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1. 发明授权

US5705853A Power semiconductor module 失效
标题翻译：功率半导体模块
公开(公告)号：US5705853A
公开(公告)日：1998-01-06
申请号：US699430
申请日：1996-08-19
申请人： Kurt Faller , Toni Frey , Helmut Keser , Ferdinand Steinruck , Raymond Zehringer
发明人： Kurt Faller , Toni Frey , Helmut Keser , Ferdinand Steinruck , Raymond Zehringer
IPC分类号： H01L23/48 , H01L25/07 , H01L25/18 , H01L29/74 , H01L23/02 , H01L23/16
CPC分类号： H01L24/72 , H01L25/072 , H01L2224/48091 , H01L2224/48247 , H01L2924/01004 , H01L2924/01005 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01068 , H01L2924/01082 , H01L2924/13055
摘要： A power semiconductor module is specified in which at least one semiconductor chip, which is fitted on a baseplate, is made contact with by a respective contact plunger. The position of the contact plungers can be set individually in a manner corresponding to a distance between the semiconductor chips and a main connection which accommodates the contact plungers. The contact plungers are either subjected to pressure by means of a spring or fixed by means of a solder layer.
摘要翻译：规定了功率半导体模块，其中安装在基板上的至少一个半导体芯片通过相应的接触柱塞接触。接触柱塞的位置可以以对应于半导体芯片与容纳接触柱塞的主连接件之间的距离的方式单独设置。接触柱塞通过弹簧受到压力或通过焊料层固定。

2. 发明授权

US5978220A Liquid cooling device for a high-power semiconductor module 失效
标题翻译：用于大功率半导体模块的液体冷却装置
公开(公告)号：US5978220A
公开(公告)日：1999-11-02
申请号：US955094
申请日：1997-10-21
申请人： Toni Frey , Alexander Stuck , Raymond Zehringer
发明人： Toni Frey , Alexander Stuck , Raymond Zehringer
IPC分类号： H01L23/373 , H01L23/473 , H05K7/20
CPC分类号： H01L23/473 , H01L2924/0002
摘要： In a liquid cooling device (1) for a high-power semiconductor module (14), which contains a plurality of heat-generating submodules (8a-h) arranged next to one another on a cooling surface (3) and is fusion-bonded to the cooling surface (3), an improved load cycle resistance is achieved by the liquid cooling device (1) having a housing (2) which encloses a liquid space (4), through which a cooling liquid flows, and the upper side of which forms the cooling surface (3), and by the housing (2) of the liquid cooling device (1), at least in the region of the cooling surface (3), consisting of a metal-ceramic composite material, the coefficient of thermal expansion of which is adapted to the coefficient of thermal expansion of the ceramic substrates or of the power semiconductor devices of the submodules (8a-h) and, by additional means (11a-h; 12) for improving the heat transfer between the cooling surface (3) and the cooling liquid being provided in the liquid space (4) of the liquid cooling device (1).
摘要翻译：在用于大功率半导体模块（14）的液体冷却装置（1）中，其包含在冷却表面（3）上彼此相邻布置的多个发热子模块（8a-h），并且熔融粘合通过具有包围液体空间（4）的壳体（2）的液体冷却装置（1）到达冷却表面（3），通过冷却液流过的液体冷却装置（1）和至少在由金属 - 陶瓷复合材料构成的冷却表面（3）的区域中形成冷却表面（3）和液体冷却装置（1）的壳体（2），系数其热膨胀适应陶瓷衬底或子模块（8a-h）的功率半导体器件的热膨胀系数，并且通过附加装置（11a-h; 12）来改善冷却表面（3）和冷却液体设置在液体冷却液的液体空间（4）中 ng设备（1）。

3. 发明授权

US06320268B1 Power semiconductor module 有权
标题翻译：功率半导体模块
公开(公告)号：US06320268B1
公开(公告)日：2001-11-20
申请号：US09488835
申请日：2000-01-21
申请人： Thomas Lang , Benno Bucher , Toni Frey
发明人： Thomas Lang , Benno Bucher , Toni Frey
IPC分类号： H01L2348
CPC分类号： H01L24/72 , H01L24/01 , H01L25/072 , H01L2924/01004 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01068 , H01L2924/01082 , H01L2924/1305 , H01L2924/13055 , H01L2924/3011 , H01L2924/00
摘要： A power semiconductor module in which at least one semiconductor chip with which contact is made by pressure is electrically connected via a contact element to a main connection. The contact element has two planar contact surfaces, between which a spring element is located. Irrespective of the individual position and height of a chip, the respective spring element ensures a standard contact force. Overloading of the semiconductor chips when the module is being clamped in is prevented by ceramic supporting elements.
摘要翻译：一种功率半导体模块，其中至少一个通过压力制成接触的半导体芯片通过接触元件电连接到主连接。接触元件具有两个平面接触表面，弹簧元件之间位于该平面接触表面之间。不管芯片的单独位置和高度如何，相应的弹簧元件确保了标准的接触力。通过陶瓷支撑元件防止半导体芯片在夹紧模块时的过载。

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