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    • 1. 发明授权
    • Transfer paper for electrophotography and process for producing the same
    • 用于电子照相的转印纸及其制造方法
    • US5662995A
    • 1997-09-02
    • US497739
    • 1995-07-03
    • Kunio SakuraiTsukasa MatsudaKyoko InoueHarumi WatanabeMasaru Kato
    • Kunio SakuraiTsukasa MatsudaKyoko InoueHarumi WatanabeMasaru Kato
    • D21H19/70G03G7/00B32B3/26
    • G03G7/0013D21H19/70G03G7/0006Y10T428/24802Y10T428/24934Y10T428/249953Y10T428/25Y10T428/27Y10T428/277Y10T428/31Y10T428/31993
    • Transfer paper for electrophotography of the present invention includes base paper; and a coating layer provided on at least one side of the base paper. The coating layer includes a pigment and a binder, has a solids content in the range of 2 to 10 g/m.sup.2, and has void-free areas containing no voids having a circle-equivalent diameter of equal to or more than 1 .mu.m and void area containing voids whose circle-equivalent diameter is equal to or more than 1 .mu.m. A proportion of void areas whose equivalent circle diameter is more than 20 .mu.m is not more than 2%, and the average equivalent circle diameter of the void areas and that of the void-free areas as observed on the surface of the coating layer satisfy at least one of the following conditions: (1) the average equivalent circle diameter of the void areas and that of the void-free areas are each from 1.5 to 10 .mu.m; (2) the average equivalent circle diameter of the void areas and that of the void-free areas are each 0.2 to 1.5 times the volume average particle size of the toner used for image formation; and (3) the average equivalent circle diameter of the void areas is from 1.0 to 10.0 .mu.m and that of the void-free area is from 1.5 to 10 .mu.m.
    • 本发明的电子照相用转印纸包括原纸; 以及设置在原纸的至少一侧上的涂层。 涂层包括颜料和粘合剂,其固体含量在2至10g / m 2的范围内,并且具有不含圆当量直径等于或大于1μm的空隙的无空隙区域,以及 空心面积为圆当量直径等于或大于1μm的空隙。 当量圆直径大于20μm的空隙区域的比例不超过2%,在涂层表面观察到的空隙区域和无空隙区域的平均当量圆直径满足 以下条件中的至少一个:(1)空隙区域的平均当量圆直径和无空隙面积的平均当量圆直径分别为1.5至10μm; (2)空隙区域和无空隙区域的平均当量圆直径分别为图像形成用调色剂的体积平均粒径的0.2〜1.5倍。 (3)空隙面积的平均当量圆直径为1.0〜10.0μm,无空隙面积为1.5〜10μm。
    • 6. 发明授权
    • Plasma enhanced atomic layer deposition system and method
    • 等离子体增强原子层沉积系统和方法
    • US08486845B2
    • 2013-07-16
    • US11084024
    • 2005-03-21
    • Tsukasa Matsuda
    • Tsukasa Matsuda
    • H01L21/31H01L21/469
    • C23C16/45544C23C16/4554C23C16/515H01J37/32009H01J37/32532H01L21/28562
    • A method for depositing a film on a substrate using a plasma enhanced atomic layer deposition (PEALD) process includes disposing the substrate in a process chamber configured to facilitate the PEALD process, introducing a first process material within the process chamber and introducing a second process material within the process chamber. Also included is coupling electromagnetic power to the process chamber during introduction of the second process material in order to generate a plasma that facilitates a reduction reaction between the first and second process materials at a surface of the substrate. A reactive gas is introduced within the process chamber, the reactive gas chemically reacting with contaminants in the process chamber to release the contaminants from at least one of a process chamber component or the substrate.
    • 使用等离子体增强原子层沉积(PEALD)工艺在衬底上沉积膜的方法包括将衬底布置在处理室中,该处理室被配置为便于PEALD工艺,在处理室内引入第一工艺材料并引入第二工艺材料 在处理室内。 还包括在引入第二工艺材料期间将电磁功率耦合到处理室,以便产生促进第一和第二工艺材料在衬底表面处的还原反应的等离子体。 反应性气体被引入处理室内,反应气体与处理室中的污染物质化学反应以从处理室组件或衬底中的至少一个释放污染物。
    • 10. 发明授权
    • Method and system for forming a variable thickness seed layer
    • 用于形成可变厚度种子层的方法和系统
    • US07351285B2
    • 2008-04-01
    • US11092266
    • 2005-03-29
    • Tsukasa Matsuda
    • Tsukasa Matsuda
    • C30B23/00C23C16/00B05D3/00
    • C23C16/18C23C16/16H01L21/28556H01L21/76868H01L21/76873
    • A method and system for forming a variable thickness seed layer on a substrate for a subsequent metal electrochemical plating process, where the seed layer thickness profile improves uniformity of the electroplated metal layer compared to when using a constant thickness seed layer. The method includes providing a substrate in a process chamber containing a showerhead, with the center of the substrate generally aligned with an inner gas delivery zone of the showerhead and the edge of the substrate generally aligned with an outer gas delivery zone of the showerhead. The method further includes depositing a seed layer on the substrate by exposing the substrate to a first gas containing a metal-containing precursor flowed through the inner gas delivery zone, and exposing the substrate to a second gas flowed through the outer gas delivery zone, whereby the seed layer is deposited with a thickness at the edge of the substrate that is less than the thickness at the center of the substrate.
    • 一种用于在随后的金属电化学电镀工艺的衬底上形成可变厚度籽晶层的方法和系统,其中与使用恒定厚度的种子层相比,种子层厚度分布改善了电镀金属层的均匀性。 该方法包括在包含喷头的处理室中提供衬底,其中衬底的中心大致与喷头的内部气体输送区域对准,并且衬底的边缘与喷头的外部气体输送区域大致对准。 该方法还包括通过将衬底暴露于含有流过内部气体输送区的含金属前体的第一气体,并将衬底暴露于流过外部气体输送区的第二气体,从而将衬底层沉积在衬底上,由此 籽晶层在衬底的边缘处被沉积成小于衬底中心的厚度。