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1. 发明申请

US20110101405A1 LIGHT-EMITTING DIODE PACKAGE 有权
标题翻译：发光二极管封装
公开(公告)号：US20110101405A1
公开(公告)日：2011-05-05
申请号：US12613003
申请日：2009-11-05
申请人： Kuo-Ching CHANG , Wu-Cheng KUO , Tzu-Han LIN
发明人： Kuo-Ching CHANG , Wu-Cheng KUO , Tzu-Han LIN
IPC分类号： H01L33/00
CPC分类号： H01L33/62 , H01L24/32 , H01L24/48 , H01L24/49 , H01L24/83 , H01L24/85 , H01L33/486 , H01L2224/05554 , H01L2224/29111 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/49113 , H01L2224/73265 , H01L2224/83815 , H01L2224/85439 , H01L2224/85444 , H01L2224/92247 , H01L2924/00014 , H01L2924/01004 , H01L2924/01006 , H01L2924/01013 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/12041 , H01L2924/15153 , H01L2924/157 , H01L2924/15747 , H01L2924/15787 , H01L2924/1579 , H01L2924/00 , H01L2924/00012 , H01L2924/00015 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A light-emitting diode package is provided. The light-emitting diode package comprises a substrate and a first metal layer disposed over the substrate. A solder layer is disposed on the first metal layer and a light-emitting diode chip is disposed on the solder layer, wherein the light-emitting diode chip comprises a conductive substrate and a multilayered epitaxial structure formed on the conductive substrate, and wherein the conductive substrate is adjacent to the solder layer.
摘要翻译：提供了一种发光二极管封装。发光二极管封装包括衬底和设置在衬底上的第一金属层。焊料层设置在第一金属层上，并且发光二极管芯片设置在焊料层上，其中发光二极管芯片包括形成在导电衬底上的导电衬底和多层外延结构，并且其中导电衬底与焊料层相邻。

2. 发明申请

US20100127288A1 LIGHT-EMITTING DIODE DEVICES AND METHODS FOR FABRICATING THE SAME 审中-公开
标题翻译：发光二极管器件及其制造方法
公开(公告)号：US20100127288A1
公开(公告)日：2010-05-27
申请号：US12323094
申请日：2008-11-25
申请人： Wu-Cheng KUO , Tzu-Han Lin
发明人： Wu-Cheng KUO , Tzu-Han Lin
IPC分类号： H01L33/00
CPC分类号： H01L33/483 , H01L33/54 , H01L2224/48091 , H01L2224/49107 , H01L2933/005 , H01L2924/00014
摘要： An LED device including a support structure with at least one LED die mounted thereon, a recess formed in a part of the support structure from a side of the LED die, and a lens formed over the support structure to encapsulate the LED die and the recess, thereby forming a protrusion in the support structure is disclosed.
摘要翻译：一种LED装置，包括具有安装在其上的至少一个LED管芯的支撑结构，从所述LED管芯的一侧形成在所述支撑结构的一部分中的凹部，以及形成在所述支撑结构上的透镜，以封装所述LED管芯和所述凹部从而在支撑结构中形成突起。

3. 发明申请

US20100237379A1 LIGHT EMITTING DEVICE 审中-公开
标题翻译：发光装置
公开(公告)号：US20100237379A1
公开(公告)日：2010-09-23
申请号：US12407385
申请日：2009-03-19
申请人： Wu-Cheng KUO , Jui-Ping Weng , Tzu-Han Lin
发明人： Wu-Cheng KUO , Jui-Ping Weng , Tzu-Han Lin
IPC分类号： H01L33/00
CPC分类号： H01L33/486 , H01L33/62 , H01L2924/0002 , H01L2924/00
摘要： An embodiment of the invention provides a light emitting device, which includes: a first substrate made of a semiconductor material or a ceramic material; a first hole having extending direction from a first side toward an opposite second side and from a first surface toward an opposite second surface of the first substrate; a second hole having extending direction from the first side toward the second side and from the first surface toward the second surface; a light emitting element disposed overlying the first surface and having a first electrode and a second electrode; a first conducting layer overlying a first sidewall of the first hole and electrically connected to the first electrode; and a second conducting layer overlying a second sidewall of the second hole and electrically connected to the second electrode.
摘要翻译：本发明的实施例提供了一种发光器件，其包括：由半导体材料或陶瓷材料制成的第一衬底; 第一孔，其具有从第一侧朝向相反的第二侧的延伸方向以及从第一基板的第一表面朝向相反的第二表面; 第二孔，从第一侧向第二侧延伸，从第一面向第二面延伸; 设置在所述第一表面上并具有第一电极和第二电极的发光元件; 覆盖所述第一孔的第一侧壁并电连接到所述第一电极的第一导电层; 以及覆盖所述第二孔的第二侧壁并电连接到所述第二电极的第二导电层。

4. 发明申请

US20120248473A1 LIGHT EMITTING SEMICONDUCTOR STRUCTURE 有权
标题翻译：发光二极管结构
公开(公告)号：US20120248473A1
公开(公告)日：2012-10-04
申请号：US13078541
申请日：2011-04-01
申请人： Wu-Cheng KUO
发明人： Wu-Cheng KUO
IPC分类号： H01L33/08
CPC分类号： H01L33/62 , H01L25/0756 , H01L2224/73265 , H01L2224/48091 , H01L2924/00014
摘要： The invention provides a light emitting semiconductor structure, which includes a substrate; a first LED chip formed on the substrate; an adhesion layer formed on the first LED chip; and a second light emitting diode chip formed on the adhesion layer, wherein the second LED chip has a first conductive wire which is electrically connected to the substrate.
摘要翻译：本发明提供一种发光半导体结构，其包括基板; 形成在基板上的第一LED芯片; 形成在第一LED芯片上的粘附层; 以及形成在所述粘合层上的第二发光二极管芯片，其中所述第二LED芯片具有电连接到所述基板的第一导线。

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