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    • 3. 发明授权
    • Solar cell and method for manufacturing the same
    • 太阳能电池及其制造方法
    • US09029188B2
    • 2015-05-12
    • US14286806
    • 2014-05-23
    • LG Electronics Inc.
    • Jungmin HaJunyong AhnJinho Kim
    • H01L31/18H01L31/0224H01L31/0216H01L31/0352H01L31/068
    • H01L31/186H01L31/02168H01L31/022425H01L31/03529H01L31/068H01L31/18H01L31/1864Y02E10/52Y02E10/547
    • A method for manufacturing a solar cell is discussed. The method may include injecting first impurity ions at a first surface of a substrate by using a first ion implantation method to form a first impurity region, the substrate having a first conductivity type and the first impurity ions having a second conductivity type, and the first impurity region having the second conductivity type; heating the substrate with the first impurity region to activate the first impurity region to form an emitter region from the first impurity region; etching the emitter region from a surface of the emitter region to a predetermined depth to form an emitter part from the emitter region; and forming a first electrode on the emitter part to connect to the emitter part and a second electrode on a second surface of the substrate to connect to the second surface of the substrate.
    • 讨论了太阳能电池的制造方法。 所述方法可以包括通过使用第一离子注入方法在衬底的第一表面处注入第一杂质离子以形成第一杂质区,所述衬底具有第一导电类型,并且所述第一杂质离子具有第二导电类型,并且所述第一杂质离子 具有第二导电类型的杂质区; 用所述第一杂质区域加热所述衬底以激活所述第一杂质区域以从所述第一杂质区域形成发射极区域; 将发射极区域从发射极区域的表面蚀刻到预定深度以从发射极区域形成发射极部分; 以及在所述发射极部分上形成第一电极以连接到所述发射极部分,以及在所述基板的第二表面上连接到所述基板的第二表面的第二电极。
    • 8. 发明授权
    • Solar cell
    • US11056598B2
    • 2021-07-06
    • US16388491
    • 2019-04-18
    • LG ELECTRONICS INC.
    • Jungmin HaYoungho ChoeChangseo Park
    • H01L31/0224H01L31/0216H01L31/068H01L31/0236
    • A bifacial solar cell includes a substrate formed of a silicon wafer having an n-type conductivity; an emitter region positioned on a front surface of the substrate and having a p-type conductivity; a front negative fixed charge layer on the emitter region, and a front positive fixed charge layer on the front negative fixed charge; a plurality of first front electrodes extending in a first direction and connected to the emitter region through the front negative fixed charge layer and the front positive fixed charge layer; a plurality of second front electrodes extending in a second direction crossing the first direction and electrically and physically connected to the plurality of first front electrodes; a back aluminum oxide layer and a back silicon nitride layer on a back surface of the substrate; a plurality of back surface field regions extending in the first direction and locally positioned on the back surface of the substrate; a plurality of first back electrodes extending in the first direction and directly positioned on the plurality of back surface field regions through the back aluminum oxide layer and the back silicon nitride layer; and a plurality of second back electrodes extending in the second direction and electrically and physically connected to the plurality of first back electrodes, wherein the front negative fixed charge layer and the back aluminum oxide layer have the same thickness.