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    • 8. 发明申请
    • Resistance Semiconductor Memory Device Having Three-Dimensional Stack and Word Line Decoding Method Thereof
    • 具有三维堆栈和字线解码方法的电阻半导体存储器件
    • US20100329070A1
    • 2010-12-30
    • US12873836
    • 2010-09-01
    • Joon Min ParkSang-Beom KangHyung-Rok OhWoo-Yeong Cho
    • Joon Min ParkSang-Beom KangHyung-Rok OhWoo-Yeong Cho
    • G11C8/10
    • G11C8/08G11C8/14G11C11/16G11C13/00G11C13/0004G11C13/0023G11C13/0028G11C2213/71G11C2213/72
    • A resistance semiconductor memory device of a three-dimensional stack structure, and a word line decoding method thereof, are provided. In the resistance semiconductor memory device of a three-dimensional stack structure, in which a plurality of word line layers and a plurality of bit line layers are disposed alternately and perpendicularly, and in which a plurality of memory cell layers are disposed between the word line layers and the bit line layers; the resistance semiconductor memory device includes a plurality of bit lines disposed on each of the bit line layers in a first direction as a length direction; a plurality of sub word lines disposed on each of the word line layers in a second direction as a length direction, intersected to the first direction; a plurality of memory cells disposed on the memory cell layers; and a plurality of main word lines individually disposed on a main word line layer specifically adapted over the bit line layers and the word line layers, in the second direction as a length direction, each one of the plurality of main word lines being shared by a predetermined number of sub word lines. An efficient word line decoding adequate to high integration can be achieved.
    • 提供三维堆栈结构的电阻半导体存储器件及其字线解码方法。 在三维堆叠结构的电阻半导体存储器件中,其中多个字线层和多个位线层交替和垂直地布置,并且其中多个存储单元层设置在字线 层和位线层; 电阻半导体存储器件包括沿着第一方向设置在每个位线层上的多个位线作为长度方向; 在与第一方向相交的长度方向的第二方向上配置在每个字线层上的多个子字线; 设置在所述存储单元层上的多个存储单元; 以及多个主字线分别设置在主字线层上,特别适用于位线层和字线层,在第二方向上作为长度方向,多个主字线中的每一条由 预定数量的子字线。 可以实现足够高集成度的有效的字线解码。
    • 9. 发明申请
    • SEMICONDUCTOR MEMORY DEVICES AND METHODS HAVING CORE STRUCTURES FOR MULTI-WRITING
    • 具有用于多写的核心结构的半导体存储器件和方法
    • US20090279351A1
    • 2009-11-12
    • US12437438
    • 2009-05-07
    • Joon Min ParkBeak Hyung Cho
    • Joon Min ParkBeak Hyung Cho
    • G11C11/00G11C8/00G11C7/00
    • G11C8/10G11C7/18G11C8/14G11C13/0004G11C13/0023G11C13/0026G11C13/0028G11C13/0069G11C2013/0088G11C2213/77
    • A semiconductor memory device having an efficient core structure for multi-writing includes a data input/output line, a plurality of memory banks each comprising a plurality of memory cells, a first global bit line and a second global bit line which are shared by the plurality of memory banks, and a first write driver and a second write driver which are connected with the data input/output line and provide a program current to the plurality of memory banks through the first and second global bit lines, respectively. Each memory bank includes a first cell area connected with the first global bit line and a second cell area connected with the second global bit line. In a multi-write mode, the first cell area in a first memory bank among the plurality of memory banks and the second cell area in a second memory bank among the plurality of memory banks are simultaneously selected and data is written to memory cells in the selected first and second cell areas, so that data writing time is reduced under the same conditions as a normal write mode.
    • 具有用于多次写入的有效核心结构的半导体存储器件包括数据输入/输出线,多个存储器组,每个存储器组包括多个存储器单元,第一全局位线和第二全局位线, 多个存储体,以及分别与数据输入/输出线连接并通过第一和第二全局位线向多个存储体提供编程电流的第一写入驱动器和第二写入驱动器。 每个存储体包括与第一全局位线连接的第一单元区域和与第二全局位线连接的第二单元区域。 在多写入模式中,同时选择多个存储体中的第一存储体中的第一单元区域和多个存储体之间的第二存储体中的第二单元区域,并将数据写入存储单元中的存储单元 选择的第一和第二单元区域,使得在与正常写入模式相同的条件下数据写入时间被减少。
    • 10. 发明授权
    • Semiconductor memory devices having core structures for multi-writing
    • 具有用于多写入的核心结构的半导体存储器件
    • US07936594B2
    • 2011-05-03
    • US12437438
    • 2009-05-07
    • Joon Min ParkBeak Hyung Cho
    • Joon Min ParkBeak Hyung Cho
    • G11C11/00
    • G11C8/10G11C7/18G11C8/14G11C13/0004G11C13/0023G11C13/0026G11C13/0028G11C13/0069G11C2013/0088G11C2213/77
    • A semiconductor memory device having an efficient core structure for multi-writing includes a data input/output line, a plurality of memory banks each comprising a plurality of memory cells, a first global bit line and a second global bit line which are shared by the plurality of memory banks, and a first write driver and a second write driver which are connected with the data input/output line and provide a program current to the plurality of memory banks through the first and second global bit lines, respectively. Each memory bank includes a first cell area connected with the first global bit line and a second cell area connected with the second global bit line. In a multi-write mode, the first cell area in a first memory bank among the plurality of memory banks and the second cell area in a second memory bank among the plurality of memory banks are simultaneously selected and data is written to memory cells in the selected first and second cell areas, so that data writing time is reduced under the same conditions as a normal write mode.
    • 具有用于多次写入的有效核心结构的半导体存储器件包括数据输入/输出线,多个存储器组,每个存储器组包括多个存储器单元,第一全局位线和第二全局位线, 多个存储体,以及分别与数据输入/输出线连接并通过第一和第二全局位线向多个存储体提供编程电流的第一写入驱动器和第二写入驱动器。 每个存储体包括与第一全局位线连接的第一单元区域和与第二全局位线连接的第二单元区域。 在多写入模式中,同时选择多个存储体中的第一存储体中的第一单元区域和多个存储体之间的第二存储体中的第二单元区域,并将数据写入存储单元中的存储单元 选择的第一和第二单元区域,使得在与正常写入模式相同的条件下数据写入时间被减少。