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1. 发明申请

US20120160458A1 COOLER HAVING GROUND HEATED PLANE FOR COOLING HEATING ELECTRONIC COMPONENT 审中-公开
标题翻译：具有用于冷却加热电子部件的接地加热平板的冷却器
公开(公告)号：US20120160458A1
公开(公告)日：2012-06-28
申请号：US13409593
申请日：2012-03-01
申请人： Kuo-Len Lin , Chen-Hsiang Lin , Jui-Ho Liu , Chih-Hung Cheng , Ken Hsu
发明人： Kuo-Len Lin , Chen-Hsiang Lin , Jui-Ho Liu , Chih-Hung Cheng , Ken Hsu
IPC分类号： F28D15/04
CPC分类号： F28D15/0275 , B24B37/04 , B24B37/12 , B24B37/30 , B24B57/02 , F28D15/0233 , F28F13/182 , H01L23/427 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A method for making heated plane of a cooler to obtain better flatness and roughness includes a grinder with a grinding plate and a fixture. Then, the cooler is arranged onto the fixture. Next, the abrasive is injected into the gap between the grinding plate and the heated plane, making the fixture press and clamp the cooler in a way, such that the heated plane of the cooler contacts the abrasive closely. Finally, the grinding plate is rotated to make at least one grinding process to the heated plane, making the heated plane obtain a surface with better roughness and flatness, further enhancing the contact tightness between the heated plane and a heating element, and therefore promoting the thermally conductive efficiency between the cooler and the heating element.
摘要翻译：用于制造冷却器的加热平面以获得更好的平坦度和粗糙度的方法包括具有研磨板和夹具的研磨机。然后，将冷却器布置在固定装置上。接下来，研磨剂被注入到研磨板和加热平面之间的间隙中，使夹具以一定的方式压紧并夹紧冷却器，使得冷却器的加热平面与磨料紧密接触。最后，研磨板旋转，对被加热面进行至少一次研磨处理，使得加热面得到更好的粗糙度和平坦度的表面，进一步增强了加热面与加热元件之间的接触紧密度，从而促进了冷却器和加热元件之间的导热效率。

2. 发明授权

US08328601B2 Apparatus for grinding heated plane of cooler 失效
标题翻译：用于研磨冷却器加热平面的装置
公开(公告)号：US08328601B2
公开(公告)日：2012-12-11
申请号：US13409575
申请日：2012-03-01
申请人： Kuo-Len Lin , Chen-Hsiang Lin , Jui-Ho Liu , Chih-Hung Cheng , Ken Hsu
发明人： Kuo-Len Lin , Chen-Hsiang Lin , Jui-Ho Liu , Chih-Hung Cheng , Ken Hsu
IPC分类号： B24B1/00
CPC分类号： F28D15/0275 , B24B37/04 , B24B37/12 , B24B37/30 , B24B57/02 , F28D15/0233 , F28F13/182 , H01L23/427 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A method for making heated plane of a cooler to obtain better flatness and roughness includes a grinder with a grinding plate and a fixture. Then, the cooler is arranged onto the fixture. Next, the abrasive is injected into the gap between the grinding plate and the heated plane, making the fixture press and clamp the cooler in a way, such that the heated plane of the cooler contacts the abrasive closely. Finally, the grinding plate is rotated to make at least one grinding process to the heated plane, making the heated plane obtain a surface with better roughness and flatness, further enhancing the contact tightness between the heated plane and a heating element, and therefore promoting the thermally conductive efficiency between the cooler and the heating element.
摘要翻译：用于制造冷却器的加热平面以获得更好的平坦度和粗糙度的方法包括具有研磨板和夹具的研磨机。然后，将冷却器布置在固定装置上。接下来，研磨剂被注入到研磨板和加热平面之间的间隙中，使夹具以一定的方式压紧并夹紧冷却器，使得冷却器的加热平面与磨料紧密接触。最后，研磨板旋转，对被加热面进行至少一次研磨处理，使得加热面得到更好的粗糙度和平坦度的表面，进一步增强了加热面与加热元件之间的接触紧密度，从而促进了冷却器和加热元件之间的导热效率。

3. 发明申请

US20120276822A1 APPARATUS FOR GRINDING HEATED PLANE OF COOLER 失效
标题翻译：用于研磨加热的冷却机平面的装置
公开(公告)号：US20120276822A1
公开(公告)日：2012-11-01
申请号：US13409575
申请日：2012-03-01
申请人： Kuo-Len LIN , Chen-Hsiang Lin , Jui-Ho Liu , Chih-Hung Cheng , Ken Hsu
发明人： Kuo-Len LIN , Chen-Hsiang Lin , Jui-Ho Liu , Chih-Hung Cheng , Ken Hsu
IPC分类号： B24B19/00
CPC分类号： F28D15/0275 , B24B37/04 , B24B37/12 , B24B37/30 , B24B57/02 , F28D15/0233 , F28F13/182 , H01L23/427 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A method for making heated plane of a cooler to obtain better flatness and roughness includes a grinder with a grinding plate and a fixture. Then, the cooler is arranged onto the fixture. Next, the abrasive is injected into the gap between the grinding plate and the heated plane, making the fixture press and clamp the cooler in a way, such that the heated plane of the cooler contacts the abrasive closely. Finally, the grinding plate is rotated to make at least one grinding process to the heated plane, making the heated plane obtain a surface with better roughness and flatness, further enhancing the contact tightness between the heated plane and a heating element, and therefore promoting the thermally conductive efficiency between the cooler and the heating element.
摘要翻译：用于制造冷却器的加热平面以获得更好的平坦度和粗糙度的方法包括具有研磨板和夹具的研磨机。然后，将冷却器布置在固定装置上。接下来，研磨剂被注入到研磨板和加热平面之间的间隙中，使夹具以一定的方式压紧并夹紧冷却器，使得冷却器的加热平面与磨料紧密接触。最后，研磨板旋转，对被加热面进行至少一次研磨处理，使得加热面得到更好的粗糙度和平坦度的表面，进一步增强了加热面与加热元件之间的接触紧密度，从而促进了冷却器和加热元件之间的导热效率。

4. 发明授权

US08235768B2 Cooler with ground heated plane and grinding method and apparatus thereof 有权
标题翻译：具有地面加热平面的冷却器及其研磨方法和装置
公开(公告)号：US08235768B2
公开(公告)日：2012-08-07
申请号：US12482000
申请日：2009-06-10
申请人： Kuo-Len Lin , Chen-Hsiang Lin , Jui-Ho Liu , Chih-Hung Cheng , Ken Hsu
发明人： Kuo-Len Lin , Chen-Hsiang Lin , Jui-Ho Liu , Chih-Hung Cheng , Ken Hsu
IPC分类号： B24B1/00
CPC分类号： F28D15/0275 , B24B37/04 , B24B37/12 , B24B37/30 , B24B57/02 , F28D15/0233 , F28F13/182 , H01L23/427 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A method for making heated plane of a cooler obtain better flatness and roughness includes a grinder with a grinding plate and a fixture. Then, the cooler is arranged onto the fixture. Next, the abrasive is injected into the gap between the grinding plate and the heated plane, making the fixture press and clamp the cooler in a way, such that the heated plane of the cooler contacts the abrasive closely. Finally, the grinding plate is rotated to make at least one grinding process to the heated plane, making the heated plane obtain a surface with better roughness and flatness, further enhancing the contact tightness between the heated plane and a heating element, and therefore promoting the thermally conductive efficiency between the cooler and the heating element.
摘要翻译：制造冷却器的加热平面的方法获得更好的平整度和粗糙度的方法包括具有研磨板和夹具的研磨机。然后，将冷却器布置在固定装置上。接下来，研磨剂被注入到研磨板和加热平面之间的间隙中，使夹具以一定的方式压紧并夹紧冷却器，使得冷却器的加热平面与磨料紧密接触。最后，研磨板旋转，对被加热面进行至少一次研磨处理，使得加热面得到更好的粗糙度和平坦度的表面，进一步增强了加热面与加热元件之间的接触紧密度，从而促进了冷却器和加热元件之间的导热效率。

5. 发明申请

US20100294462A1 HEAT SINK AND HEAT-DISSIPATING FINS OF THE SAME 审中-公开
标题翻译：散热器和散热片
公开(公告)号：US20100294462A1
公开(公告)日：2010-11-25
申请号：US12468182
申请日：2009-05-19
申请人： Kuo-Len Lin , Chen-Hsiang Lin , Jui-Ho Liu , Chih-Hung Cheng , Ken Hsu
发明人： Kuo-Len Lin , Chen-Hsiang Lin , Jui-Ho Liu , Chih-Hung Cheng , Ken Hsu
IPC分类号： F28F13/00
CPC分类号： H01L23/3672 , F21V29/76 , F21V29/77 , F21V29/773 , F21V29/89 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A heat sink and heat-dissipating fins have wave-shaped folds. The heat sink includes a plurality of heat-dissipating fins that are radially connected together to form a ring. The inside of the heat-dissipating fins is formed with an accommodating space for allowing a heat-generating element to be disposed therein. The heat-dissipating fin is a metallic piece with its one side bent vertically to form a fold. The fold is bent continuously to form a wave shape. Via the wave-shaped folds, the user can grip the heat-dissipating fins easily. Further, the rigidness and strength of the fold can be increased.
摘要翻译：散热片和散热片有波浪形折叠。散热片包括径向连接在一起以形成环的多个散热片。散热翅片的内部形成有容纳空间，用于使发热元件设置在其中。散热翅片是金属片，其一侧垂直弯曲以形成折痕。折叠连续弯曲以形成波形。通过波形折叠，用户可以容易地抓住散热片。此外，折叠的刚性和强度可以增加。

6. 发明授权

US08341967B2 Heat-dissipating device for supplying cold airflow 失效
标题翻译：用于供应冷气流的散热装置
公开(公告)号：US08341967B2
公开(公告)日：2013-01-01
申请号：US12707805
申请日：2010-02-18
申请人： Chih-Hung Cheng , Ken Hsu , Chen-Hsiang Lin , Kuo-Len Lin
发明人： Chih-Hung Cheng , Ken Hsu , Chen-Hsiang Lin , Kuo-Len Lin
IPC分类号： F25B21/02
CPC分类号： H01L23/427 , F25B21/02 , F25B2321/0251 , H01L23/3675 , H01L23/38 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat-dissipating device (1) includes a casing (10) and a thermal insulation plate (20) provided within the casing (10). The thermal insulating plate (20) divides the interior of the casing (10) into a first accommodating space (101) and a second accommodating space (102). A hot air outlet (121) and a first air inlet (122) of the casing (10) are in communication with the first accommodating space (101). A cold air outlet (110) and a second air inlet (123) of the casing (10) are in communication with the second accommodating space (102). A thermoelectric cooling chip (30) is disposed in a through-hole (200) of the thermal insulation plate (20) and has a hot-end surface (31) facing the first accommodating space (101) and a cold-end surface (32) facing the second accommodating space (102). A heat-dissipating module (40) is received in the first accommodating space (101). A cold-airflow supplying module (50) is received in the second accommodating space (102). The heat generated by the hot-end surface (31) is dissipated to the hot air outlet (121) by the thermal conduction of the heat-dissipating module (40). The cold generated by the cold-end surface (32) is conducted and distributed uniformly by the cold-airflow supplying module (50) to the cold air outlet (110).
摘要翻译：散热装置（1）包括壳体（10）和设置在壳体（10）内的绝热板（20）。绝热板（20）将壳体（10）的内部分成第一容纳空间（101）和第二容纳空间（102）。所述壳体（10）的热风出口（121）和第一空气入口（122）与所述第一容纳空间（101）连通。壳体（10）的冷气出口（110）和第二空气入口（123）与第二容纳空间（102）连通。一个热电冷却芯片（30）设置在绝热板（20）的通孔（200）中并且具有面向第一容纳空间（101）的热端表面（31）和冷端表面 32）面向第二容纳空间（102）。散热模块（40）被容纳在第一容纳空间（101）中。冷气流供给模块（50）被容纳在第二容纳空间（102）中。热端面（31）产生的热量通过散热模块（40）的热传导而散热到热风出口（121）。由冷端表面32产生的冷由冷气流供给模块50均匀地传导并均匀地分配到冷气出口110。

7. 发明申请

US20110197598A1 Heat-Dissipating Device For Supplying Cold Airflow 失效
标题翻译：用于供应冷气流的散热装置
公开(公告)号：US20110197598A1
公开(公告)日：2011-08-18
申请号：US12707805
申请日：2010-02-18
申请人： Chih-Hung CHENG , Ken Hsu , Chen-Hsiang Lin , Kuo-Len Lin
发明人： Chih-Hung CHENG , Ken Hsu , Chen-Hsiang Lin , Kuo-Len Lin
IPC分类号： F25B21/02 , F28D15/00 , F28F1/20
CPC分类号： H01L23/427 , F25B21/02 , F25B2321/0251 , H01L23/3675 , H01L23/38 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat-dissipating device (1) includes a casing (10) and a thermal insulation plate (20) provided within the casing (10). The thermal insulating plate (20) divides the interior of the casing (10) into a first accommodating space (101) and a second accommodating space (102). A hot air outlet (121) and a first air inlet (122) of the casing (10) are in communication with the first accommodating space (101). A cold air outlet (110) and a second air inlet (123) of the casing (10) are in communication with the second accommodating space (102). A thermoelectric cooling chip (30) is disposed in a through-hole (200) of the thermal insulation plate (20) and has a hot-end surface (31) facing the first accommodating space (101) and a cold-end surface (32) facing the second accommodating space (102). A heat-dissipating module (40) is received in the first accommodating space (101). A cold-airflow supplying module (50) is received in the second accommodating space (102). The heat generated by the hot-end surface (31) is dissipated to the hot air outlet (121) by the thermal conduction of the heat-dissipating module (40). The cold generated by the cold-end surface (32) is conducted and distributed uniformly by the cold-airflow supplying module (50) to the cold air outlet (110).
摘要翻译：散热装置（1）包括壳体（10）和设置在壳体（10）内的绝热板（20）。绝热板（20）将壳体（10）的内部分成第一容纳空间（101）和第二容纳空间（102）。所述壳体（10）的热风出口（121）和第一空气入口（122）与所述第一容纳空间（101）连通。壳体（10）的冷气出口（110）和第二空气入口（123）与第二容纳空间（102）连通。一个热电冷却芯片（30）设置在绝热板（20）的通孔（200）中并且具有面向第一容纳空间（101）的热端表面（31）和冷端表面 32）面向第二容纳空间（102）。散热模块（40）被容纳在第一容纳空间（101）中。冷气流供给模块（50）被容纳在第二容纳空间（102）中。热端面（31）产生的热量通过散热模块（40）的热传导而散热到热风出口（121）。由冷端表面32产生的冷由冷气流供给模块50均匀地传导并均匀地分配到冷气出口110。

8. 发明申请

US20100288454A1 ADJUSTABLE PROP STAND OF WINDOW CURTAIN 审中-公开
标题翻译： WINDOW CURTAIN的可调节优点
公开(公告)号：US20100288454A1
公开(公告)日：2010-11-18
申请号：US12467621
申请日：2009-05-18
申请人： Kuo-Len LIN , Chen-Hsiang Lin , Mong-Hua Hung , Chih-Hung Cheng , Ken Hsu
发明人： Kuo-Len LIN , Chen-Hsiang Lin , Mong-Hua Hung , Chih-Hung Cheng , Ken Hsu
IPC分类号： A47H1/18
CPC分类号： A47H1/18 , A47H5/04 , B66F3/12
摘要： An adjusting structure of adjustable window curtain prop stand includes two prop plates and an adjusting structure arranged between the two prop plates. The adjusting structure further includes a lead screw, two displacing elements, two positioning elements and a plurality of connecting elements. The lead screw has two external threads respectively with different directions of spiral and available for being engaged with the two displacing elements thereon. The two positioning elements are respectively secured to inner side faces of the two prop plates to be located at an upper and a lower positions between the two displacing elements, where each connecting element is separately and actively connected between the two displacing elements and the two displacing elements, such that a linkage mechanism is formed by taking the two displacing elements as a gliding pair.
摘要翻译：可调式窗帘支架的调节结构包括两个支撑板和两个支撑板之间布置的调整结构。调节结构还包括导螺杆，两个移位元件，两个定位元件和多个连接元件。导螺杆具有分别具有不同方向的螺旋的两个外螺纹并且可用于与其上的两个移位元件接合。两个定位元件分别固定在两个支撑板的内侧面上，以位于两个位移元件之间的上部和下部位置处，其中每个连接元件分开并主动地连接在两个移位元件之间，两个位移元件使得通过将两个位移元件作为滑动对来形成连杆机构。

9. 发明授权

US07815347B2 LED lamp tube heat dissipating structure 有权
标题翻译： LED灯管散热结构
公开(公告)号：US07815347B2
公开(公告)日：2010-10-19
申请号：US12166591
申请日：2008-07-02
申请人： Kuo-Len Lin , Chen-Hsiang Lin , Wen-Jung Liu , Hwai-Ming Wang , Ken Hsu , Chih-Hung Cheng
发明人： Kuo-Len Lin , Chen-Hsiang Lin , Wen-Jung Liu , Hwai-Ming Wang , Ken Hsu , Chih-Hung Cheng
IPC分类号： F21V29/02
CPC分类号： F21V29/83 , F21K9/27 , F21K9/66 , F21S8/04 , F21V29/507 , F21V29/60 , F21Y2105/16 , F21Y2115/10
摘要： A light emitting diode (LED) lamp tube heat dissipating structure is capable of dissipating heat in a tube quickly to improve the heat dissipating efficiency. A circuit board with a light radiating surface and a heat dissipating surface is contained in the tube, and the light radiating surface of the circuit board is electrically connected to LED lamps. Two conductive bushings are sheathed onto both ends of the tube and electrically connected with the circuit board, and at least one heat dissipating hole is disposed separately on both distal surfaces of the tube that covers the heat dissipating surface of the circuit board, such that external air is entered into the tube from the heat dissipating hole on a distal surface of the tube and dispersed from the heat dissipating hole on another distal surface of the tube for dissipating the heat in the tube.
摘要翻译：发光二极管（LED）灯管散热结构能够快速散热管中的热量，从而提高散热效率。具有光辐射面和散热面的电路板被容纳在管中，并且电路板的光辐射表面电连接到LED灯。两个导电衬套被套在管的两端并与电路板电连接，并且至少一个散热孔分别设置在管的两个远端表面上，该远端表面覆盖电路板的散热表面，使得外部空气从管的远端表面上的散热孔进入管中，并从管的另一远端表面上的散热孔分散，以消散管中的热量。

10. 发明授权

US07594738B1 LED lamp with replaceable power supply 有权
标题翻译： LED灯具可更换电源
公开(公告)号：US07594738B1
公开(公告)日：2009-09-29
申请号：US12166560
申请日：2008-07-02
申请人： Kuo-Len Lin , Chen-Hsiang Lin , Wen-Jung Liu , Hwai-Ming Wang , Ken Hsu , Chih-Hung Cheng
发明人： Kuo-Len Lin , Chen-Hsiang Lin , Wen-Jung Liu , Hwai-Ming Wang , Ken Hsu , Chih-Hung Cheng
IPC分类号： F21V33/00
CPC分类号： F21V23/06 , F21K9/27 , F21V19/0085 , F21V23/006 , F21V29/506 , F21V29/83 , F21Y2103/10 , F21Y2115/10 , Y10S362/80
摘要： An LED lamp with replaceable power supply includes a tubular body, a light module, a power supply, and two power connectors. The light module is disposed within the tubular body. The light module includes a circuit board and a plurality of LEDs. The LEDs are electrically coupled to the circuit board and are disposed on the bottom side of the circuit board. The power supply is replaceably disposed on the light module and is electrically coupled to the circuit board. The two power connectors are respectively coupled to the two ends of the tubular body and are electrically coupled to the power supply.
摘要翻译：具有可替换电源的LED灯包括管状体，光模块，电源和两个电源连接器。灯模块设置在管状体内。光模块包括电路板和多个LED。 LED电耦合到电路板并且设置在电路板的底侧。电源可替换地设置在光模块上并且电耦合到电路板。两个电源连接器分别耦合到管状体的两端并电耦合到电源。

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