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    • 5. 发明申请
    • Cooling of substrate using interposer channels
    • 使用插入器通道冷却衬底
    • US20060042825A1
    • 2006-03-02
    • US10933051
    • 2004-09-02
    • Minhua LuLawrence Mok
    • Minhua LuLawrence Mok
    • H05K1/00
    • H01L23/427F28D15/0266H01L23/433H01L2224/16H01L2924/00011H01L2924/00014H01L2924/01019H01L2924/10253Y10T29/49126Y10T29/49128Y10T29/4913Y10T29/49165Y10T29/49204H01L2924/00H01L2224/0401
    • A structure, and method of forming and cooling the structure. The structure may include a substrate (e.g., a semiconductor chip) having N continuous substrate channels and an interposer having N continuous interposer channels (N≧2). The N interposer channels are coupled to the N substrate channels to form M continuous loops (1≦M≦N). The M loops may transfer heat from a heat source within the substrate to the interposer and then to a heat sink thermally coupled to the interposer. The structure may include an interposer having a thermally conductive enclosure surrounding a cavity. The cavity contains a thermally conductive foam material (e.g., graphite foam). The foam material contains a serpentine channel having contiguously connected channel segments. The serpentine channel may transfer heat from a heat source within a substrate (e.g., a semiconductor chip) to the interposer and then to a heat sink thermally coupled to the interposer.
    • 一种结构,以及形成和冷却结构的方法。 该结构可以包括具有N个连续衬底通道的衬底(例如,半导体芯片)和具有N个连续插入器通道(N> = 2)的插入器。 N个插入器通道耦合到N个衬底沟道以形成M个连续环(1≤M≤N)。 M环可将热量从衬底内的热源传递到插入器,然后传递到热耦合到插入器的散热器。 该结构可以包括具有围绕空腔的导热外壳的插入器。 空腔包含导热泡沫材料(例如石墨泡沫)。 泡沫材料包含具有连续连接的通道段的蛇形通道。 蛇形通道可以将热量从衬底(例如,半导体芯片)内的热源传递到插入器,然后传递到热耦合到插入器的散热器。