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1. 发明授权

US11670668B2 Light-emitting device 有权
公开(公告)号：US11670668B2
公开(公告)日：2023-06-06
申请号：US17199445
申请日：2021-03-12
申请人： Kuan-Yu Chen , Hsiao-Lung Lin , Hao-Hsiang Huang
发明人： Kuan-Yu Chen , Hsiao-Lung Lin , Hao-Hsiang Huang
IPC分类号： H01L27/15 , H01L33/56 , H01L33/54
CPC分类号： H01L27/156 , H01L33/54 , H01L33/56
摘要： A light-emitting device including a substrate, an insulating layer, an inner circuit structure, a plurality of light-emitting elements, an insulating encapsulation layer, and a transparent conductive layer is provided. The insulating layer is disposed on the substrate. The inner circuit structure is disposed on the insulating layer. The light-emitting elements are correspondingly disposed on the inner circuit structure. The insulating encapsulation layer is disposed on the inner circuit structure. The insulating encapsulating layer covers a portion of the inner circuit structure and encapsulates the light-emitting elements. The transparent conductive layer is disposed on the insulating encapsulating layer. The transparent conductive layer electrically connects the light-emitting elements, and serially connects the light-emitting elements.

2. 发明申请

US20210288106A1 LIGHT-EMITTING DEVICE 有权
公开(公告)号：US20210288106A1
公开(公告)日：2021-09-16
申请号：US17199445
申请日：2021-03-12
申请人： Kuan-Yu Chen , Hsiao-Lung Lin , Hao-Hsiang Huang
发明人： Kuan-Yu Chen , Hsiao-Lung Lin , Hao-Hsiang Huang
IPC分类号： H01L27/15 , H01L33/56 , H01L33/54
摘要： A light-emitting device including a substrate, an insulating layer, an inner circuit structure, a plurality of light-emitting elements, an insulating encapsulation layer, and a transparent conductive layer is provided. The insulating layer is disposed on the substrate. The inner circuit structure is disposed on the insulating layer. The light-emitting elements are correspondingly disposed on the inner circuit structure. The insulating encapsulation layer is disposed on the inner circuit structure. The insulating encapsulating layer covers a portion of the inner circuit structure and encapsulates the light-emitting elements. The transparent conductive layer is disposed on the insulating encapsulating layer. The transparent conductive layer electrically connects the light-emitting elements, and serially connects the light-emitting elements.

3. 发明申请

US20200266377A1 ORGANIC LIGHT EMITTING DISPLAY DEVICE 审中-公开
公开(公告)号：US20200266377A1
公开(公告)日：2020-08-20
申请号：US16794255
申请日：2020-02-19
申请人： Kuan-Yu Chen , Hsiao-Lung Lin
发明人： Kuan-Yu Chen , Hsiao-Lung Lin
IPC分类号： H01L51/50 , H01L51/52
摘要： An organic light emitting display device including a substrate, an anode, a hole transport layer, a cathode, an electron transport layer and an organic light emitting layer is provided. The anode is located on the substrate. The hole transport layer is located on the anode. The cathode is located on the substrate. The electron transport layer is located on the cathode. The organic light emitting layer is located between the hole transport layer and the electron transport layer. A vertical projection of the anode on the substrate is not overlapped with a vertical projection of the cathode on the substrate.

4. 发明授权

US10930874B2 Organic light emitting display device 有权
公开(公告)号：US10930874B2
公开(公告)日：2021-02-23
申请号：US16794255
申请日：2020-02-19
申请人： Kuan-Yu Chen , Hsiao-Lung Lin
发明人： Kuan-Yu Chen , Hsiao-Lung Lin
IPC分类号： H01L51/50 , H01L51/52
摘要： An organic light emitting display device including a substrate, an anode, a hole transport layer, a cathode, an electron transport layer and an organic light emitting layer is provided. The anode is located on the substrate. The hole transport layer is located on the anode. The cathode is located on the substrate. The electron transport layer is located on the cathode. The organic light emitting layer is located between the hole transport layer and the electron transport layer. A vertical projection of the anode on the substrate is not overlapped with a vertical projection of the cathode on the substrate.

5. 发明申请

US20220408563A1 CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF 有权
公开(公告)号：US20220408563A1
公开(公告)日：2022-12-22
申请号：US17842796
申请日：2022-06-17
申请人： Kuan-Yu Chen , Hsiao-Lung Lin
发明人： Kuan-Yu Chen , Hsiao-Lung Lin
IPC分类号： H05K1/11 , H05K1/05 , H05K3/40 , H05K3/44
摘要： A circuit board includes a metal substrate, a resin layer, an insulating layer, and a first conductive structure. The metal substrate has a first through hole, and the first through hole has a first width. A portion of the resin layer is disposed in the first through hole. The resin layer has a second through hole. The second through hole has a second width. The insulating layer is disposed on at least one surface of the metal substrate, and a portion of the insulating layer contacts the resin layer. The first conductive structure is disposed in the second through hole. The first conductive structure penetrates through the metal substrate. The first width is greater than the second width. A manufacturing method of the circuit board is also provided.

6. 发明申请

US20230054463A1 Cutting Method by Using Particle Beam of Metallic Glass 有权
公开(公告)号：US20230054463A1
公开(公告)日：2023-02-23
申请号：US17405043
申请日：2021-08-18
申请人： Kuan-Wei Chen , Kuan-Yu Chen
发明人： Kuan-Wei Chen , Kuan-Yu Chen
IPC分类号： B24C11/00 , B24C1/04 , B24C3/32 , B24C5/06 , B24C5/08
摘要： A cutting method by applying a particle beam of metallic glass onto a substrate to cut or partially cut the substrate with high production efficiency, low production cost and better environmental protection.

7. 发明申请

US20150131766A1 APPARATUS AND METHOD FOR FREQUENCY LOCKING 有权
标题翻译：用于频率锁定的装置和方法
公开(公告)号：US20150131766A1
公开(公告)日：2015-05-14
申请号：US14135593
申请日：2013-12-20
申请人： Kuan-Yu Chen , Yuan-Min Hu
发明人： Kuan-Yu Chen , Yuan-Min Hu
IPC分类号： H04J3/06 , H04L7/033
CPC分类号： H04L7/033 , H03L7/087 , H04L7/005
摘要： An apparatus and a method for frequency locking are provided. The apparatus includes a phase-locked loop (PLL), a local clock generator, a data buffer unit and a control unit. The PLL locks the phase and the frequency of a radio frequency signal to generate a recovery clock signal and received data. The data buffer unit writes the received data into an elastic buffer of the data buffer unit according to the frequency of the recovery clock signal, and reads the received data from the elastic buffer according to the frequency of a local clock signal generated by the local clock generator. The control unit obtains a write-in address and a read-out address in the elastic buffer, and sends a control signal to the local clock generator for adjusting the frequency of the local clock signal according to relationship between the write-in address and the read-out address.
摘要翻译：提供一种用于频率锁定的装置和方法。该装置包括锁相环（PLL），本地时钟发生器，数据缓冲器单元和控制单元。 PLL锁定射频信号的相位和频率以产生恢复时钟信号和接收的数据。数据缓冲器单元根据恢复时钟信号的频率将接收到的数据写入数据缓冲器单元的弹性缓冲器，并根据由本地时钟产生的本地时钟信号的频率从弹性缓冲器读取接收的数据发电机。控制单元在弹性缓冲器中获得写入地址和读出地址，并且根据写入地址和写入地址之间的关系向本地时钟发生器发送控制信号以调整本地时钟信号的频率读出地址。

8. 发明授权

US08796788B2 Semiconductor devices with strained source/drain structures 有权
标题翻译：具有应变源/漏结构的半导体器件
公开(公告)号：US08796788B2
公开(公告)日：2014-08-05
申请号：US13009322
申请日：2011-01-19
申请人： Tsz-Mei Kwok , Hsueh-Chang Sung , Kuan-Yu Chen , Hsien-Hsin Lin
发明人： Tsz-Mei Kwok , Hsueh-Chang Sung , Kuan-Yu Chen , Hsien-Hsin Lin
IPC分类号： H01L29/772
CPC分类号： H01L29/6659 , H01L29/165 , H01L29/665 , H01L29/66628 , H01L29/66636 , H01L29/7834 , H01L29/7848
摘要： An integrated circuit device and method for manufacturing the integrated circuit device is disclosed. The disclosed method provides a processing for forming improved source/drain features in the semiconductor device. Semiconductor devices with the improved source/drain features may prevent or reduce defects and achieve high strain effect resulting from epi layers. In an embodiment, the source/drain features comprises a second portion surrounding a first portion, and a third portion between the second portion and the semiconductor substrate, wherein the second portion has a composition different from the first and third portions.
摘要翻译：公开了一种用于制造集成电路器件的集成电路器件和方法。所公开的方法提供了用于在半导体器件中形成改进的源极/漏极特征的处理。具有改善的源极/漏极特征的半导体器件可以防止或减少缺陷并实现由epi层产生的高应变效应。在一个实施例中，源极/漏极特征包括围绕第一部分的第二部分和在第二部分和半导体衬底之间的第三部分，其中第二部分具有不同于第一和第三部分的组成。

9. 再颁专利

USRE45018E1 Electrical connector with improved contacts 失效
标题翻译：具有改善触点的电连接器
公开(公告)号：USRE45018E1
公开(公告)日：2014-07-15
申请号：US13292664
申请日：2011-11-09
申请人： Chong Yi , Kuan-Yu Chen
发明人： Chong Yi , Kuan-Yu Chen
IPC分类号： H05K1/00
CPC分类号： G02B6/3817 , G02B6/3885 , H01R12/712 , H01R13/6582
摘要： An electrical connector includes a housing member and a number of contacts attached to the housing member. The contacts include a number of first contacts and second contacts arranged side by side along a transverse direction, respectively. Each of the first and second contacts include a main portion, a contact portion and a bending portion extending from a lateral edge of the main portion. The bending portion has a narrow width in order to occupy small space of a rear wall of the housing member so that the rear wall of the housing member still has adequate area for mounting other components.
摘要翻译：电连接器包括壳体构件和附接到壳体构件的多个触点。触点包括分别沿横向并排布置的多个第一触点和第二触点。第一和第二触头中的每一个包括主要部分，接触部分和从主要部分的侧边缘延伸的弯曲部分。弯曲部分具有窄的宽度以便占据壳体构件的后壁的小的空间，使得壳体构件的后壁仍具有用于安装其它部件的足够的面积。

10. 发明授权

US08648360B2 Light-emitting diode structure 有权
标题翻译：发光二极管结构
公开(公告)号：US08648360B2
公开(公告)日：2014-02-11
申请号：US13472456
申请日：2012-05-15
申请人： Kuan-Yu Chen
发明人： Kuan-Yu Chen
IPC分类号： H01L33/00
CPC分类号： H01L33/58
摘要： A light-emitting diode structure includes a base with a recessed portion, a light-emitting chip and a light-transmissive block. The light-emitting chip disposed in the recessed portion of the base and emits a light beam. The light-transmissive block disposed on the base covers the recessed portion and the light-emitting chip, so that the light beam emitted from the light-emitting chip is radiated outwardly via the light-transmissive block. The light-transmissive block is a flat-top multilateral cone including a bottom surface, a top surface, and several side surfaces connected to and located between the bottom surface and the top surface. A slot with a bottom portion is formed on the top surface of the light-transmissive block.
摘要翻译：发光二极管结构包括具有凹部的基座，发光芯片和透光块。发光芯片设置在基座的凹部中并发射光束。设置在基座上的透光块覆盖凹部和发光芯片，使得从发光芯片发射的光束经由透光块向外辐射。透光块是包括底表面，顶表面和连接到并位于底表面和顶表面之间的几个侧表面的平顶多边锥体。具有底部的槽形成在透光块的顶表面上。

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