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1. 发明授权

US07359763B2 Cutting tool angle adjustment method 有权
标题翻译：切削刀具角度调整方法
公开(公告)号：US07359763B2
公开(公告)日：2008-04-15
申请号：US11010336
申请日：2004-12-14
申请人： Kuei-Jung Chen , Sin-Len Tan , Chih-Yi Lai , Meng-Chun Chen
发明人： Kuei-Jung Chen , Sin-Len Tan , Chih-Yi Lai , Meng-Chun Chen
IPC分类号： G06F19/00 , B23Q15/00 , G06K9/00
CPC分类号： G05B19/4015 , G05B2219/37208 , G05B2219/45031 , G05B2219/45212 , G05B2219/50057 , G05B2219/50074 , Y10T83/148
摘要： A cutting tool adjustment method includes lowering a cutting tool on a transparent Mylar to produce an indentation before an actual scribing operation; picking up the image of the indentation; using a numerical analysis method and a set formula to automatically calculate a correction angle and position so as to adjust the angle and position of the cutting tool subject to the calculation result; and repeating the calculation and adjustment procedures, if necessary.
摘要翻译：切割工具调整方法包括：在实际的划线操作之前，将透明聚酯薄膜上的切割工具降低以产生压痕; 拿起压痕的形象; 使用数值分析方法和设定公式自动计算校正角度和位置，以便根据计算结果调整切割刀具的角度和位置; 并在必要时重复计算和调整程序。

2. 发明申请

US20060036337A1 Cutting tool angle adjustment method 有权
标题翻译：切削刀具角度调整方法
公开(公告)号：US20060036337A1
公开(公告)日：2006-02-16
申请号：US11010336
申请日：2004-12-14
申请人： Kuei-Jung Chen , Sin-Len Tan , Chih-Yi Lai , Meng-Chun Chen
发明人： Kuei-Jung Chen , Sin-Len Tan , Chih-Yi Lai , Meng-Chun Chen
IPC分类号： G05B19/18 , G05B11/32 , G06F19/00
CPC分类号： G05B19/4015 , G05B2219/37208 , G05B2219/45031 , G05B2219/45212 , G05B2219/50057 , G05B2219/50074 , Y10T83/148
摘要： A cutting tool adjustment method is disclosed to lower a cutting tool on a transparent Mylar to produce an indentation before actual scribing operation, and then to pick up the image of the indentation, and then to use a numerical analysis method and the set formula to automatically calculate the correction angle and position and to adjust the angle and position of the cutting tool subject to the calculation result, and then to repeat the calculation and adjustment procedure if necessary. Thus, the cutting tool and its cutting edge can be accurately adjusted to the correct angle and position to obtain a precise indentation. Further, by means of the automatic adjustment procedure, the present invention saves much adjusting time, thereby improving the productivity.
摘要翻译：公开了一种切割工具调整方法，以降低透明聚酯薄膜上的切割工具，以在实际划线操作之前产生凹痕，然后拾取凹痕的图像，然后使用数字分析方法和设定公式自动计算校正角度和位置，并根据计算结果调整切削刀具的角度和位置，然后根据需要重复计算和调整步骤。因此，可以将切削刀具及其切削刃精确地调节到正确的角度和位置，以获得精确的压痕。此外，通过自动调整程序，本发明节省了大量的调整时间，从而提高了生产率。

3. 发明授权

US06932259B2 Brittle material breaking apparatus 有权
公开(公告)号：US06932259B2
公开(公告)日：2005-08-23
申请号：US10782913
申请日：2004-02-23
申请人： Kuei-Jung Chen , Meng-Chun Chen , Chih-Ming Chen , Chih-Yi Lai
发明人： Kuei-Jung Chen , Meng-Chun Chen , Chih-Ming Chen , Chih-Yi Lai
IPC分类号： B26F3/00 , B26F3/02 , H01L21/00
CPC分类号： H01L21/67092 , B26F3/002 , Y10T225/325 , Y10T225/371 , Y10T225/379 , Y10T225/386
摘要： A brittle material breaking apparatus using a lifting mechanism to lift/lower a carrier wherein the lifting mechanism is controlled to lift the carrier for holding the brittle material for breaking, and then to lower the carrier from the brittle material to a distance for enabling the brittle material to be shifted to a next scribe line for further breaking, preventing the occurrence of friction between the brittle material and the carrier and the production of static electricity and micro particles and, improving the breaking quality. The brittle material breaking apparatus further includes a stroke fine adjustment mechanism adapted to adjust the stroke of the breaking-cutter relative to the brittle material.

4. 发明授权

US06782883B2 Cutting device for breaking fragile materials such as semiconductor wafers or the like 失效
公开(公告)号：US06782883B2
公开(公告)日：2004-08-31
申请号：US10358251
申请日：2003-02-05
申请人： Kuei-Jung Chen , Meng-Chun Chen , Chih-Yi Lai
发明人： Kuei-Jung Chen , Meng-Chun Chen , Chih-Yi Lai
IPC分类号： B28D132
CPC分类号： H01L21/67092 , B28D5/0011 , Y10T83/929
摘要： A cutting device for breaking fragile materials is constructed to include a lifting mechanism adapted to move the cutter vertically, a rotary table adapted to control the cutting angle of the cutter on the workpiece, a feed mechanism adapted to control the federate of the cutter, and a rotary mechanism adapted to rotate the cutter for enabling the cutter to cut the workpiece with one of multiple cutting points thereof selectively.

5. 发明申请

US20050121486A1 Brittle material breaking apparatus 有权
标题翻译：脆性材料破碎装置
公开(公告)号：US20050121486A1
公开(公告)日：2005-06-09
申请号：US10782913
申请日：2004-02-23
申请人： Kuei-Jung Chen , Meng-Chun Chen , Chih-Ming Chen , Chih-Yi Lai
发明人： Kuei-Jung Chen , Meng-Chun Chen , Chih-Ming Chen , Chih-Yi Lai
IPC分类号： B26F3/00 , B26F3/02 , H01L21/00
CPC分类号： H01L21/67092 , B26F3/002 , Y10T225/325 , Y10T225/371 , Y10T225/379 , Y10T225/386
摘要： A brittle material breaking apparatus using a lifting mechanism to lift/lower a carrier wherein the lifting mechanism is controlled to lift the carrier for holding the brittle material for breaking, and then to lower the carrier from the brittle material to a distance for enabling the brittle material to be shifted to a next scribe line for further breaking, preventing the occurrence of friction between the brittle material and the carrier and the production of static electricity and micro particles and, improving the breaking quality. The brittle material breaking apparatus further includes a stroke fine adjustment mechanism adapted to adjust the stroke of the breaking-cutter relative to the brittle material.
摘要翻译：一种使用提升机构来提升/降低载体的脆性材料断开装置，其中提升机构被控制以提升载体以保持用于断裂的脆性材料，然后将载体从脆性材料降低到一定距离，以使脆性要转移到下一划线以进一步断裂的材料，防止脆性材料和载体之间的摩擦发生，并产生静电和微粒，并提高断裂质量。脆性材料破碎装置还包括行程微调机构，该机构适于相对于脆性材料调节断刀的行程。

6. 发明授权

US08204257B2 System and method for increasing ring tone volume 有权
标题翻译：增加铃声音量的系统和方法
公开(公告)号：US08204257B2
公开(公告)日：2012-06-19
申请号：US12147517
申请日：2008-06-27
申请人： Meng-Chun Chen
发明人： Meng-Chun Chen
IPC分类号： H03G3/00
CPC分类号： H04M19/04
摘要： A method for increasing ring tone volume is provided. The method includes steps of: reading an audio file which is set as a current ring tone; determining whether the ring tone is a MP3 audio file or a musical instrument digital interface (MIDI) audio file; adjusting frequencies by using an equalizer technique to increase volume of the ring tone if the ring tone is the MP3 audio file; adjusting a volume level of the ring tone to be the highest volume level, and adjusting timbre of the ring tone to increase the ring tone volume by simulating a musical score of the ring tone by using different instruments if the ring tone is the MIDI audio file. A related system is also provided.
摘要翻译：提供了增加铃声音量的方法。该方法包括以下步骤：读取被设置为当前铃音的音频文件; 确定铃声是MP3音频文件还是乐器数字接口（MIDI）音频文件; 如果铃声是MP3音频文件，则使用均衡器技术来调整频率以增加铃声的音量; 将铃声的音量调整为最高音量，并且如果铃声是MIDI音频文件，则通过使用不同的乐器来模拟铃声的乐谱来调整铃音的音色以增加铃声音量。还提供了相关系统。

7. 发明申请

US20090010479A1 Portable electronic device with movable speaker device 有权
标题翻译：带移动扬声器装置的便携式电子装置
公开(公告)号：US20090010479A1
公开(公告)日：2009-01-08
申请号：US11953710
申请日：2007-12-10
申请人： Meng-Chun Chen
发明人： Meng-Chun Chen
IPC分类号： H04R1/02
CPC分类号： H04M1/03 , H04M1/0235 , H04M1/605 , H04M1/72558
摘要： A portable electronic device (100) includes a main body (10) having at least one cavity (131) defined therein, at least one speaker device (20) being movable received in the cavity of the main body, and at least one latching mechanism (30) movably attached to the main body. The speaker device has a resonant chamber (28) defined therein, and a positioning stop member (262) extending therefrom. Each resonant chamber communicates with a corresponding cavity. The at least one latching mechanism includes a latching body (31), and the latching body is configured for selectably engaging with the positioning stop member to enable control of movement of a corresponding speaker device relative to the main body.
摘要翻译：便携式电子设备（100）包括具有限定在其中的至少一个空腔（131）的主体（10），可移动地容纳在主体的空腔中的至少一个扬声器装置（20）和至少一个闩锁机构（30）可移动地附接到主体。扬声器装置具有限定在其中的谐振室（28）和从其延伸的定位停止构件（262）。每个谐振室与相应的腔连通。所述至少一个闩锁机构包括闩锁体（31），并且所述闩锁体构造成可选择地与所述定位止动构件接合，以能够控制相应的扬声器装置相对于所述主体的运动。

8. 发明授权

US5878911A Solder-ball supplying apparatus 失效
标题翻译：焊球供给装置
公开(公告)号：US5878911A
公开(公告)日：1999-03-09
申请号：US881900
申请日：1997-06-23
申请人： Ching-Lin Lin , Meng-Chun Chen , Chen-Chung Du , Jing-Ching Lin , Chyi-Liou Lin
发明人： Ching-Lin Lin , Meng-Chun Chen , Chen-Chung Du , Jing-Ching Lin , Chyi-Liou Lin
IPC分类号： B23K3/06 , H05K3/34 , B65G59/00
CPC分类号： B23K3/0623 , B23K2201/40 , H05K3/3478
摘要： A solder-ball supplying apparatus for a ball-grid array (BGA) IC packaging process is provided, which can supply solder balls of diameters from 0.5 mm to 1.0 mm at a preset amount to a solder-ball implanting machine. The solder-ball supplying apparatus is fully automated, in which vacuum means is used to suck out a preset amount of solder balls from a storage tank that are to be supplied. Rotary pneumatic cylinder means in conjunction with valve means are used to control the conveyance of the solder balls to the container. This solder-ball supplying apparatus can supply solder balls fast and in a non-contact manner that can prevent damage to the solder balls being supplied. It is fully automated so that manual labor is reduced and the quality of the solder balls being supplied can be assured.
摘要翻译：提供了一种用于球栅阵列（BGA）IC封装工艺的焊球提供装置，其可以将预定量的直径为0.5mm至1.0mm的焊球提供给焊球注入机。焊球供给装置是完全自动化的，其中使用真空装置从要供应的储罐中抽出预定量的焊球。旋转气缸装置结合阀装置用于控制焊球向容器的传送。该焊球供给装置能够以非接触的方式快速地供给焊球，能够防止对所供给的焊球的损坏。它完全自动化，从而减少手工劳动，并且可以确保供应的焊球的质量。

9. 发明授权

US5704536A Automatic ball placing device 失效
标题翻译：自动球放置装置
公开(公告)号：US5704536A
公开(公告)日：1998-01-06
申请号：US615556
申请日：1996-03-12
申请人： Meng-Chun Chen , Weng-Jung Lu
发明人： Meng-Chun Chen , Weng-Jung Lu
IPC分类号： B23K3/06 , H05K3/34 , H05K3/30
CPC分类号： B23K3/0623 , B23K2201/40 , H05K3/3478
摘要： An automatic ball placing device can automatically attach the solder ball to the pad of BGA's (Ball Grid Array) substrate. It comprises mainly a BGA substrate fixing device, a stencil fixing seat at least, a horizontal driving device, a vertical driving device and a swinging device. The BGA substrate possesses multiple stencil. The horizontal driving device and the vertical driving device can drive the said BGA substrate fixing device to perform horizontal and vertical movement respectively so as to move the BGA substrate to the position below the stencil fixing seat and thereby, make the solder balls drop into the mesh of the stencil which facilitates the solder balls to attach to the pad of BGA's substrate.
摘要翻译：自动球放置装置可以自动将焊球附着到BGA（球栅阵列）基板的焊盘上。其主要包括BGA基板固定装置，至少一个模板固定座，水平驱动装置，垂直驱动装置和摆动装置。 BGA衬底具有多个模板。水平驱动装置和垂直驱动装置可以驱动所述BGA基板固定装置分别进行水平和垂直移动，以便将BGA基板移动到模板固定座下方的位置，从而使焊球落入网格中的模板，其有助于焊球附着到BGA衬底的焊盘。

10. 发明授权

US07930005B2 Housing and portable electronic device using same 有权
标题翻译：外壳和便携式电子设备使用相同
公开(公告)号：US07930005B2
公开(公告)日：2011-04-19
申请号：US11967050
申请日：2007-12-29
申请人： Meng-Chun Chen
发明人： Meng-Chun Chen
IPC分类号： H04M1/00 , H04B1/38
CPC分类号： H04M1/035
摘要： A portable electronic device (100) includes a body (10) and a housing (30). The body has a speaker (20) and a groove (13). The speaker is received in the groove. The housing defines at least one main hole (34) and two subsidiary holes (35). The subsidiary holes is disposed adjacent to the at least one main hole.
摘要翻译：便携式电子设备（100）包括主体（10）和壳体（30）。主体具有扬声器（20）和凹槽（13）。扬声器被接收在凹槽中。壳体限定至少一个主孔（34）和两个辅助孔（35）。附属孔邻近至少一个主孔设置。

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