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    • 4. 发明授权
    • Method and apparatus for modeling capacitance in an integrated circuit
    • 用于对集成电路中的电容进行建模的方法和装置
    • US5761080A
    • 1998-06-02
    • US561647
    • 1995-11-22
    • William F. DeCampJohn J. Ellis-MonaghanPeter A. HabitzEdward W. Seibert
    • William F. DeCampJohn J. Ellis-MonaghanPeter A. HabitzEdward W. Seibert
    • G06F17/50
    • G06F17/5081Y10S706/921
    • According to the present embodiment, a method for calculating the parasitic capacitance in a semiconductor device is disclosed. According to the preferred method, a layout file containing the shapes of a semiconductor device is provided. The dimensions of the layout file are then adjusted to wafer dimensions so as reflect actual production devices. The shapes of the layout file are then partitioned into simpler shapes, typically abutted rectangles, called tiles. Each tile is then decomposed into overlap and fringe capacitance components, each component having a uniform capacitance environment with respect to its capacitance elements. The parasitic capacitance of the semiconductor device can thus be accurately computed, with an efficient use of resources. Additionally the preferred embodiment is easily adaptable to a wide range of technology types.
    • 根据本实施例,公开了一种用于计算半导体器件中的寄生电容的方法。 根据优选方法,提供了包含半导体器件的形状的布局文件。 然后将布局文件的尺寸调整为晶圆尺寸,以反映实际的生产设备。 然后,布局文件的形状被分割成更简单的形状,通常是称为块的邻接矩形。 然后,每个瓦片被分解成重叠和边缘电容分量,每个部件相对于其电容元件具有均匀的电容环境。 因此,可以有效利用资源来准确地计算半导体器件的寄生电容。 此外,优选实施例容易适应于广泛的技术类型。