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1. 发明授权

US09425501B2 Composite thermoformed assembly 有权
标题翻译：复合热成型组件
公开(公告)号：US09425501B2
公开(公告)日：2016-08-23
申请号：US13449283
申请日：2012-04-17
申请人： Laurent Desclos , Jeffrey Shambiin
发明人： Laurent Desclos , Jeffrey Shambiin
IPC分类号： H01Q1/40 , H01Q1/38 , H01P11/00 , H01Q5/378
CPC分类号： H01Q1/38 , H01P11/003 , H01Q1/40 , H01Q5/378 , Y10T156/1044
摘要： Methods for producing cost effective and reliable antennas and circuits for wireless devices are disclosed. The antennas and circuits are formed by applying a conductive layer to one side of a carrier sheet and attaching a second carrier sheet to encapsulate and protect the conductive layer. The combination of the two carrier sheets and the conductive layer are then formed into one or more three-dimensional antenna structures or circuits in a thermoforming process. This technique enables high volume production of antennas and RF circuits in a fast, reliable, and cost-efficient manner that provides for encapsulation of the conductive layer. The plurality of antennas and circuits formed in this fashion may then be separated by a cutting apparatus to obtain individual devices that are ready for integration into myriad communication devices.
摘要翻译：公开了用于生产无线设备的成本有效和可靠的天线和电路的方法。天线和电路通过将导电层施加到载体片的一侧并附接第二载体片以封装并保护导电层而形成。然后，两个载体片和导电层的组合在热成型工艺中形成一个或多个三维天线结构或电路。该技术可以快速，可靠和成本有效的方式大量生产天线和RF电路，从而提供导电层的封装。以这种形式形成的多个天线和电路然后可以由切割装置分离，以获得准备用于集成到无数通信装置中的各种装置。

2. 发明申请

US20120285611A1 COMPOSITE THERMOFORMED ASSEMBLY 有权
标题翻译：复合热成型装置
公开(公告)号：US20120285611A1
公开(公告)日：2012-11-15
申请号：US13449283
申请日：2012-04-17
申请人： Laurent Desclos , Jeffrey Shambiin
发明人： Laurent Desclos , Jeffrey Shambiin
IPC分类号： B32B37/02 , B32B38/10
CPC分类号： H01Q1/38 , H01P11/003 , H01Q1/40 , H01Q5/378 , Y10T156/1044
摘要： Methods for producing cost effective and reliable antennas and circuits for wireless devices are disclosed. The antennas and circuits are formed by applying a conductive layer to one side of a carrier sheet and attaching a second carrier sheet to encapsulate and protect the conductive layer. The combination of the two carrier sheets and the conductive layer are then formed into one or more three-dimensional antenna structures or circuits in a thermoforming process. This technique enables high volume production of antennas and RF circuits in a fast, reliable, and cost-efficient manner that provides for encapsulation of the conductive layer. The plurality of antennas and circuits formed in this fashion may then be separated by a cutting apparatus to obtain individual devices that are ready for integration into myriad communication devices.
摘要翻译：公开了用于生产无线设备的成本有效和可靠的天线和电路的方法。天线和电路通过将导电层施加到载体片的一侧并附接第二载体片以封装并保护导电层而形成。然后，两个载体片和导电层的组合在热成型工艺中形成一个或多个三维天线结构或电路。该技术可以快速，可靠和成本有效的方式大量生产天线和RF电路，从而提供导电层的封装。以这种形式形成的多个天线和电路然后可以由切割装置分离，以获得准备用于集成到无数通信装置中的各种装置。

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