for integrating microchannel cooling modules within high-density electronic modules (e.g., chip packages, system-on-a-package modules, etc.,) comprising multiple high-performance IC chips. Electronic modules are designed such that high-performance (high power) IC chips are disposed in close proximity to the integrated cooling module (or cooling plate) for effective heat extraction. Moreover, electronic modules which comprise large surface area silicon carriers with multiple chips face mounted thereon are designed such that integrated silicon cooling modules are rigidly bonded to the back surfaces of such chips to increase the structural integrity of the silicon carriers.
摘要翻译：提供了用于将微通道冷却模块集成在包括多个高性能IC芯片的高密度电子模块（例如，芯片封装，系统级封装模块等）中的装置和方法。电子模块被设计成使得高性能（大功率）IC芯片被布置成靠近集成冷却模块（或冷却板）以有效地提取热量。此外，包括具有多个芯片面的大表面积硅载体的电子模块被设计成使得集成硅冷却模块刚性地结合到这种芯片的背面以增加硅载体的结构完整性。

4. 发明申请

US20060103011A1 Apparatus and methods for cooling semiconductor integrated circuit chip packages 有权
公开(公告)号：US20060103011A1
公开(公告)日：2006-05-18
申请号：US10987985
申请日：2004-11-12
申请人： Paul Andry , Evan Colgan , Lawrence Mok , Chirag Patel , David Seeger
发明人： Paul Andry , Evan Colgan , Lawrence Mok , Chirag Patel , David Seeger
IPC分类号： H01L23/34
CPC分类号： H01L23/473 , H01L25/0657 , H01L2224/16225 , H01L2224/32245 , H01L2224/73253 , H01L2225/06517 , H01L2225/06589 , H01L2924/00011 , H01L2924/00014 , H01L2924/01019 , H01L2924/15311 , H01L2224/0401
摘要： Apparatus and methods are provided for integrating microchannel cooling modules within high-density electronic modules (e.g., chip packages, system-on-a-package modules, etc.,) comprising multiple high-performance IC chips. Electronic modules are designed such that high-performance (high power) IC chips are disposed in close proximity to the integrated cooling module (or cooling plate) for effective heat extraction. Moreover, electronic modules which comprise large surface area silicon carriers with multiple chips face mounted thereon are designed such that integrated silicon cooling modules are rigidly bonded to the back surfaces of such chips to increase the structural integrity of the silicon carriers.

5. 发明申请

US20060042825A1 Cooling of substrate using interposer channels 有权
标题翻译：使用插入器通道冷却衬底
公开(公告)号：US20060042825A1
公开(公告)日：2006-03-02
申请号：US10933051
申请日：2004-09-02
申请人： Minhua Lu , Lawrence Mok
发明人： Minhua Lu , Lawrence Mok
IPC分类号： H05K1/00
CPC分类号： H01L23/427 , F28D15/0266 , H01L23/433 , H01L2224/16 , H01L2924/00011 , H01L2924/00014 , H01L2924/01019 , H01L2924/10253 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49165 , Y10T29/49204 , H01L2924/00 , H01L2224/0401
摘要： A structure, and method of forming and cooling the structure. The structure may include a substrate (e.g., a semiconductor chip) having N continuous substrate channels and an interposer having N continuous interposer channels (N≧2). The N interposer channels are coupled to the N substrate channels to form M continuous loops (1≦M≦N). The M loops may transfer heat from a heat source within the substrate to the interposer and then to a heat sink thermally coupled to the interposer. The structure may include an interposer having a thermally conductive enclosure surrounding a cavity. The cavity contains a thermally conductive foam material (e.g., graphite foam). The foam material contains a serpentine channel having contiguously connected channel segments. The serpentine channel may transfer heat from a heat source within a substrate (e.g., a semiconductor chip) to the interposer and then to a heat sink thermally coupled to the interposer.
摘要翻译：一种结构，以及形成和冷却结构的方法。该结构可以包括具有N个连续衬底通道的衬底（例如，半导体芯片）和具有N个连续插入器通道（N> = 2）的插入器。 N个插入器通道耦合到N个衬底沟道以形成M个连续环（1≤M≤N）。 M环可将热量从衬底内的热源传递到插入器，然后传递到热耦合到插入器的散热器。该结构可以包括具有围绕空腔的导热外壳的插入器。空腔包含导热泡沫材料（例如石墨泡沫）。泡沫材料包含具有连续连接的通道段的蛇形通道。蛇形通道可以将热量从衬底（例如，半导体芯片）内的热源传递到插入器，然后传递到热耦合到插入器的散热器。

6. 发明申请

US20050050366A1 Personal website for electronic commerce on a smart Java card with multiple security check points 有权
标题翻译：智能Java卡上的电子商务个人网站，具有多个安全检查点
公开(公告)号：US20050050366A1
公开(公告)日：2005-03-03
申请号：US10953711
申请日：2004-09-29
申请人： Thomas Kwok , Lawrence Mok
发明人： Thomas Kwok , Lawrence Mok
IPC分类号： G09C1/00 , G06F1/00 , G06F17/00 , G06F21/00 , G06F21/20 , G06Q20/34 , G06Q20/36 , G06Q20/40 , G06T7/00 , G07F7/08 , G07F7/10 , H04L9/32
CPC分类号： G07F7/1008 , G06F21/32 , G06F21/33 , G06F21/34 , G06F21/445 , G06Q20/341 , G06Q20/363 , G06Q20/40145 , G07F7/0866
摘要： A Method and system are disclosed for accessing personal Web site or executing electronic commerce with security in a smart Java card. A personal Web site which includes personal or private information is stored in a personal smart Java card. Before a user can access the Web site stored in the smart Java card, the user is validated by any one of or in combination of PIN, facial images, hand images, eye image, voice characteristics, and finger prints. In addition, an encryption engine embedded in the smart Java card decodes and compares the entered PIN combined with a secure key or security certificate to verify the identity of the user. Before the bank account can be accessed freely by the user, the bank's computer system checks the combined secure data to ensure the authenticity of the card and the user's identity with multiple check points using Internet security protocols via Web browsers.
摘要翻译：公开了一种用于访问个人网站或在智能Java卡中执行具有安全性的电子商务的方法和系统。包含个人或私人信息的个人网站存储在个人智能Java卡中。在用户可以访问存储在智能Java卡中的网站之前，用户通过PIN，面部图像，手图像，眼睛图像，语音特征和指纹中的任何一个或其组合来验证用户。此外，嵌入在智能Java卡中的加密引擎解码并比较输入的PIN与安全密钥或安全证书的组合，以验证用户的身份。银行帐户可以由用户自由访问之前，银行的计算机系统将通过Web浏览器使用Internet安全协议检查组合的安全数据，以确保卡的真实性和多个检查点的用户身份。

7. 发明申请

US20050168947A1 Chip packaging module with active cooling mechanisms 审中-公开
标题翻译：具有主动冷却机构的芯片封装模块
公开(公告)号：US20050168947A1
公开(公告)日：2005-08-04
申请号：US10733672
申请日：2003-12-11
申请人： Lawrence Mok , Leena Buchwalter , Stephen Buchwalter
发明人： Lawrence Mok , Leena Buchwalter , Stephen Buchwalter
IPC分类号： H01L23/427 , H01L23/473 , H02B1/00 , H05K7/20
CPC分类号： H01L23/427 , H01L23/473 , H01L2224/16225 , H01L2224/48091 , H01L2924/10158 , H01L2924/00014
摘要： The invention is directed to structure and methods of improving the cooling capacity of chip packaging modules. The chip packaging module has a substrate with thin-film wiring on one side and grooves or channels etched on one or both sides where coolant pumps are embedded. The coolant pumps are used to enhance the liquid flowing inside the module. The coolant flows through the chips within the vias in the chips or around the chips when the chips do not have vias. Both cooling modes, single or two-phase modes can be adopted in the module.
摘要翻译：本发明涉及提高芯片封装模块的冷却能力的结构和方法。芯片封装模块具有在一侧具有薄膜布线的基板，在嵌入有冷却剂泵的一侧或两侧蚀刻的凹槽或通道。冷却液泵用于增强模块内流动的液体。当芯片没有通孔时，冷却剂流过芯片内或芯片周围的通孔内的芯片。模块中可以采用两种冷却模式，单相或双相模式。

8. 发明申请

US20060102318A1 Semiconductor chip heat transfer device 有权
标题翻译：半导体芯片传热装置
公开(公告)号：US20060102318A1
公开(公告)日：2006-05-18
申请号：US10988219
申请日：2004-11-12
申请人： Lawrence Mok
发明人： Lawrence Mok
IPC分类号： H05K7/20
CPC分类号： H01L23/473 , F28D15/00 , F28D15/02 , F28D2015/0291 , F28F2013/006 , F28F2250/08 , F28F2265/12 , F28F2265/26 , H01L23/34 , H01L23/427 , H01L2224/16225 , H01L2224/73253 , H01L2924/00011 , H01L2924/00014 , H01L2924/3011 , H01L2224/0401
摘要： The present invention is directed to a method of improving the heat transfer from a semiconductor chip to its heat sinking device. The heat transfer device consists of a liquid chamber in which liquid is circulated within the chamber to spread the heat from one location of the chamber to the heat pipes partially mounted in the chamber. The heat is then carried away by the heat pipes to a remote heat sinking device. The chamber has built-in mechanism to allow the liquid to expand during normal operation and its expansion status to be monitored.
摘要翻译：本发明涉及一种改善从半导体芯片到其散热装置的传热的方法。传热装置包括液体室，液体在室内循环，以将热量从室的一个位置传播到部分安装在室中的热管。然后，热量被热管带走到远程散热装置。该腔室具有内置机构，允许液体在正常操作期间膨胀，并且其膨胀状态将被监控。

9. 发明申请

US20050183846A1 Heat dissipation interface for semiconductor chip structures 有权
标题翻译：半导体芯片结构散热界面
公开(公告)号：US20050183846A1
公开(公告)日：2005-08-25
申请号：US10784624
申请日：2004-02-23
申请人： Lawrence Mok
发明人： Lawrence Mok
IPC分类号： F28D15/00 , F28F3/02 , H01L23/367 , H01L23/427
CPC分类号： H01L23/3672 , F28F3/02 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： The present invention is directed to a modular heat dissipating device that consists of a plurality of sheet and beam members which are connected together by heat pipes. The sheet or support fin member is constructed by folding a piece of heat conducting material which is then mounted on a beam member. There are individual compliant interfaces built into the fin members such that a good thermal contact can be ensured with the heat generating semiconductor devices. The modular heat dissipating devices can be stacked up to gain higher cooling capacity or spread around to cover multiple chips on a printed-wiring board.
摘要翻译：本发明涉及一种由多个通过热管连接在一起的片材和梁构件组成的模块化散热装置。片材或支撑翅片构件通过折叠一块导热材料构成，然后将导热材料安装在梁构件上。在翅片构件中内置有单独的兼容接口，从而可以利用发热半导体器件确保良好的热接触。模块化散热装置可以堆叠起来以获得更高的冷却能力或扩展到覆盖印刷电路板上的多个芯片。

10. 发明授权

US07820488B2 Microelectronic devices and methods 有权
标题翻译：微电子器件及方法
公开(公告)号：US07820488B2
公开(公告)日：2010-10-26
申请号：US11932793
申请日：2007-10-31
申请人： Sri M. Sri-Jayantha , Gareth Hougham , Sung Kang , Lawrence Mok , Hien Dang , Arun Sharma
发明人： Sri M. Sri-Jayantha , Gareth Hougham , Sung Kang , Lawrence Mok , Hien Dang , Arun Sharma
IPC分类号： H01L21/00
CPC分类号： H01L23/552 , H01L23/3677 , H01L2924/0002 , H01L2924/00
摘要： A microelectronic device is made of a semiconductor substrate, a heat generating component in a layer thereof, and a body within the remaining semiconductor substrate. The body is made of materials which have a high thermal inertia and/or thermal conductivity. When high thermal conductivity materials are used, the body acts to transfer the heat away from the substrate to a heat sink.
摘要翻译：微电子器件由半导体衬底，其一层中的发热元件和剩余半导体衬底内的主体构成。主体由具有高热惯性和/或导热性的材料制成。当使用高导热性材料时，主体用于将热量从基板转移到散热器。

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