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    • 4. 发明授权
    • Semiconductor device and method for manufacturing the same
    • 半导体装置及其制造方法
    • US08759186B2
    • 2014-06-24
    • US13354334
    • 2012-01-20
    • Yung-Hui YehChih-Ming Lai
    • Yung-Hui YehChih-Ming Lai
    • H01L33/08
    • H01L29/7869H01L27/1225H01L27/1248H01L29/66969
    • A method for manufacturing a semiconductor device includes forming a metal oxide semiconductor layer and a first insulating layer on a substrate. A gate is formed on the first insulating layer. The first insulating layer is patterned by using the gate as an etching mask so as to expose the metal oxide semiconductor layer to serve as a source region and a drain region. A dielectric layer is formed on the substrate to cover the gate and the oxide semiconductor layer, where the dielectric layer has at least one of hydrogen group and hydroxyl group. A heating treatment is performed so that the at least one of hydrogen group and hydroxyl group reacts with the source region and the drain region. A source electrode and a drain electrode electrically connected to the source region and the drain region respectively are formed on the dielectric layer.
    • 一种制造半导体器件的方法包括在衬底上形成金属氧化物半导体层和第一绝缘层。 在第一绝缘层上形成栅极。 通过使用栅极作为蚀刻掩模来对第一绝缘层进行构图,以使金属氧化物半导体层暴露于源极区和漏极区。 在基板上形成介电层以覆盖栅极和氧化物半导体层,其中电介质层具有氢基和羟基中的至少一个。 进行加热处理,使得氢基和羟基中的至少一个与源极区和漏极区反应。 在电介质层上分别形成与源极区域和漏极区域电连接的源极电极和漏极电极。
    • 6. 发明申请
    • SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
    • 半导体器件及其制造方法
    • US20130126859A1
    • 2013-05-23
    • US13354334
    • 2012-01-20
    • Yung-Hui YehChih-Ming Lai
    • Yung-Hui YehChih-Ming Lai
    • H01L33/08H01L33/44
    • H01L29/7869H01L27/1225H01L27/1248H01L29/66969
    • A method for manufacturing a semiconductor device includes forming a metal oxide semiconductor layer and a first insulating layer on a substrate. A gate is formed on the first insulating layer. The first insulating layer is patterned by using the gate as an etching mask so as to expose the metal oxide semiconductor layer to serve as a source region and a drain region. A dielectric layer is formed on the substrate to cover the gate and the oxide semiconductor layer, where the dielectric layer has at least one of hydrogen group and hydroxyl group. A heating treatment is performed so that the at least one of hydrogen group and hydroxyl group reacts with the source region and the drain region. A source electrode and a drain electrode electrically connected to the source region and the drain region respectively are formed on the dielectric layer.
    • 一种制造半导体器件的方法包括在衬底上形成金属氧化物半导体层和第一绝缘层。 在第一绝缘层上形成栅极。 通过使用栅极作为蚀刻掩模来对第一绝缘层进行构图,以使金属氧化物半导体层暴露于源极区和漏极区。 在基板上形成介电层以覆盖栅极和氧化物半导体层,其中电介质层具有氢基和羟基中的至少一个。 进行加热处理,使得氢基和羟基中的至少一个与源极区和漏极区反应。 在电介质层上分别形成与源极区域和漏极区域电连接的源极电极和漏极电极。
    • 8. 发明授权
    • Lens and illumination device having same
    • 透镜和具有相同的照明装置
    • US08337053B2
    • 2012-12-25
    • US12795821
    • 2010-06-08
    • Tien-Pao ChenChih-Ming Lai
    • Tien-Pao ChenChih-Ming Lai
    • F21V3/00
    • F21V5/04F21V5/08F21W2131/103F21Y2115/10G02B19/0014G02B19/0061
    • A lens applied to a light emitting element includes a first surface profile and a second surface profile opposite to the first surface profile. The first surface profile defines a first trench facing the light emitting element, and the first trench includes a bottom curved surface serving as a light incident surface. The second surface profile includes a top curved surface, and serves as a light emitting surface. Both the bottom and the top curved surfaces are mirror symmetric to the first suppositional plane P1 (X=0), and mirror asymmetric to the second suppositional plane P2 (Y=0) to cooperatively adjust light from the light emitting element to obtain an asymmetric light field. An illumination device having the lens is further provided.
    • 应用于发光元件的透镜包括第一表面轮廓和与第一表面轮廓相对的第二表面轮廓。 第一表面轮廓限定面向发光元件的第一沟槽,并且第一沟槽包括用作光入射表面的底部弯曲表面。 第二表面轮廓包括顶部曲面,并且用作发光表面。 底部和顶部曲面都与第一假想平面P1(X = 0)镜面对称,并且镜子不对称于第二假想平面P2(Y = 0),以协调地调节来自发光元件的光以获得不对称 光场。 还提供了具有透镜的照明装置。
    • 9. 发明授权
    • LED light emitting device
    • LED发光装置
    • US08246205B2
    • 2012-08-21
    • US12889433
    • 2010-09-24
    • Chih-Ming Lai
    • Chih-Ming Lai
    • F21S4/00F21V21/00
    • F21V23/0457F21K9/23F21Y2115/10H05B33/0854H05B37/0227
    • An LED light emitting device includes an LED light emitting component comprising a visible LED die emitting visible light and an infrared LED die emitting infrared light, a power source driver for providing electric energy for the LED light emitting component, and a temperature sensor for sensing a surface temperature of an outer surface of the LED light emitting component. When a value of the surface temperature is smaller than zero degree Celsius, the temperature sensor outputs a control signal to the power source driver to control the power source driver to supply an electric current to the infrared LED die, whereby the infrared LED die radiates infrared light to melt ice on the outer surface of the LED light emitting component.
    • 一种LED发光装置,其特征在于,包括:LED发光部件,其包含发出可见光的可见LED芯片和发射红外光的红外LED芯片;用于为所述LED发光部件提供电能的电源驱动器;以及感测 LED发光部件的外表面的表面温度。 当表面温度的值小于零摄氏度时,温度传感器向电源驱动器输出控制信号,以控制电源驱动器向红外LED管芯提供电流,由此红外LED管芯辐射红外线 光在LED发光部件的外表面上融化冰。
    • 10. 发明授权
    • LED lamp
    • 点灯
    • US08215783B2
    • 2012-07-10
    • US12768742
    • 2010-04-28
    • Chih-Ming Lai
    • Chih-Ming Lai
    • F21V33/00
    • F21V29/60F21S8/083F21V29/2212F21V29/76F21W2111/00F21W2131/10F21Y2115/10Y10S362/80
    • An LED lamp includes a lamp support and a light-source module mounted on the lamp support. The lamp support includes a main post and a branch post extending from the main post. The main post is tubular and defines a first airflow tunnel inside the main post. The branch post is tubular and defines a second airflow tunnel inside the branch post, and the second airflow tunnel is directly communicated with the outer environment. The first and second airflow tunnels are communicated with each other. The light-source module is located at a position through which an airflow from the first and second airflow tunnels of the main post and the branch post flows.
    • LED灯包括灯支架和安装在灯支架上的光源模块。 灯支架包括主柱和从主柱延伸的分支柱。 主柱是管状的,并且在主柱内限定了第一气流通道。 分支柱是管状的并且在分支柱内部限定第二气流通道,并且第二气流通道与外部环境直接连通。 第一和第二气流通道彼此连通。 光源模块位于通过主柱和分支柱的第一和第二气流通道的气流流过的位置。