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    • 2. 发明授权
    • Programmable via devices in back end of line level
    • 可通过线路级后端设备进行编程
    • US07969770B2
    • 2011-06-28
    • US11833321
    • 2007-08-03
    • Kuan-Neng ChenLia Krusin-ElbaumDennis M. NewnsSampath Purushothaman
    • Kuan-Neng ChenLia Krusin-ElbaumDennis M. NewnsSampath Purushothaman
    • G11C11/00
    • H01L28/65H01L28/20H01L45/06H01L45/1206H01L45/122H01L45/1286H01L45/144H01L45/148H01L45/1683Y10S977/754
    • Programmable via devices and methods for the fabrication thereof are provided. In one aspect, a programmable via device is provided. The programmable via device comprises a first dielectric layer; at least one isolation layer over the first dielectric layer; a heater within the isolation layer; a capping layer over a side of the isolation layer opposite the first dielectric layer; at least one programmable via extending through the capping layer and at least a portion of the isolation layer and in contact with the heater, the programmable via comprising at least one phase change material; a conductive cap over the programmable via; a second dielectric layer over a side of the capping layer opposite the isolation layer; a first conductive via and a second conductive via, each extending through the second dielectric layer, the capping layer and at least a portion of the isolation layer and in contact with the heater; and a third conductive via extending through the second dielectric layer and in contact with the conductive cap.
    • 提供可编程的器件及其制造方法。 在一个方面,提供了可编程通路装置。 可编程通孔装置包括第一介电层; 在所述第一介电层上方的至少一个隔离层; 隔离层内的加热器; 在所述隔离层的与所述第一介电层相对的一侧上的覆盖层; 至少一个可编程通道,其延伸穿过所述封盖层和所述隔离层的至少一部分并与所述加热器接触,所述可编程通孔包括至少一个相变材料; 可编程通孔上的导电盖; 在覆盖层的与隔离层相对的一侧上的第二电介质层; 第一导电通孔和第二导电通孔,每个延伸穿过第二介电层,封盖层和至少一部分隔离层并与加热器接触; 以及延伸穿过所述第二介电层并与所述导电盖接触的第三导电通孔。
    • 7. 发明申请
    • Programmable Via Devices with Air Gap Isolation
    • 具有空气间隙隔离的可编程通孔器件
    • US20090305460A1
    • 2009-12-10
    • US12544964
    • 2009-08-20
    • Kuan-Neng ChenLia Krusin-ElbaumDennis M. NewnsSampath Purushothaman
    • Kuan-Neng ChenLia Krusin-ElbaumDennis M. NewnsSampath Purushothaman
    • H01L21/06
    • H01L45/06H01L28/20H01L45/1206H01L45/122H01L45/1286H01L45/1293H01L45/144H01L45/148H01L45/1683
    • Programmable via devices and methods for the fabrication thereof are provided. In one aspect, a programmable via device is provided. The programmable via device comprises a first dielectric layer; a heater over the first dielectric layer; an air gap separating at least a portion of the heater from the first dielectric layer; an isolation layer over the first dielectric layer covering at least a portion of the heater; a capping layer over a side of the isolation layer opposite the first dielectric layer; at least one programmable via extending through the capping layer and at least a portion of the isolation layer and in contact with the heater, the programmable via comprising at least one phase change material; a conductive cap over the programmable via; a second dielectric layer over a side of the capping layer opposite the isolation layer; a first conductive via and a second conductive via, each extending through the second dielectric layer, the capping layer and at least a portion of the isolation layer and in contact with the heater; and a third conductive via extending through the second dielectric layer and in contact with the conductive cap.
    • 提供可编程的器件及其制造方法。 在一个方面,提供了可编程通路装置。 可编程通孔装置包括第一介电层; 第一介电层上的加热器; 将所述加热器的至少一部分与所述第一介电层分开的气隙; 覆盖所述加热器的至少一部分的所述第一介电层上的隔离层; 在所述隔离层的与所述第一介电层相对的一侧上的覆盖层; 至少一个可编程通道,其延伸穿过所述封盖层和所述隔离层的至少一部分并与所述加热器接触,所述可编程通孔包括至少一个相变材料; 可编程通孔上的导电盖; 在覆盖层的与隔离层相对的一侧上的第二电介质层; 第一导电通孔和第二导电通孔,每个延伸穿过第二介电层,封盖层和至少一部分隔离层并与加热器接触; 以及延伸穿过所述第二介电层并与所述导电盖接触的第三导电通孔。
    • 8. 发明申请
    • PROGRAMMABLE VIA DEVICES WITH AIR GAP ISOLATION
    • 可通过具有空气隔离的装置进行编程
    • US20090033360A1
    • 2009-02-05
    • US11833354
    • 2007-08-03
    • Kuan-Neng ChenLia Krusin-ElbaumDennis M. NewnsSampath Purushothaman
    • Kuan-Neng ChenLia Krusin-ElbaumDennis M. NewnsSampath Purushothaman
    • H03K19/177H01L45/00
    • H01L45/06H01L28/20H01L45/1206H01L45/122H01L45/1286H01L45/1293H01L45/144H01L45/148H01L45/1683
    • Programmable via devices and methods for the fabrication thereof are provided. In one aspect, a programmable via device is provided. The programmable via device comprises a first dielectric layer; a heater over the first dielectric layer; an air gap separating at least a portion of the heater from the first dielectric layer; an isolation layer over the first dielectric layer covering at least a portion of the heater; a capping layer over a side of the isolation layer opposite the first dielectric layer; at least one programmable via extending through the capping layer and at least a portion of the isolation layer and in contact with the heater, the programmable via comprising at least one phase change material; a conductive cap over the programmable via; a second dielectric layer over a side of the capping layer opposite the isolation layer; a first conductive via and a second conductive via, each extending through the second dielectric layer, the capping layer and at least a portion of the isolation layer and in contact with the heater; and a third conductive via extending through the second dielectric layer and in contact with the conductive cap.
    • 提供可编程的器件及其制造方法。 在一个方面,提供了可编程通路装置。 可编程通孔装置包括第一介电层; 第一介电层上的加热器; 将所述加热器的至少一部分与所述第一介电层分开的气隙; 覆盖所述加热器的至少一部分的所述第一介电层上的隔离层; 在所述隔离层的与所述第一介电层相对的一侧上的覆盖层; 至少一个可编程通道,其延伸穿过所述封盖层和所述隔离层的至少一部分并与所述加热器接触,所述可编程通孔包括至少一个相变材料; 可编程通孔上的导电盖; 在覆盖层的与隔离层相对的一侧上的第二电介质层; 第一导电通孔和第二导电通孔,每个延伸穿过第二介电层,封盖层和至少一部分隔离层并与加热器接触; 以及延伸穿过所述第二介电层并与所述导电盖接触的第三导电通孔。
    • 9. 发明申请
    • PROGRAMMABLE VIA DEVICES IN BACK END OF LINE LEVEL
    • 通过线路后端的设备可编程
    • US20090033358A1
    • 2009-02-05
    • US11833321
    • 2007-08-03
    • Kuan-Neng ChenLia Krusin-ElbaumDennis M. NewnsSampath Purushothaman
    • Kuan-Neng ChenLia Krusin-ElbaumDennis M. NewnsSampath Purushothaman
    • H01L45/00H03K19/177
    • H01L28/65H01L28/20H01L45/06H01L45/1206H01L45/122H01L45/1286H01L45/144H01L45/148H01L45/1683Y10S977/754
    • Programmable via devices and methods for the fabrication thereof are provided. In one aspect, a programmable via device is provided. The programmable via device comprises a first dielectric layer; at least one isolation layer over the first dielectric layer; a heater within the isolation layer; a capping layer over a side of the isolation layer opposite the first dielectric layer; at least one programmable via extending through the capping layer and at least a portion of the isolation layer and in contact with the heater, the programmable via comprising at least one phase change material; a conductive cap over the programmable via; a second dielectric layer over a side of the capping layer opposite the isolation layer; a first conductive via and a second conductive via, each extending through the second dielectric layer, the capping layer and at least a portion of the isolation layer and in contact with the heater; and a third conductive via extending through the second dielectric layer and in contact with the conductive cap.
    • 提供可编程的器件及其制造方法。 在一个方面,提供了可编程通路装置。 可编程通孔装置包括第一介电层; 在所述第一介电层上方的至少一个隔离层; 隔离层内的加热器; 在所述隔离层的与所述第一介电层相对的一侧上的覆盖层; 至少一个可编程通道,其延伸穿过所述封盖层和所述隔离层的至少一部分并与所述加热器接触,所述可编程通孔包括至少一个相变材料; 可编程通孔上的导电盖; 在覆盖层的与隔离层相对的一侧上的第二电介质层; 第一导电通孔和第二导电通孔,每个延伸穿过第二介电层,封盖层和至少一部分隔离层并与加热器接触; 以及延伸穿过所述第二介电层并与所述导电盖接触的第三导电通孔。