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1. 发明授权

US10564759B2 Method and apparatus for providing touch interface 有权
公开(公告)号：US10564759B2
公开(公告)日：2020-02-18
申请号：US13335608
申请日：2011-12-22
申请人： Kwang-Yong Lee , Woo-Jin Jung , Beom-Soo Cho , Yong-Gook Park
发明人： Kwang-Yong Lee , Woo-Jin Jung , Beom-Soo Cho , Yong-Gook Park
IPC分类号： G06F3/041 , G06F3/048 , G06F3/0488
摘要： An apparatus performs a method for providing a touch interface. The method includes receiving a touch input from a touch detection unit, detecting touch characteristics according to the touch input, and generating events different from each other according to the detected touch characteristics.

2. 发明申请

US20120162111A1 METHOD AND APPARATUS FOR PROVIDING TOUCH INTERFACE 审中-公开
标题翻译：提供触控界面的方法和装置
公开(公告)号：US20120162111A1
公开(公告)日：2012-06-28
申请号：US13335608
申请日：2011-12-22
申请人： Kwang-Yong Lee , Woo-Jin Jung , Beom-Soo Cho , Yong-Gook Park
发明人： Kwang-Yong Lee , Woo-Jin Jung , Beom-Soo Cho , Yong-Gook Park
IPC分类号： G06F3/041
摘要： A method and apparatus for providing a touch interface. The method for providing the touch interface includes receiving a touch input from a touch detection unit, detecting touch characteristics according to the touch input, and generating events different from each other according to the detected touch characteristics.
摘要翻译：一种用于提供触摸界面的方法和装置。提供触摸界面的方法包括从触摸检测单元接收触摸输入，根据触摸输入检测触摸特性，以及根据检测到的触摸特性产生彼此不同的事件。

3. 发明授权

US09159680B2 Method of fabricating semiconductor device 有权
标题翻译：制造半导体器件的方法
公开(公告)号：US09159680B2
公开(公告)日：2015-10-13
申请号：US13486155
申请日：2012-06-01
申请人： Sang-Wook Park , Kwang-Yong Lee , Ho-Geon Song
发明人： Sang-Wook Park , Kwang-Yong Lee , Ho-Geon Song
IPC分类号： H01L21/28 , H01L21/78 , H01L23/00
CPC分类号： H01L24/03 , H01L24/05 , H01L2224/02319 , H01L2224/02331 , H01L2224/02375 , H01L2224/02377 , H01L2224/02379 , H01L2224/03003 , H01L2224/03334 , H01L2224/05548 , H01L2224/05554 , H01L2224/05567 , H01L2224/05639 , H01L2224/05647 , H01L2224/05655 , H01L2224/0603 , H01L2224/06153 , H01L2924/01327 , H01L2924/1461 , H01L2924/15787 , H01L2924/15788 , H01L2924/00014 , H01L2924/00
摘要： A method of fabricating a semiconductor device includes preparing a semiconductor substrate having a circuit unit on an upper surface thereof, a metal pad electrically connected to the circuit unit, and a passivation layer that covers the circuit unit and exposes the metal pad, forming a first re-wiring layer that is electrically connected to the metal pad and is formed by a printing method to extend from the metal pad on the passivation layer and forming a second re-wiring layer on the first re-wiring layer using the first re-wiring layer as a seed by using an electro-plating process.
摘要翻译：制造半导体器件的方法包括制备在其上表面上具有电路单元的半导体衬底，电连接到电路单元的金属焊盘以及覆盖电路单元并暴露金属焊盘的钝化层，形成第一电连接到金属焊盘的再布线层，并且通过印刷方法形成，以从钝化层上的金属焊盘延伸，并且在第一重新布线层上形成第二重新布线层，使用第一重新布线层作为种子使用电镀方法。

4. 发明申请

US20120309167A1 METHOD OF FABRICATING SEMICONDUCTOR DEVICE 有权
标题翻译：制造半导体器件的方法
公开(公告)号：US20120309167A1
公开(公告)日：2012-12-06
申请号：US13486155
申请日：2012-06-01
申请人： Sang-Wook PARK , Kwang-Yong Lee , Ho-Geon Song
发明人： Sang-Wook PARK , Kwang-Yong Lee , Ho-Geon Song
IPC分类号： H01L21/28 , H01L21/78
CPC分类号： H01L24/03 , H01L24/05 , H01L2224/02319 , H01L2224/02331 , H01L2224/02375 , H01L2224/02377 , H01L2224/02379 , H01L2224/03003 , H01L2224/03334 , H01L2224/05548 , H01L2224/05554 , H01L2224/05567 , H01L2224/05639 , H01L2224/05647 , H01L2224/05655 , H01L2224/0603 , H01L2224/06153 , H01L2924/01327 , H01L2924/1461 , H01L2924/15787 , H01L2924/15788 , H01L2924/00014 , H01L2924/00
摘要： A method of fabricating a semiconductor device includes preparing a semiconductor substrate having a circuit unit on an upper surface thereof, a metal pad electrically connected to the circuit unit, and a passivation layer that covers the circuit unit and exposes the metal pad, forming a first re-wiring layer that is electrically connected to the metal pad and is formed by a printing method to extend from the metal pad on the passivation layer and forming a second re-wiring layer on the first re-wiring layer using the first re-wiring layer as a seed by using an electro-plating process.
摘要翻译：制造半导体器件的方法包括制备在其上表面上具有电路单元的半导体衬底，电连接到电路单元的金属焊盘以及覆盖电路单元并暴露金属焊盘的钝化层，形成第一电连接到金属焊盘的再布线层，并且通过印刷方法形成，以从钝化层上的金属焊盘延伸，并且在第一重新布线层上形成第二重新布线层，使用第一重新布线层作为种子使用电镀方法。

5. 发明申请

US20120173744A1 WIRELESS CONNECTION METHOD AND APPARATUS USING IMAGE RECOGNITION IN MOBILE COMMUNICATION TERMINAL 审中-公开
标题翻译：无线连接方法和使用移动通信终端中的图像识别的设备
公开(公告)号：US20120173744A1
公开(公告)日：2012-07-05
申请号：US13395419
申请日：2010-09-10
申请人： Kwang-Yong Lee , Soon-Hwan Kwon
发明人： Kwang-Yong Lee , Soon-Hwan Kwon
IPC分类号： H04W76/02 , G06F15/16
CPC分类号： G06K9/3266 , H04W8/205 , H04W12/003 , H04W12/00522 , H04W84/12
摘要： A method and apparatus for wireless connection with an external device using image recognition in a mobile communication terminal is provided. In the method for wireless connection with an external device using image recognition in a mobile communication terminal, an image including network connection information is acquired by a camera. The network connection information is acquired by recognizing the image through an image recognition algorithm. The wireless connection with the external device is performed using the acquired network connection information.
摘要翻译：提供了一种在移动通信终端中使用图像识别的与外部设备进行无线连接的方法和装置。在移动通信终端中使用图像识别的外部设备进行无线连接的方法中，通过摄像机获取包含网络连接信息的图像。通过图像识别算法识别图像来获取网络连接信息。使用所获取的网络连接信息来执行与外部设备的无线连接。

6. 发明授权

US08332770B2 Apparatus and method for providing character deletion function 有权
标题翻译：提供字符删除功能的装置和方法
公开(公告)号：US08332770B2
公开(公告)日：2012-12-11
申请号：US12188555
申请日：2008-08-08
申请人： Keun-Ho Shin , Kwang-Yong Lee
发明人： Keun-Ho Shin , Kwang-Yong Lee
IPC分类号： G06F3/048
CPC分类号： G06F3/0488
摘要： An apparatus and a method for providing a character deletion function is provided. A plurality of deletion items having respective designated deletion schemes are displayed, when there is a request for a deletion mode while inputting characters. It is determined if a Drag event occurs after a Press event occurs in an area where one of the plurality of deletion items is displayed. It is determined if a Release event occurs when the Drag event occurs. A deletion function in a deletion scheme corresponding to a deletion item having an area where the Release event occurs is performed when the Release event occurs. Accordingly, a user has convenience with which, when inputting characters, the user receives various deletion schemes and can perform a desired deletion function in a simple way.
摘要翻译：提供了一种用于提供字符删除功能的装置和方法。当在输入字符时存在删除模式的请求时，显示具有各自指定的删除方案的多个删除项目。在显示多个删除项之一的区域中发生Press事件之后，确定是否发生拖动事件。当发生Drag事件时，确定是否发生Release事件。当释放事件发生时，执行与具有发生释放事件的区域的删除项相对应的删除方案中的删除功能。因此，用户具有便利性，当输入字符时，用户接收各种删除方案，并且可以以简单的方式执行所需的删除功能。

7. 发明授权

US07873396B2 Portable terminal with hinge stopper 有权
标题翻译：带铰链止动器的便携式终端
公开(公告)号：US07873396B2
公开(公告)日：2011-01-18
申请号：US11765228
申请日：2007-06-19
申请人： Yi-Tae Kang , Yong-Jae Kim , Sang-Gook Kim , Kwang-Yong Lee
发明人： Yi-Tae Kang , Yong-Jae Kim , Sang-Gook Kim , Kwang-Yong Lee
IPC分类号： H04M1/00
CPC分类号： H04M1/0214
摘要： A portable terminal is equipped with a first housing, a second housing and a hinge device, the second housing being coupled to one end of the first housing and rotating about a hinge axis extending in a longitudinal direction of the first housing, the hinge device rotatably coupling the first housing and the second housing, the hinge device including: a first hinge base mounted on the first housing or the second housing; a second hinge base mounted on the second housing or the first housing, coupled oppositely to the first hinge base, and rotating about the hinge axis; and a hinge stopper mounted adjacent to the second hinge base, and pivoting around the hinge axis as the second hinge base rotates, wherein the hinge stopper is engaged with the first hinge base in at least one point while the second hinge base rotates, and thus stops rotation of the second hinge base.
摘要翻译：便携式终端装备有第一壳体，第二壳体和铰链装置，第二壳体联接到第一壳体的一端并围绕在第一壳体的纵向方向上延伸的铰链轴线旋转，铰链装置可旋转联接第一壳体和第二壳体，铰链装置包括：安装在第一壳体或第二壳体上的第一铰链座; 安装在所述第二壳体或所述第一壳体上的第二铰链座，其与所述第一铰链座相对地联接并围绕所述铰链轴线旋转; 以及铰链止动件，其邻近所述第二铰链座安装，并且当所述第二铰链基座旋转时围绕所述铰链轴线枢转，其中所述铰链止动件在所述第二铰链座旋转时在至少一个点处与所述第一铰链座接合，停止第二铰链座的旋转。

8. 发明授权

US09698066B2 Semiconductor chips having defect detecting circuits 有权
公开(公告)号：US09698066B2
公开(公告)日：2017-07-04
申请号：US15201675
申请日：2016-07-05
申请人： Bo-Ra Lee , Jae-Ho Jeong , Nam-Gyu Baek , Hyo-Seok Woo , Hyun-Sook Yoon , Kwang-Yong Lee
发明人： Bo-Ra Lee , Jae-Ho Jeong , Nam-Gyu Baek , Hyo-Seok Woo , Hyun-Sook Yoon , Kwang-Yong Lee
IPC分类号： H01L21/66 , H01L29/423 , H01L27/1157 , H01L23/00
CPC分类号： H01L22/34 , H01L23/562 , H01L27/1157 , H01L27/11575 , H01L27/11582
摘要： A semiconductor chip includes: a gate pattern on a substrate; an interlayer insulation layer on the gate pattern; a first wiring structure on the interlayer insulation layer; and a defect detection circuit electrically connected to the gate pattern and the first wiring structure. The first wiring structure is electrically connected to the gate pattern via a contact plug through the interlayer insulation layer. The defect detection circuit is electrically connected to the gate pattern and the first wiring structure, and the defect detection circuit is configured to detect defects in the first wiring structure and at least one of the gate pattern and the substrate.

9. 发明授权

US08772084B2 Multi-chip semiconductor package and method of fabricating the same 失效
标题翻译：多芯片半导体封装及其制造方法
公开(公告)号：US08772084B2
公开(公告)日：2014-07-08
申请号：US13618041
申请日：2012-09-14
申请人： Jong-Gi Lee , Kwang-Yong Lee , Min-Ho Lee
发明人： Jong-Gi Lee , Kwang-Yong Lee , Min-Ho Lee
IPC分类号： H01L21/44 , H01L23/02
CPC分类号： H01L24/82 , H01L23/3128 , H01L23/3135 , H01L23/3185 , H01L24/24 , H01L24/92 , H01L25/0657 , H01L25/50 , H01L2224/0401 , H01L2224/05124 , H01L2224/05147 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/05669 , H01L2224/05684 , H01L2224/16225 , H01L2224/24011 , H01L2224/2405 , H01L2224/24145 , H01L2224/244 , H01L2224/24998 , H01L2225/06517 , H01L2225/06524 , H01L2225/06558 , H01L2225/06562 , H01L2924/01029 , H01L2924/12042 , H01L2924/1431 , H01L2924/1434 , H01L2924/1436 , H01L2924/1437 , H01L2924/1438 , H01L2924/15311 , H01L2924/181 , H01L2924/00
摘要： A first semiconductor chip having a first projection electrode formed on an upper surface thereof is prepared. A second semiconductor chip having a second projection electrode is mounted on the first semiconductor chip to expose the first projection electrode. An insulating film is formed between the first projection electrode and the second projection electrode. A groove is formed in the insulating film. An interconnection configured to fill an inside of the groove and connected to the first projection electrode and the second projection electrode is formed.
摘要翻译：制备具有形成在其上表面上的第一突起电极的第一半导体芯片。具有第二投影电极的第二半导体芯片安装在第一半导体芯片上以暴露第一投影电极。在第一投影电极和第二投影电极之间形成绝缘膜。在绝缘膜中形成凹槽。形成了用于填充凹槽内部并连接到第一突出电极和第二突起电极的互连。

10. 发明授权

US08254140B2 Mounting substrate 有权
标题翻译：安装基板
公开(公告)号：US08254140B2
公开(公告)日：2012-08-28
申请号：US12357693
申请日：2009-01-22
申请人： Kwang-Yong Lee , Jong-Gi Lee , Sun-Won Kang , Ji-Seok Hong
发明人： Kwang-Yong Lee , Jong-Gi Lee , Sun-Won Kang , Ji-Seok Hong
IPC分类号： H05K7/10
CPC分类号： H05K3/3494 , H01L21/565 , H01L23/49816 , H01L24/16 , H01L24/81 , H01L2224/05568 , H01L2224/05573 , H01L2224/11334 , H01L2224/13022 , H01L2224/13099 , H01L2224/16 , H01L2224/81191 , H01L2224/81192 , H01L2224/81222 , H01L2224/81801 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01043 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/181 , H05K1/0212 , H05K3/3436 , H05K3/4007 , H05K2203/101 , H01L2924/00 , H01L2224/05599
摘要： A mounting substrate includes a substrate, a bonding pad and an induction heating pad. The bonding pad is formed on the substrate, and adhered to a solder ball to mount a semiconductor chip on the substrate. The induction heating pad is disposed adjacent to the bonding pad, the induction heating pad being induction heated by an applied alternating magnetic field to reflow the solder ball. The induction heating pad having a diameter greater than a skin depth in response to the frequency of the applied alternating magnetic field is selectively induction heated in response to a low frequency band of the alternating magnetic field. Accordingly, during a reflow process for a solder ball, the semiconductor chip may be mounted on the mounting substrate to complete a semiconductor package without damaging the mounting substrate, to thereby improve the reliability of the completed semiconductor package.
摘要翻译：安装基板包括基板，接合焊盘和感应加热垫。接合焊盘形成在基板上，并且粘附到焊球以将半导体芯片安装在基板上。感应加热垫设置在接合焊盘附近，感应加热垫被施加的交变磁场感应加热以回流焊球。响应于所施加的交变磁场的频率具有大于皮肤深度的直径的感应加热垫响应于交变磁场的低频带被选择性地感应加热。因此，在焊球的回流处理中，可以将半导体芯片安装在安装基板上以完成半导体封装而不损坏安装基板，从而提高完成的半导体封装的可靠性。

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