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1. 发明申请

US20160365339A1 OPTICAL MODULE INTEGRATED PACKAGE 审中-公开
公开(公告)号：US20160365339A1
公开(公告)日：2016-12-15
申请号：US15247300
申请日：2016-08-25
申请人： LINGSEN PRECISION INDUSTRIES, LTD.
发明人： Ming-Te TU , Yao-Ting YEH , Yu-Chen LIN
IPC分类号： H01L25/16 , H01L31/173 , H01L31/0232
CPC分类号： H01L25/167 , H01L24/73 , H01L31/0203 , H01L31/0232 , H01L31/02325 , H01L31/167 , H01L31/173 , H01L2224/32225 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/73265 , H01L2924/1433 , Y02P40/57 , H01L2924/00012
摘要： A an optical module integrated package includes a substrate, a light-receiving chip mounted in a light-receiving region of the substrate, an electronic component mounted in the substrate, a cover mounted on the substrate and having a light-receiving chip disposed above the light-receiving hole, and a lens fixedly mounted in the light-receiving hole of the cover. Thus, the optical module integrated package not only have the chip and the electronic component integrated therein to reduce the packaging cost and to improve the yield but also provide a light filtering, focusing or diffusing effect to enhance optical recognition accuracy.

2. 发明申请

US20150028360A1 PACKAGE STRUCTURE OF OPTICAL MODULE 有权
标题翻译：光模块的包装结构
公开(公告)号：US20150028360A1
公开(公告)日：2015-01-29
申请号：US14073567
申请日：2013-11-06
申请人： LINGSEN PRECISION INDUSTRIES, LTD.
发明人： Ming-Te TU , Yao-Ting YEH
IPC分类号： H01L31/16 , H01L31/18
CPC分类号： H01L25/167 , H01L25/165 , H01L31/16 , H01L31/167 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2924/1815 , H01L2924/00
摘要： A package structure of an optical module includes: a substrate defined with a light-emitting region and a light-admitting region; a light-emitting chip disposed at the light-emitting region of the substrate; a light-admitting chip disposed at the light-admitting region of the substrate; two encapsulants for enclosing the light-emitting chip and the light-admitting chip, respectively; and a shielding layer formed on the substrate and the encapsulants and having a light-emitting hole and a light-admitting hole, wherein the light-emitting hole and the light-admitting hole are positioned above the light-emitting chip and the light-admitting chip, respectively. Accordingly, the optical module package structure simplifies a packaging process and cuts manufacturing costs.
摘要翻译：光学模块的封装结构包括：由发光区域和光入区限定的衬底; 设置在所述基板的发光区域的发光芯片; 设置在所述基板的所述光入射区域的光入射芯片; 分别封装发光芯片和光导芯片的两个密封剂; 以及形成在所述基板和所述密封剂上并具有发光孔和导光孔的屏蔽层，其中所述发光孔和所述导光孔位于所述发光芯片的上方，并且所述光入射芯片。因此，光学模块封装结构简化了封装过程并降低了制造成本。

3. 发明申请

US20180063646A1 MEMS MICROPHONE PACKAGE 审中-公开
公开(公告)号：US20180063646A1
公开(公告)日：2018-03-01
申请号：US15335742
申请日：2016-10-27
申请人： LINGSEN PRECISION INDUSTRIES, LTD.
发明人： Hsien-Ken LIAO , Ming-Te TU , Jyong-Yue TIAN , Yao-Ting YEH
IPC分类号： H04R19/04 , B81B7/00 , H04R1/04
CPC分类号： H04R19/04 , B81B7/007 , B81B2201/0257 , B81B2207/012 , H04R1/04 , H04R2201/003
摘要： A MEMS microphone package includes a substrate including a base layer, a sound hole cut through opposing top and bottom surfaces of the base layer, a conduction part arranged on the base layer and a notch located on the top surface of the base layer, a sidewall connected with one end thereof to the top surface of the base layer and having a conducting line electrically connected to the conduction part, a cover plate connected to an opposite end of the sidewall and having a solder pad and a third contact disposed in conduction with the solder pad and electrically connected to the conducting line, a processor chip mounted in the notch and electrically connected to the conduction part, and an acoustic wave sensor mounted on the base layer to face toward the sound hole and electrically connected to the processor chip.

4. 发明申请

US20180063614A1 MICROPHONE PACKAGE STRUCTURE 有权
公开(公告)号：US20180063614A1
公开(公告)日：2018-03-01
申请号：US15334633
申请日：2016-10-26
申请人： LINGSEN PRECISION INDUSTRIES, LTD.
发明人： Yao-Ting YEH , Ming-Te TU
IPC分类号： H04R1/04 , H04R19/04
CPC分类号： H04R1/04 , H04R1/083 , H04R19/04 , H04R2201/029
摘要： A microphone package structure includes a substrate, sound wave transducer, processing chip, lid, sound aperture, at least one first solder pad and at least one second solder pad. The substrate has a top side, a bottom side and two opposing lateral sides. The top and bottom sides each connect the lateral sides. The sound wave transducer and processing chip are disposed on the top side. The lid covers the substrate to form a chamber for containing the sound wave transducer and the processing chip electrically connected to the substrate and sound wave transducer. The sound aperture is disposed at the substrate or lid. The at least one first solder pad is disposed on the bottom side and in electrical conduction with the processing chip. The at least one second solder pad is disposed on one of the lateral sides and in electrical conduction with the processing chip.

5. 发明申请

US20150187963A1 MICRO OPTICAL PACKAGE STRUCTURE WITH FILTRATION LAYER AND METHOD FOR MAKING THE SAME 有权
标题翻译：具有滤光层的微光学包装结构及其制造方法
公开(公告)号：US20150187963A1
公开(公告)日：2015-07-02
申请号：US14171328
申请日：2014-02-03
申请人： LINGSEN PRECISION INDUSTRIES, LTD.
发明人： Ming-Te TU , Yao-Ting YEH
IPC分类号： H01L31/0203 , H01L31/18 , H01L31/173
CPC分类号： H01L31/0203 , H01L31/16 , H01L31/173 , H01L31/18 , H01L2224/48091 , H01L2224/48227 , H01L2924/181 , Y02P70/521 , H01L2924/00012 , H01L2924/00014
摘要： A micro optical package structure with filtration layers includes a substrate having a light-emitting area and a light-receiving area, a light-emitting chip being deposited in a light-emitting area, a light-receiving chip being deposited in a light-receiving area, two packaging resin bodies for enclosing the light-emitting chip and the light-receiving chip, respectively, and being separately deposited in the light-emitting area and the light-receiving area, respectively, and the filtration layers formed on the packaging resin bodies surface for filtering out lights of different wavelengths. The micro optical package structure needs neither barrier nor protective cover between or outside the packaging resin bodies, so can be microminiaturized. The micro optical package structure can filter out visible lights of specific wavelengths without using any additional filters.
摘要翻译：具有过滤层的微型光学封装结构包括具有发光区域和受光区域的基板，在发光区域中沉积的发光芯片，在受光区域中沉积的光接收芯片分别包围发光芯片和受光芯片的两个包装树脂体，分别沉积在发光区域和光接收区域中，以及形成在包装树脂上的过滤层身体表面用于过滤不同波长的光。微型光学封装结构在包装树脂体之间或之外既不需要屏障也不需要保护层，因此可以微型化。微型光学封装结构可以滤除特定波长的可见光，而无需使用任何额外的滤光片。

6. 发明申请

US20150028357A1 PACKAGE STRUCTURE OF AN OPTICAL MODULE 审中-公开
标题翻译：光学模块的包装结构
公开(公告)号：US20150028357A1
公开(公告)日：2015-01-29
申请号：US14072154
申请日：2013-11-05
申请人： Lingsen Precision Industries, Ltd
发明人： Ming-Te TU , Yao-Ting YEH
IPC分类号： H01L25/16 , H01L25/00
CPC分类号： H01L25/167 , H01L24/73 , H01L33/54 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/181 , H01L2924/1815 , H01L2924/00012
摘要： This invention relates to a package structure of an optical module. A light emitting and light receiving chips are disposed on a light emitting and light receiving region of the substrate, respectively. Two encapsulating gels cover the light emitting chip and the light receiving chip, respectively, and form a first and a second hemispherical lens portions on the light emitting chip and the light receiving chip, respectively. A cover is affixed on the substrate and each of the encapsulating gels and has a light emitting hole and a light receiving hole, wherein the first and the second lens portions are accommodated, respectively. An engaging means is formed on an adjacent surface between each encapsulating gels and the cover in a horizontal direction. Thereby, the package structure of the optical module of the present invention increases the connection region between each encapsulating gels and the cover to enhance the engagement.
摘要翻译：本发明涉及光模块的封装结构。发光和光接收芯片分别设置在基板的发光和光接收区域上。两个封装胶分别覆盖发光芯片和光接收芯片，并分别在发光芯片和光接收芯片上形成第一和第二半球透镜部分。盖子固定在基板和每个封装凝胶上并具有发光孔和光接收孔，其中分别容纳第一透镜部分和第二透镜部分。在每个封装凝胶和盖之间的相邻表面上沿水平方向形成接合装置。因此，本发明的光模块的封装结构增加了每个封装凝胶和盖之间的连接区域，以增强接合。

7. 发明申请

US20180063645A1 MEMS MICROPHONE PACKAGE 审中-公开
公开(公告)号：US20180063645A1
公开(公告)日：2018-03-01
申请号：US15334773
申请日：2016-10-26
申请人： LINGSEN PRECISION INDUSTRIES, LTD.
发明人： Yao-Ting YEH , Hsien-Ken LIAO , Jyong-Yue TIAN , Ming-Te TU
IPC分类号： H04R19/04 , B81B7/00 , H04R19/00
CPC分类号： H04R19/04 , B81B7/007 , B81B2201/0257 , B81B2207/012 , B81B2207/095 , B81C1/0023 , H04R17/02 , H04R19/005 , H04R31/006 , H04R2201/003 , H04R2410/03
摘要： A MEMS microphone package includes a substrate including a base layer, a sound hole cut through the base layer, a conduction part arranged on the base layer, a sidewall connected with one end thereof to the top surface of the base layer and having a conducting line electrically connected to the conduction part, a cover plate connected to an opposite end of the sidewall and having a solder pad and a third contact disposed in conduction with the solder pad and electrically connected to the conducting line, an acoustic wave sensor mounted on the top surface of the base layer to face toward the sound hole, a processor chip mounted on the top surface of the base layer and electrically connected to the acoustic wave sensor and the conduction part, and one or multiple electronic components electrically bonded to the cover plate.

8. 发明申请

US20180063615A1 MEMS MICROPHONE PACKAGE 审中-公开
公开(公告)号：US20180063615A1
公开(公告)日：2018-03-01
申请号：US15334655
申请日：2016-10-26
申请人： LINGSEN PRECISION INDUSTRIES, LTD.
发明人： Hsien-Ken LIAO , Ming-Te TU , Jyong-Yue TIAN , Yao-Ting YEH
IPC分类号： H04R1/04 , H04R19/00 , H04R19/04
CPC分类号： H04R1/04 , H04R19/005 , H04R19/04 , H04R31/006 , H04R2201/003
摘要： A MEMS microphone package includes a substrate including a sound hole, a first conduction part and a second conduction part, a sidewall connected with one end thereof to the substrate and having a conducting line electrically connected to the second conduction part, a cover plate connected to an opposite end of the sidewall and defining a chamber therein and having a solder pad and a fifth contact in conduction with the solder pad and electrically connected to the conducting line, a processor chip mounted on the substrate inside the chamber and electrically connected to the first conduction part and the second conduction part, and a acoustic wave sensor mounted on the substrate inside the chamber to face toward the sound hole and electrically connected to the first conduction part using flip-chip technology.

9. 发明申请

US20150279827A1 OPTICAL MODULE INTEGRATED PACKAGE 有权
标题翻译：光模块集成包
公开(公告)号：US20150279827A1
公开(公告)日：2015-10-01
申请号：US14337721
申请日：2014-07-22
申请人： Lingsen Precision Industries, Ltd.
发明人： Ming-Te TU , Yao-Ting YEH , Yu-Chen LIN
IPC分类号： H01L25/16 , H01L31/0203 , C03B19/02 , B29C45/14 , B29D11/00 , H01L31/173 , H01L31/0232
CPC分类号： H01L25/167 , H01L24/73 , H01L31/0203 , H01L31/0232 , H01L31/02325 , H01L31/167 , H01L31/173 , H01L2224/32225 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/73265 , H01L2924/1433 , Y02P40/57 , H01L2924/00012
摘要： A an optical module integrated package includes a substrate, a light-receiving chip mounted in a light-receiving region of the substrate, an electronic component mounted in the substrate, a cover mounted on the substrate and having a light-receiving chip disposed above the light-receiving hole, and a lens fixedly mounted in the light-receiving hole of the cover. Thus, the optical module integrated package not only have the chip and the electronic component integrated therein to reduce the packaging cost and to improve the yield but also provide a light filtering, focusing or diffusing effect to enhance optical recognition accuracy.
摘要翻译：一种光学模块集成封装，包括基板，安装在基板的光接收区域中的光接收芯片，安装在基板中的电子部件，安装在基板上的盖，并且具有设置在基板上的光接收芯片光接收孔和固定地安装在盖的光接收孔中的透镜。因此，光学模块集成封装不仅将芯片和电子部件集成在其中以降低封装成本并提高产量，而且还提供滤光，聚焦或扩散效果以增强光学识别精度。

10. 发明申请

US20150028378A1 PACKAGE STRUCTURE OF OPTICAL MODULE 有权
标题翻译：光模块的包装结构
公开(公告)号：US20150028378A1
公开(公告)日：2015-01-29
申请号：US14072320
申请日：2013-11-05
申请人： Lingsen Precision Industries, Ltd.
发明人： Ming-Te TU , Yao-Ting YEH
IPC分类号： H01L33/48 , H01L33/52 , H01L33/00
CPC分类号： H01L33/48 , H01L25/167 , H01L33/58 , H01L2224/48091 , H01L2224/73265 , H01L2924/0002 , H01L2924/00014 , H01L2924/00
摘要： A package structure of an optical module includes: a substrate having a frame defined with a light-emitting region and a light-admitting region; a light-emitting chip disposed at the light-emitting region of the substrate; a light-admitting chip disposed at the light-admitting region of the substrate; two encapsulants formed in the frame and enclosing the light-emitting chip and the light-admitting chip, respectively; and a shielding layer formed on the frame and the encapsulants and having a light-emitting hole and a light-admitting hole, wherein the light-emitting hole and the light-admitting hole are positioned above the light-emitting chip and the light-admitting chip, respectively. The optical module package structure uses an opaque glue to reduce costs and total thickness of the package structure.
摘要翻译：光学模块的封装结构包括：具有限定有发光区域和光入射区域的框架的基板; 设置在所述基板的发光区域的发光芯片; 设置在所述基板的所述光入射区域的光入射芯片; 两个密封剂形成在框架中，分别包围发光芯片和光导芯片; 以及屏蔽层，其形成在所述框架和所述密封剂上，并且具有发光孔和导光孔，其中所述发光孔和所述光入孔位于所述发光芯片的上方，并且所述光入射芯片。光学模块封装结构使用不透明胶来降低封装结构的成本和总厚度。

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