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1. 发明申请

US20080239325A1 Optical sensing methods and apparatus 有权
标题翻译：光学感应方法和装置
公开(公告)号：US20080239325A1
公开(公告)日：2008-10-02
申请号：US11730055
申请日：2007-03-29
申请人： Kwok Sing Cheng , Ho Shan Ng , Lai Man Chau , Yeung Ming Chow , Tao Tao
发明人： Kwok Sing Cheng , Ho Shan Ng , Lai Man Chau , Yeung Ming Chow , Tao Tao
IPC分类号： G01B11/14
CPC分类号： G01S17/026 , G01S17/50
摘要： A method of sensing movement or proximity of objects by optical reflection is provided. The method includes the steps of transmitting a train of optical pulses towards a destination, sensing optical pulses reflected from the destination, and sensing and evaluating movement or proximity characteristics of objects at the destination with reference to variation in pulse width between transmitted and reflected optical pulses.
摘要翻译：提供了通过光学反射来检测物体的移动或接近的方法。该方法包括以下步骤：向目的地发送一列光脉冲，感测从目的地反射的光脉冲，并且参考目的地的物体的移动或接近特性，参考发射和反射的光脉冲之间的脉冲宽度的变化。

2. 发明授权

US07671972B2 Optical sensing methods and apparatus 有权
标题翻译：光学感应方法和装置
公开(公告)号：US07671972B2
公开(公告)日：2010-03-02
申请号：US11730055
申请日：2007-03-29
申请人： Kwok Sing Cheng , Ho Shan Ng , Lai Man Chau , Yeung Ming Chow , Tao Tao
发明人： Kwok Sing Cheng , Ho Shan Ng , Lai Man Chau , Yeung Ming Chow , Tao Tao
IPC分类号： G01P3/36
CPC分类号： G01S17/026 , G01S17/50
摘要： A method of sensing movement or proximity of objects by optical reflection is provided. The method includes the steps of transmitting a train of optical pulses towards a destination, sensing optical pulses reflected from the destination, and sensing and evaluating movement or proximity characteristics of objects at the destination with reference to variation in pulse width between transmitted and reflected optical pulses.
摘要翻译：提供了通过光学反射来检测物体的移动或接近的方法。该方法包括以下步骤：向目的地发送一列光脉冲，感测从目的地反射的光脉冲，并且参考目的地的物体的移动或接近特性，参考发射和反射的光脉冲之间的脉冲宽度的变化。

3. 发明授权

US07684053B2 Optical displacement sensor and distance measuring apparatus 有权
标题翻译：光学位移传感器和测距仪
公开(公告)号：US07684053B2
公开(公告)日：2010-03-23
申请号：US11637008
申请日：2006-12-12
申请人： Yeung Ming Chow
发明人： Yeung Ming Chow
IPC分类号： G01B11/24
CPC分类号： G01B11/026 , G01B11/24
摘要： An optical displacement sensor for measuring distance or surface displacement of an object by surface profile scanning includes an optical source, a first optical detector and a second optical detector. The optical source is located intermediate the first and second optical detectors. The first and second optical detectors are arranged to collect light emitted by the optical source when scattered by and/or reflected from the object.
摘要翻译：用于通过表面轮廓扫描来测量物体的距离或表面位移的光学位移传感器包括光源，第一光学检测器和第二光学检测器。光源位于第一和第二光学检测器的中间。第一和第二光学检测器被布置成在由物体散射和/或从物体反射时收集由光源发射的光。

4. 发明授权

US06501185B1 Barrier cap for under bump metal 失效
标题翻译：阻挡金属凸块
公开(公告)号：US06501185B1
公开(公告)日：2002-12-31
申请号：US10154931
申请日：2002-05-28
申请人： Yeung Ming Chow , Zaheed Sadrudin Karim
发明人： Yeung Ming Chow , Zaheed Sadrudin Karim
IPC分类号： H01L2348
CPC分类号： H01L24/12 , H01L21/2885 , H01L23/53223 , H01L23/53238 , H01L24/03 , H01L24/05 , H01L24/11 , H01L2224/0401 , H01L2224/05082 , H01L2224/05147 , H01L2224/05166 , H01L2224/05171 , H01L2224/05541 , H01L2224/05556 , H01L2224/05559 , H01L2224/05572 , H01L2224/05624 , H01L2224/11462 , H01L2224/1147 , H01L2224/11474 , H01L2224/1148 , H01L2224/11849 , H01L2224/11901 , H01L2224/11902 , H01L2224/13006 , H01L2224/13016 , H01L2224/13082 , H01L2224/131 , H01L2224/13111 , H01L2224/13116 , H01L2224/13155 , H01L2224/13164 , H01L2224/1357 , H01L2924/00013 , H01L2924/0002 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/14 , H01L2924/3651 , H01L2924/00014 , H01L2924/01083 , H01L2924/207 , H01L2224/13099 , H01L2224/05552
摘要： A semiconductor wafer having solder bumps thereon for use in flip-chip bonded integrated circuits comprises a semiconductor substrate formed with metal bond pads at selected locations thereon, a metal electroplating buss layer or layers over the bond pads, a layer of solder-wettable under bump metal on the buss layer, a layer of barrier metal which overlies and encapsulates the solder-wettable metal, and a solder bump formed on the barrier metal.
摘要翻译：其上具有用于倒装芯片接合集成电路的焊料凸块的半导体晶片包括在其上的选定位置处形成有金属接合焊盘的半导体衬底，接合焊盘上的金属电镀总线层或层，可焊接润湿的凸块覆盖并封装可焊性润湿金属的阻挡金属层，以及形成在阻挡金属上的焊料凸块。

5. 发明申请

US20090225330A1 OPTOELECTRONIC DISTANCE SENSOR 有权
标题翻译：光电距离传感器
公开(公告)号：US20090225330A1
公开(公告)日：2009-09-10
申请号：US12043800
申请日：2008-03-06
申请人： Yeung Ming Chow
发明人： Yeung Ming Chow
IPC分类号： G01B11/14 , H01L33/00 , H01L31/18
CPC分类号： G01B11/026 , G01S7/481 , G01S17/48 , H01L25/167 , H01L31/0203 , H01L31/125 , H01L2224/48247 , H01L2924/10253 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要： An optoelectronic distance sensor with slant component 200 having a spacer 202 bonded on a mother substrate 201 is disclosed. The spacer 202 has slant surface for receiving one or more optoelectronic components 204, such as an optical sensor, that are mounted at an angle to the mother substrate 201. Such electronic components 204 are bonded on a daughter substrate 203 which attaches to the spacer 202 at the slant surface. The optoelectronic assembly 200 can be manufactured at chip-level, including by one ore more of exemplary methods disclosed herein.
摘要翻译：公开了具有接合在母基板201上的间隔件202的倾斜部件200的光电距离传感器。间隔件202具有用于接收一个或多个光电元件204（例如光学传感器）的倾斜表面，该光电子部件204与母基板201成一定角度安装。这样的电子部件204接合在附着于间隔件202的子基板203上在倾斜的表面。光电组件200可以在芯片级制造，包括本文公开的一个或多个示例性方法。

6. 发明申请

US20080137071A1 Optical displacement sensor and distance measuring apparatus 有权
标题翻译：光学位移传感器和测距仪
公开(公告)号：US20080137071A1
公开(公告)日：2008-06-12
申请号：US11637008
申请日：2006-12-12
申请人： Yeung Ming Chow
发明人： Yeung Ming Chow
IPC分类号： G01N21/00
CPC分类号： G01B11/026 , G01B11/24
摘要： An optical displacement sensor for measuring distance or surface displacement of an object by surface profile scanning includes an optical source, a first optical detector and a second optical detector. The optical source is located intermediate the first and second optical detectors. The first and second optical detectors are arranged to collect light emitted by the optical source when scattered by and/or reflected from the object.
摘要翻译：用于通过表面轮廓扫描来测量物体的距离或表面位移的光学位移传感器包括光源，第一光学检测器和第二光学检测器。光源位于第一和第二光学检测器的中间。第一和第二光学检测器被布置成在由物体散射和/或从物体反射时收集由光源发射的光。

7. 发明授权

US07701567B2 Optoelectronic distance sensor 有权
标题翻译：光电距离传感器
公开(公告)号：US07701567B2
公开(公告)日：2010-04-20
申请号：US12043800
申请日：2008-03-06
申请人： Yeung Ming Chow
发明人： Yeung Ming Chow
IPC分类号： G01J1/42
CPC分类号： G01B11/026 , G01S7/481 , G01S17/48 , H01L25/167 , H01L31/0203 , H01L31/125 , H01L2224/48247 , H01L2924/10253 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要： An optoelectronic distance sensor with slant component 200 having a spacer 202 bonded on a mother substrate 201 is disclosed. The spacer 202 has slant surface for receiving one or more optoelectronic components 204, such as an optical sensor, that are mounted at an angle to the mother substrate 201. Such electronic components 204 are bonded on a daughter substrate 203 which attaches to the spacer 202 at the slant surface. The optoelectronic assembly 200 can be manufactured at chip-level, including by one ore more of exemplary methods disclosed herein.
摘要翻译：公开了具有接合在母基板201上的间隔件202的倾斜部件200的光电距离传感器。间隔件202具有用于接收一个或多个光电元件204（例如光学传感器）的倾斜表面，该光电子部件204与母基板201成一定角度安装。这样的电子部件204接合在附着于间隔件202的子基板203上在倾斜的表面。光电组件200可以在芯片级制造，包括本文公开的一个或多个示例性方法。

8. 发明申请

US20080083868A1 Monitoring devices and surveillance devices 审中-公开
标题翻译：监控设备和监控设备
公开(公告)号：US20080083868A1
公开(公告)日：2008-04-10
申请号：US11453829
申请日：2006-06-16
申请人： Torsten Wipiejewski , Yeung Ming Chow
发明人： Torsten Wipiejewski , Yeung Ming Chow
IPC分类号： G06M7/00
CPC分类号： G08B29/046 , G08B13/19
摘要： A monitoring device for security surveillance application, the device comprising: an electromagnetic wave sensor for sensing electromagnetic wave from an external electromagnetic wave source; a detection window for forming a partition between the external electromagnetic wave source and the electromagnetic wave sensor; and an anti-tampering arrangement comprising an optical arrangement for deploying an optical surveillance beam and control circuitry, wherein i. the optical surveillance beam comprising a first beam portion and a second beam portion, the first beam portion being a beam emitted by the optical arrangement towards the detection window and the second beam portion being due to total internal reflection of the first beam portion by the detection window, and ii. the control circuitry being for detection of a variation of the second beam portion, wherein the variation is indicative of tampering of the detection window.
摘要翻译：一种用于安全监视应用的监视装置，该装置包括：用于感测来自外部电磁波源的电磁波的电磁波传感器; 用于在外部电磁波源和电磁波传感器之间形成分隔的检测窗口; 以及包括用于部署光学监视光束和控制电路的光学装置的防篡改装置，其中i。所述光学监视光束包括第一光束部分和第二光束部分，所述第一光束部分是由所述光学装置朝向所述检测窗口发射的光束，并且所述第二光束部分是由于所述第一光束部分通过所述检测的全内反射窗口，和ii。所述控制电路用于检测所述第二光束部分的变化，其中所述变化表示所述检测窗口的篡改。

9. 发明授权

US06413851B1 Method of fabrication of barrier cap for under bump metal 失效
标题翻译：下凸块金属阻挡帽的制造方法
公开(公告)号：US06413851B1
公开(公告)日：2002-07-02
申请号：US09878271
申请日：2001-06-12
申请人： Yeung Ming Chow , Zaheed Sadrudin Karim
发明人： Yeung Ming Chow , Zaheed Sadrudin Karim
IPC分类号： H01L2144
CPC分类号： H01L24/12 , H01L21/2885 , H01L23/53223 , H01L23/53238 , H01L24/03 , H01L24/05 , H01L24/11 , H01L2224/0401 , H01L2224/05082 , H01L2224/05147 , H01L2224/05166 , H01L2224/05171 , H01L2224/05541 , H01L2224/05556 , H01L2224/05559 , H01L2224/05572 , H01L2224/05624 , H01L2224/11462 , H01L2224/1147 , H01L2224/11474 , H01L2224/1148 , H01L2224/11849 , H01L2224/11901 , H01L2224/11902 , H01L2224/13006 , H01L2224/13016 , H01L2224/13082 , H01L2224/131 , H01L2224/13111 , H01L2224/13116 , H01L2224/13155 , H01L2224/13164 , H01L2224/1357 , H01L2924/00013 , H01L2924/0002 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/14 , H01L2924/3651 , H01L2924/00014 , H01L2924/01083 , H01L2924/207 , H01L2224/13099 , H01L2224/05552
摘要： A method of fabrication of solder bumps on a semiconductor wafer provided with metal bond pads comprises the steps of: (a) applying a metal adhesion/barrier/electroplating buss layer or layers on at least the bond pads; (b) forming a layer of a resist in a predefined pattern defining openings therein over the bond pads; (c) applying a layer of solder-wettable under bump metal into the openings; (d) removing a volume of resist from the regions of the openings to create an opening between an edge of the layer of wettable metal and the resist; (e) applying a layer of a barrier metal over the layer of solder-wettable metal including the openings created at step (d) while encapsulates the layer of wettable metal; (f) fabricating a solder bump onto the layer of barrier metal; and (g) removing the resist material; and (h) removing any exposed adhesion/barrier layer.
摘要翻译：在设置有金属接合焊盘的半导体晶片上制造焊料凸块的方法包括以下步骤：（a）在至少接合焊盘上施加金属粘附/阻挡/电镀总线层或层; （b）以预定的图案形成抗蚀剂层，所述图案在接合焊盘上限定开口; （c）将可焊接润湿的下凸块金属层施加到开口中; （d）从开口的区域移除体积的抗蚀剂，以在可湿性金属层的边缘和抗蚀剂之间形成开口; （e）在包含可步骤（d）所产生的开口的可焊接润湿金属层上施加一层阻挡金属，同时封装可湿性金属层; （f）在阻挡金属层上制造焊料凸块; 和（g）除去抗蚀剂材料; 和（h）去除任何暴露的粘附/阻挡层。

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