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1. 发明申请

US20130126932A1 PACKAGE OF ENVIRONMENTAL SENSITIVE ELECTRONIC ELEMENT 有权
标题翻译：环境敏感电子元件包装
公开(公告)号：US20130126932A1
公开(公告)日：2013-05-23
申请号：US13354298
申请日：2012-01-19
申请人： Kuang-Jung Chen , Jian-Lin Wu , Shu-Tang Yeh
发明人： Kuang-Jung Chen , Jian-Lin Wu , Shu-Tang Yeh
IPC分类号： H01L33/56
CPC分类号： H01L51/5256
摘要： A package of an environmental sensitive electronic element including a first substrate, a second substrate, an environmental sensitive electronic element, a flexible structure layer and a filler layer is provided. The environmental sensitive electronic element is disposed on the first substrate and located between the first substrate and the second substrate. The environmental sensitive electronic element includes an anode layer, a hole injecting layer, a hole transporting layer, an organic light emitting layer, a cathode layer and an electron injection layer. The flexible structure layer is disposed on the environmental sensitive electronic element and includes a soft layer, a trapping layer and a protective layer. The material of the trapping layer is the same as the material of the electron injection layer. The filler layer is disposed between the first substrate and the second substrate and encapsulates the environmental sensitive electronic element and the flexible structure layer.
摘要翻译：提供一种包括第一基板，第二基板，环境敏感电子元件，柔性结构层和填充层的环境敏感电子元件的封装。环境敏感电子元件设置在第一基板上并且位于第一基板和第二基板之间。环境敏感电子元件包括阳极层，空穴注入层，空穴传输层，有机发光层，阴极层和电子注入层。柔性结构层设置在环境敏感电子元件上，并且包括软层，捕获层和保护层。捕获层的材料与电子注入层的材料相同。填充层设置在第一基板和第二基板之间，并且封装环境敏感的电子元件和柔性结构层。

2. 发明授权

US09142798B2 Package of environmental sensitive electronic element 有权
标题翻译：环保敏感电子元件包装
公开(公告)号：US09142798B2
公开(公告)日：2015-09-22
申请号：US13354298
申请日：2012-01-19
申请人： Kuang-Jung Chen , Jian-Lin Wu , Shu-Tang Yeh
发明人： Kuang-Jung Chen , Jian-Lin Wu , Shu-Tang Yeh
IPC分类号： H01L33/56 , H01L51/52
CPC分类号： H01L51/5256
摘要： A package of an environmental sensitive electronic element including a first substrate, a second substrate, an environmental sensitive electronic element, a flexible structure layer and a filler layer is provided. The environmental sensitive electronic element is disposed on the first substrate and located between the first substrate and the second substrate. The environmental sensitive electronic element includes an anode layer, a hole injecting layer, a hole transporting layer, an organic light emitting layer, a cathode layer and an electron injection layer. The flexible structure layer is disposed on the environmental sensitive electronic element and includes a soft layer, a trapping layer and a protective layer. The material of the trapping layer is the same as the material of the electron injection layer. The filler layer is disposed between the first substrate and the second substrate and encapsulates the environmental sensitive electronic element and the flexible structure layer.
摘要翻译：提供一种包括第一基板，第二基板，环境敏感电子元件，柔性结构层和填充层的环境敏感电子元件的封装。环境敏感电子元件设置在第一基板上并且位于第一基板和第二基板之间。环境敏感电子元件包括阳极层，空穴注入层，空穴传输层，有机发光层，阴极层和电子注入层。柔性结构层设置在环境敏感电子元件上，并且包括软层，捕获层和保护层。捕获层的材料与电子注入层的材料相同。填充层设置在第一基板和第二基板之间，并且封装环境敏感的电子元件和柔性结构层。

3. 发明授权

US08236126B2 Encapsulation method of environmentally sensitive electronic element 有权
标题翻译：环境敏感电子元件的封装方法
公开(公告)号：US08236126B2
公开(公告)日：2012-08-07
申请号：US12860945
申请日：2010-08-23
申请人： Kuang-Jung Chen , Shu-Tang Yeh , Ping-I Shih , Kung-Yu Cheng , Jian-Lin Wu
发明人： Kuang-Jung Chen , Shu-Tang Yeh , Ping-I Shih , Kung-Yu Cheng , Jian-Lin Wu
IPC分类号： B32B38/10
CPC分类号： B32B37/26 , B32B37/185 , B32B37/187 , B32B2037/1253 , B32B2037/268 , B32B2038/1891 , B32B2457/206 , H01L51/524 , H01L2251/5338 , H01L2924/16235 , Y10T156/1052
摘要： An encapsulation method of an environmentally sensitive electronic element is provided. A first substrate is provided, wherein at least one first alignment mark and a plurality of environmentally sensitive electronic elements are formed on the first substrate. A second substrate is provided, wherein at least one second alignment mark and a plurality of limiting cavities are formed on the second substrate. A plurality of cover lids is respectively disposed in the limiting cavities. An adhesive is formed on the cover lids. The first substrate and the second substrate are laminated together with the first alignment mark and the second alignment mark as reference, so that the environmentally sensitive electronic elements are sealed in the adhesive and located between the first substrate and the second substrate. The second substrate and the cover lids are separated from each other.
摘要翻译：提供了一种对环境敏感的电子元件的封装方法。提供了第一衬底，其中在第一衬底上形成至少一个第一对准标记和多个对环境敏感的电子元件。提供了第二基板，其中在第二基板上形成至少一个第二对准标记和多个限制腔。多个盖盖分别设置在限制腔中。在盖盖上形成粘合剂。将第一基板和第二基板与第一对准标记和第二对准标记作为参考层压在一起，使得环境敏感的电子元件被密封在粘合剂中并且位于第一基板和第二基板之间。第二基板和盖盖彼此分离。

4. 发明申请

US20120012246A1 ENCAPSULATION METHOD OF ENVIRONMENTALLY SENSITIVE ELECTRONIC ELEMENT 有权
标题翻译：环境敏感电子元件的封装方法
公开(公告)号：US20120012246A1
公开(公告)日：2012-01-19
申请号：US12860945
申请日：2010-08-23
申请人： Kuang-Jung Chen , Shu-Tang Yeh , Ping-I Shih , Kung-Yu Cheng , Jian-Lin Wu
发明人： Kuang-Jung Chen , Shu-Tang Yeh , Ping-I Shih , Kung-Yu Cheng , Jian-Lin Wu
IPC分类号： B32B38/10
CPC分类号： B32B37/26 , B32B37/185 , B32B37/187 , B32B2037/1253 , B32B2037/268 , B32B2038/1891 , B32B2457/206 , H01L51/524 , H01L2251/5338 , H01L2924/16235 , Y10T156/1052
摘要： An encapsulation method of an environmentally sensitive electronic element is provided. A first substrate is provided, wherein at least one first alignment mark and a plurality of environmentally sensitive electronic elements are formed on the first substrate. A second substrate is provided, wherein at least one second alignment mark and a plurality of limiting cavities are formed on the second substrate. A plurality of cover lids is respectively disposed in the limiting cavities. An adhesive is formed on the cover lids. The first substrate and the second substrate are laminated together with the first alignment mark and the second alignment mark as reference, so that the environmentally sensitive electronic elements are sealed in the adhesive and located between the first substrate and the second substrate. The second substrate and the cover lids are separated from each other.
摘要翻译：提供了一种对环境敏感的电子元件的封装方法。提供了第一衬底，其中在第一衬底上形成至少一个第一对准标记和多个对环境敏感的电子元件。提供了第二基板，其中在第二基板上形成至少一个第二对准标记和多个限制腔。多个盖盖分别设置在限制腔中。在盖盖上形成粘合剂。将第一基板和第二基板与第一对准标记和第二对准标记作为参考层压在一起，使得环境敏感的电子元件被密封在粘合剂中并且位于第一基板和第二基板之间。第二基板和盖盖彼此分离。

5. 发明申请

US20100327736A1 GREEN PHOSPHORESCENT IRIDIUM COMPLEXES, FABRICATION METHOD THEREOF AND ORGANIC LIGHT-EMITTING DIODES COMPRISING THE SAME 有权
标题翻译：绿色磷光体复合物，其制造方法和包含其的有机发光二极管
公开(公告)号：US20100327736A1
公开(公告)日：2010-12-30
申请号：US12495668
申请日：2009-06-30
申请人： Chien-Hong Cheng , Jian-Lin Wu , Chuang-Yi Liao
发明人： Chien-Hong Cheng , Jian-Lin Wu , Chuang-Yi Liao
IPC分类号： H01J1/63 , C07F15/00
CPC分类号： C09K11/06 , C07F15/0033 , C09K2211/1029 , C09K2211/1033 , C09K2211/1037 , C09K2211/1044 , C09K2211/185
摘要： A green phosphorescent iridium complex represented by Formula (I) is provided. In Formula (I), R1, R2 and R3 are, independently, hydrogen, halogen, substituted or non-substituted C1-6 alkyl, C1-6 alkoxy, cycloalkyl, substituted or non-substituted aryl, amino or heteroaryl, and L is a heterocyclic ring containing N—N or N—O ligand. The invention also provides a method for fabricating the green phosphorescent iridium complex and an organic light-emitting diode including the green phosphorescent iridium complex.
摘要翻译：提供由式（I）表示的绿色磷光铱络合物。在式（I）中，R 1，R 2和R 3独立地为氢，卤素，取代或未取代的C 1-6烷基，C 1-6烷氧基，环烷基，取代或未取代的芳基，氨基或杂芳基，L为含有N-N或N-O配体的杂环。本发明还提供了一种制备绿色磷光铱络合物的方法和包括绿色磷光铱络合物的有机发光二极管。

6. 发明授权

US08753756B2 Green phosphorescent iridium complexes, fabrication method thereof and organic light-emitting diodes comprising the same 有权
标题翻译：绿色磷光铱络合物及其制造方法以及包含其的有机发光二极管
公开(公告)号：US08753756B2
公开(公告)日：2014-06-17
申请号：US12495668
申请日：2009-06-30
申请人： Chien-Hong Cheng , Jian-Lin Wu , Chuang-Yi Liao
发明人： Chien-Hong Cheng , Jian-Lin Wu , Chuang-Yi Liao
IPC分类号： H01L51/54 , C09K11/06
CPC分类号： C09K11/06 , C07F15/0033 , C09K2211/1029 , C09K2211/1033 , C09K2211/1037 , C09K2211/1044 , C09K2211/185
摘要： A green phosphorescent iridium complex represented by Formula (I) is provided. In Formula (I), R1, R2 and R3 are, independently, hydrogen, halogen, substituted or non-substituted C1-6 alkyl, C1-6 alkoxy, cycloalkyl, substituted or non-substituted aryl, amino or heteroaryl, and L is a heterocyclic ring containing N—N or N—O ligand. The invention also provides a method for fabricating the green phosphorescent iridium complex and an organic light-emitting diode including the green phosphorescent iridium complex.
摘要翻译：提供由式（I）表示的绿色磷光铱络合物。在式（I）中，R 1，R 2和R 3独立地为氢，卤素，取代或未取代的C 1-6烷基，C 1-6烷氧基，环烷基，取代或未取代的芳基，氨基或杂芳基，L为含有N-N或N-O配体的杂环。本发明还提供了一种制备绿色磷光铱络合物的方法和包括绿色磷光铱络合物的有机发光二极管。

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