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1. 发明授权

US07298933B2 Optical module 有权
标题翻译：光模块
公开(公告)号：US07298933B2
公开(公告)日：2007-11-20
申请号：US11148906
申请日：2005-06-09
申请人： Kwang Seong Choi , Jong Hyun Lee , Yong Duck Chung , Young Shik Kang , Jong Tae Moon , Je Ha Kim
发明人： Kwang Seong Choi , Jong Hyun Lee , Yong Duck Chung , Young Shik Kang , Jong Tae Moon , Je Ha Kim
IPC分类号： G02F1/01 , G02F1/35
CPC分类号： G02F1/0356
摘要： Provided is an optical module including a microstrip line, a traveling wave type optical device positioned in the end of the microstrip line, and at least one balanced open stub connected to the microstrip line for the impedance matching at a specific frequency such as 40 GHz and 60 GHz. For the fine tuning, laser trimming can be applied to the stub. A transition region is formed between the optical device and the microstrip line. A termination resistor is formed to face the microstrip line with the optical device therebetween. A bandwidth can be controlled at a specific frequency by adjusting a number of the stubs or a value of the termination resistor.
摘要翻译：提供了一种光学模块，其包括微带线，位于微带线的端部的行波型光学器件和连接到微带线的至少一个平衡的开路短路，用于在特定频率例如40GHz的阻抗匹配，以及 60 GHz。对于微调，激光修剪可以应用于存根。在光学器件和微带线之间形成过渡区域。形成终端电阻器，以便在其间具有光学器件来面对微带线。可以通过调整短路的数量或终端电阻的值来控制带宽在特定频率。

2. 发明授权

US07553092B2 Optical module and optical module package 有权
标题翻译：光模块和光模块封装
公开(公告)号：US07553092B2
公开(公告)日：2009-06-30
申请号：US11450743
申请日：2006-06-08
申请人： Kwang Seong Choi , Yong Duck Chung , Young Shik Kang , Dong Suk Jun , Je Ha Kim , Jong Tae Moon
发明人： Kwang Seong Choi , Yong Duck Chung , Young Shik Kang , Dong Suk Jun , Je Ha Kim , Jong Tae Moon
IPC分类号： G02B6/36
CPC分类号： G02F1/0121 , G02B6/4201 , G02B6/4279 , H01L2224/48091 , H01L2924/3011 , H01L2924/00014 , H01L2924/00
摘要： Provided is an optical module used in a communication system employing a radio over fiber (ROF) technology delivering a radio frequency (RF) signal through an optical fiber. The optical module includes: an optical device; a signal line for transporting a radio frequency (RF) signal input from an external circuit to the optical device; and a resistor separately disposed from the signal line and having one end connected with the optical device, wherein the input impedance seen from the signal line is matched by the resistor. A bias voltage supplied to operate the optical device is applied through an inductor connected to the signal line between the optical device and a filter. Here, the filter formed by a pattern of the signal line prevents the bias voltage from being supplied to the external circuit. In order to amplify the RF signal input from the external circuit, an amplifier may be connected between the external circuit and the filter.
摘要翻译：提供了一种用于通过光纤传送射频（RF）信号的无线电光纤（ROF）技术的通信系统中的光学模块。光学模块包括：光学装置; 用于将从外部电路输入的射频（RF）信号传送到光学装置的信号线; 以及与信号线分开设置并且具有与光学装置连接的一端的电阻，其中从信号线看到的输入阻抗由电阻器匹配。提供用于操作光学器件的偏置电压通过连接到光学器件和滤光器之间的信号线的电感器施加。这里，由信号线的图案形成的滤波器防止偏置电压被提供给外部电路。为了放大从外部电路输入的RF信号，可以在外部电路和滤波器之间连接放大器。

3. 发明申请

US20080285978A1 OPTICAL HYBRID MODULE 审中-公开
标题翻译：光学混合模块
公开(公告)号：US20080285978A1
公开(公告)日：2008-11-20
申请号：US12053694
申请日：2008-03-24
申请人： Kwang Seong Choi , Yong Duck Chung , Jae Sik Sim , Jong Tae Moon , Hyun Kyu Yu , Je Ha Kim
发明人： Kwang Seong Choi , Yong Duck Chung , Jae Sik Sim , Jong Tae Moon , Hyun Kyu Yu , Je Ha Kim
IPC分类号： H04B10/00
CPC分类号： H04B10/25752 , H01L2224/45147 , H01L2224/48091 , H01L2924/00014
摘要： Provided is an optical hybrid module in which an optical device, a filter, an amplifier and an antenna are hybrid-integrated, which includes: a silicon optical bench disposed on a substrate and having an optical fiber and an optical device; an amplifier disposed on the substrate and connected to the optical device disposed on the silicon optical bench to amplify a signal transmitted from the optical device; and an antenna disposed on the substrate to be connected to the amplifier and transmitting a signal amplified by the amplifier. Thus, a foot-print module may be embodied by disposing an antenna and a filter on a single- or multi-layer substrate and providing a bias required for the optical device and the amplifier through a solder ball. Also, due to the antenna and filter disposed on the substrate, an expensive connector is not needed, and thus a production costs can be reduced.
摘要翻译：提供了一种光混合模块，其中光学装置，滤波器，放大器和天线是混合集成的，其包括：设置在基板上并具有光纤和光学装置的硅光学台; 放大器，设置在所述基板上并连接到设置在所述硅光学台上的所述光学装置，以放大从所述光学装置发送的信号; 以及设置在所述基板上以连接到所述放大器并且发射由所述放大器放大的信号的天线。因此，可以通过在单层或多层衬底上设置天线和滤波器并通过焊球提供光学器件和放大器所需的偏置来实现脚印模块。此外，由于设置在基板上的天线和滤波器，不需要昂贵的连接器，因此可以降低生产成本。

4. 发明申请

US20110018670A1 ELECTRONIC DEVICE INCLUDING LTCC INDUCTOR 失效
标题翻译：包括LTCC电感器的电子器件
公开(公告)号：US20110018670A1
公开(公告)日：2011-01-27
申请号：US12648117
申请日：2009-12-28
申请人： Hyun-Cheol BAE , Kwang-Seong Choi , Yong Sung Eom , Jong Tae Moon , Moo Jung Chu , Jong-Hyun Lee
发明人： Hyun-Cheol BAE , Kwang-Seong Choi , Yong Sung Eom , Jong Tae Moon , Moo Jung Chu , Jong-Hyun Lee
IPC分类号： H01F5/00
CPC分类号： H01F17/0013 , H01F2017/002 , H01L2224/48091 , H01L2224/73257 , H01L2924/19107 , H01L2924/00014
摘要： Provided is an electronic device that includes an LTCC inductor including a first sheet disposed on a substrate and including a first conductive pattern, a second sheet disposed on the first sheet and including a second conductive pattern, and a via electrically connecting the first conductive pattern to the second conductive pattern, and a spacer disposed on a lower surface of the first sheet to provide an air gap between the substrate and the first sheet, wherein the first conductive pattern is exposed out of the lower surface of the first sheet.
摘要翻译：提供一种电子设备，其包括LTCC电感器，其包括设置在基板上的第一片，并且包括第一导电图案，设置在第一片上并包括第二导电图案的第二片，以及将第一导电图案电连接到第二导电图案和设置在第一片的下表面上的间隔件，以在基片和第一片之间提供气隙，其中第一导电图案从第一片的下表面露出。

5. 发明申请

US20100320596A1 METHOD FOR FABRICATING SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE USING THE SAME 有权
标题翻译：用于制造半导体封装的方法和使用该半导体封装的半导体封装
公开(公告)号：US20100320596A1
公开(公告)日：2010-12-23
申请号：US12565171
申请日：2009-09-23
申请人： Yong Sung Eom , Kwang-Seong Choi , Hyun-Cheol Bae , Jong-Hyun Lee , Jong Tae Moon
发明人： Yong Sung Eom , Kwang-Seong Choi , Hyun-Cheol Bae , Jong-Hyun Lee , Jong Tae Moon
IPC分类号： H01L23/488 , H01L21/60
CPC分类号： H01L24/81 , H01L21/486 , H01L21/563 , H01L23/29 , H01L23/293 , H01L23/49816 , H01L23/49827 , H01L24/16 , H01L24/29 , H01L24/32 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/05644 , H01L2224/05655 , H01L2224/05666 , H01L2224/05669 , H01L2224/1134 , H01L2224/1152 , H01L2224/73104 , H01L2224/73203 , H01L2224/81192 , H01L2224/818 , H01L2224/81801 , H01L2224/83194 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15787 , H01L2224/13099 , H01L2924/00 , H01L2924/00012 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： Provided is a method for fabricating semiconductor package and a semiconductor package fabricated using the same. The method for fabricating semiconductor package dopes a mixture including the polymer material and the solder particle on the substrate in which the terminal is formed and applies heat, and thus the solder particle flows (or diffuses) toward the terminal in the heated polymer resin to adhere to the exposed surface of the terminal, i.e., the side surface and upper surface of the terminal, thereby forming the solder layer. The solder layer improves the adhesive strength between the terminal of the semiconductor chip and the terminal of the substrate in the subsequent flip chip bonding process.
摘要翻译：提供一种制造半导体封装的方法和使用其制造的半导体封装。制造半导体封装的方法在形成端子的基板上涂覆包括聚合物材料和焊料颗粒的混合物，并施加热量，从而焊料颗粒向加热的聚合物树脂中的端子流动（或扩散）以粘附到端子的暴露表面，即端子的侧表面和上表面，从而形成焊料层。焊料层在随后的倒装芯片接合工艺中提高了半导体芯片的端子和衬底的端子之间的粘合强度。

6. 发明授权

US08044757B2 Electronic device including LTCC inductor 失效
标题翻译：电子器件包括LTCC电感
公开(公告)号：US08044757B2
公开(公告)日：2011-10-25
申请号：US12648117
申请日：2009-12-28
申请人： Hyun-Cheol Bae , Kwang-Seong Choi , Yong Sung Eom , Jong Tae Moon , Moo Jung Chu , Jong-Hyun Lee
发明人： Hyun-Cheol Bae , Kwang-Seong Choi , Yong Sung Eom , Jong Tae Moon , Moo Jung Chu , Jong-Hyun Lee
IPC分类号： H01F5/00 , H01F27/29 , H01F27/28 , H01L23/34 , H01L23/48
CPC分类号： H01F17/0013 , H01F2017/002 , H01L2224/48091 , H01L2224/73257 , H01L2924/19107 , H01L2924/00014
摘要： Provided is an electronic device that includes an LTCC inductor including a first sheet disposed on a substrate and including a first conductive pattern, a second sheet disposed on the first sheet and including a second conductive pattern, and a via electrically connecting the first conductive pattern to the second conductive pattern, and a spacer disposed on a lower surface of the first sheet to provide an air gap between the substrate and the first sheet, wherein the first conductive pattern is exposed out of the lower surface of the first sheet.
摘要翻译：提供一种电子设备，其包括LTCC电感器，其包括设置在基板上的第一片，并且包括第一导电图案，设置在第一片上并包括第二导电图案的第二片，以及将第一导电图案电连接到第二导电图案和设置在第一片的下表面上的间隔件，以在基片和第一片之间提供气隙，其中第一导电图案从第一片的下表面露出。

7. 发明授权

US08030200B2 Method for fabricating a semiconductor package 有权
标题翻译：半导体封装的制造方法
公开(公告)号：US08030200B2
公开(公告)日：2011-10-04
申请号：US12565171
申请日：2009-09-23
申请人： Yong Sung Eom , Kwang-Seong Choi , Hyun-Cheol Bae , Jong-Hyun Lee , Jong Tae Moon
发明人： Yong Sung Eom , Kwang-Seong Choi , Hyun-Cheol Bae , Jong-Hyun Lee , Jong Tae Moon
IPC分类号： H01L21/44
CPC分类号： H01L24/81 , H01L21/486 , H01L21/563 , H01L23/29 , H01L23/293 , H01L23/49816 , H01L23/49827 , H01L24/16 , H01L24/29 , H01L24/32 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/05644 , H01L2224/05655 , H01L2224/05666 , H01L2224/05669 , H01L2224/1134 , H01L2224/1152 , H01L2224/73104 , H01L2224/73203 , H01L2224/81192 , H01L2224/818 , H01L2224/81801 , H01L2224/83194 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15787 , H01L2224/13099 , H01L2924/00 , H01L2924/00012 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A method for fabricating a semiconductor package, includes the steps of forming a first terminal at a first substrate; mixing a polymer resin and solder particles to provide a mixture; covering at least one of an upper surface and side surfaces of the first terminal with the mixture; and heating the first substrate at a temperature higher than a melting point of the solder particles of the mixture to form a solder layer that covers the at least one of an upper surface and a side surface of the first terminal. The solder particles flow or diffuse toward the terminal in the heated polymer resin to adhere to at least some of the exposed surfaces of the terminal thereby forming the solder layer. The solder layer improves the adhesive strength between the terminals of the semiconductor chip and the substrate in the subsequent flip chip bonding process.
摘要翻译：一种半导体封装的制造方法，包括在第一基板上形成第一端子的工序; 混合聚合物树脂和焊料颗粒以提供混合物; 用所述混合物覆盖所述第一端子的上表面和侧表面中的至少一个; 以及在高于混合物的焊料颗粒的熔点的温度下加热第一衬底，以形成覆盖第一端子的上表面和侧表面中的至少一个的焊料层。焊料颗粒朝向加热的聚合物树脂中的端子流动或扩散以粘附到端子的至少一些暴露表面，从而形成焊料层。焊料层在随后的倒装芯片接合工艺中提高了半导体芯片的端子与衬底之间的粘合强度。

8. 发明授权

US07012939B2 Wavelength stabilization module having light-receiving element array and method of manufacturing the same 失效
标题翻译：具有光接收元件阵列的波长稳定模块及其制造方法
公开(公告)号：US07012939B2
公开(公告)日：2006-03-14
申请号：US10648238
申请日：2003-08-27
申请人： Kwang Seong Choi , Heung Woo Park , Ho Gyeong Yun , Byung Seok Choi , Yong Sung Eom , Jong Hyun Lee , Jong Tae Moon
发明人： Kwang Seong Choi , Heung Woo Park , Ho Gyeong Yun , Byung Seok Choi , Yong Sung Eom , Jong Hyun Lee , Jong Tae Moon
IPC分类号： H01S3/13 , G01B9/02
CPC分类号： H04B10/572
摘要： A wavelength stabilization module having a light-receiving element array and a method of manufacturing the same are disclosed. The wavelength stabilization module having a laser diode which irradiates a laser beam at the front side and the rear side thereof comprises a collimator for paralleling the laser beam irradiated at the rear side; a beam splitter for splitting the laser beam passed through the collimator into the two directional laser beams; a light-receiving element for receiving one of the split laser beams; a filter for transmitting a specific wavelength of the other of the split laser beams; a light-receiving element array for receiving the laser beam passed through the filter; and a controller for controlling the output wavelength of the laser diode by using the signals output from the light-receiving element and the light-receiving element array, and the filter and the light-receiving element array are tilted at a predetermined angle with respect to the laser beam and lock the wavelength by using an incident angle dependency of the laser beam passed through the filter.
摘要翻译：公开了具有光接收元件阵列的波长稳定模块及其制造方法。具有在其前侧和后侧照射激光束的激光二极管的波长稳定模块包括用于与在后侧照射的激光束并联的准直器; 用于将穿过准直器的激光束分成两个定向激光束的分束器; 用于接收所述分离激光束中的一个的光接收元件; 用于传输另一个分离激光束的特定波长的滤波器; 用于接收通过过滤器的激光束的光接收元件阵列; 以及控制器，用于通过使用从光接收元件和光接收元件阵列输出的信号来控制激光二极管的输出波长，并且滤光器和光接收元件阵列相对于激光束并通过使用通过过滤器的激光束的入射角依赖性来锁定波长。

9. 发明申请

US20080297299A1 VERTICALLY FORMED INDUCTOR AND ELECTRONIC DEVICE HAVING THE SAME 失效
标题翻译：垂直形成的电感器和具有该电感器的电子器件
公开(公告)号：US20080297299A1
公开(公告)日：2008-12-04
申请号：US12053716
申请日：2008-03-24
申请人： Ho Gyeong Yun , Kwang Seong Choi , Jong Tae Moon
发明人： Ho Gyeong Yun , Kwang Seong Choi , Jong Tae Moon
IPC分类号： H01F5/00
CPC分类号： H01F17/0013 , H01F17/0033 , H01F27/34 , H01F2017/002
摘要： Provided are an inductor, which is vertically formed, and an electronic device having the inductor, and more particularly, an inductor capable of minimizing loss of a surface area and accomplishing high efficiency impedance by vertically forming the inductor in a plurality of insulating layers, and an electronic device having the same. The inductor includes a plurality of conductive lines disposed in the insulating layers; and vias vertically formed in the insulating layers to electrically connect the plurality of conductive lines. When a board or an electronic device including an inductor proposed by the present invention is manufactured, the inductor can occupy a minimum area in the electronic device or board while providing high inductance. In particular, the surface area of the electronic device or board occupied by the inductor can be remarkably decreased to reduce manufacturing costs.
摘要翻译：提供了一种垂直形成的电感器，以及具有电感器的电子器件，更具体地说，一种电感器，其能够通过在多个绝缘层中垂直形成电感器来最小化表面积的损失并实现高效率阻抗，以及具有该电子设备的电子设备。电感器包括布置在绝缘层中的多条导线; 以及在绝缘层中垂直形成的通孔，以电连接多条导线。当制造包括由本发明提出的电感器的电路板或电子设备时，电感器可以在提供高电感的同时占据电子设备或电路板中的最小面积。特别地，电感器占用的电子设备或板的表面积可以显着降低，从而降低制造成本。

10. 发明申请

US20100142115A1 BURIED CAPACITOR, METHOD OF MANUFACTURING THE SAME, AND METHOD OF CHANGING CAPACITANCE THEREOF 审中-公开
标题翻译：烧结电容器，其制造方法及其电容变化方法
公开(公告)号：US20100142115A1
公开(公告)日：2010-06-10
申请号：US12499762
申请日：2009-07-08
申请人： Hyun-Cheol Bae , Kwang-Seong Choi , Ju Yeon Hong , Jong Tae Moon , Yong il Jun
发明人： Hyun-Cheol Bae , Kwang-Seong Choi , Ju Yeon Hong , Jong Tae Moon , Yong il Jun
IPC分类号： H01G5/00 , H01G7/00 , B32B38/04
CPC分类号： H01G4/30 , H01G4/232 , H01G4/38 , H01G4/40 , H05K1/0206 , H05K1/0306 , H05K1/162 , H05K3/4629 , H05K2201/0187 , H05K2201/09672 , H05K2201/0969 , H05K2203/171 , Y10T29/43 , Y10T156/1056
摘要： Provided are a buried capacitor, a method of manufacturing the same, and a method of changing a capacitance thereof. The buried capacitor includes an upper electrode including at least one first hole, a lower electrode including at least one second hole, and a dielectric interposed between the upper electrode and the lower electrode.
摘要翻译：提供一种埋电容器，其制造方法和改变其电容的方法。掩埋电容器包括上电极，其包括至少一个第一孔，包括至少一个第二孔的下电极和介于上电极和下电极之间的电介质。

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