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    • 1. 发明申请
    • PRINTED MULTILAYER CIRCUIT CONTAINING ACTIVE DEVICES AND METHOD OF MANUFATURING
    • 包含活动设备的印刷多层电路及其制造方法
    • US20080135282A1
    • 2008-06-12
    • US11609069
    • 2006-12-11
    • Krishna D. JonnalagaddaDaniel R. GamotaIwona Turlik
    • Krishna D. JonnalagaddaDaniel R. GamotaIwona Turlik
    • H05K1/16H05K3/12
    • H05K3/4664H05K1/16H05K3/12H05K3/4069H05K2203/0113H05K2203/0143Y10T29/49155
    • A printed multilayer electronic circuit has printed electronic components on a first level circuit. Electrical conductors are printed on the first level circuit, electrically connected to the electronic components. A layer of dielectric material is printed over the printed electrical conductors. The dielectric layer contains apertures or openings that extend vertically through the dielectric layer down to the electrical conductors. A second set of electrical conductors are then printed on the dielectric layer, situated around the apertures. Electrically conductive material is printed in the apertures so that an electrical connection is made from the second set of electrical conductors to the electrical conductors on the lower level. A second level circuit having additional electronic components is then formed on the dielectric layer and the second set of conductors, so that these electronic components are electrically connected to the electronic components on the first level circuit through the path of the printed second set of electrical conductors, the printed electrically conductive material, and the printed electrical conductors on the lower level.
    • 印刷的多层电子电路在第一级电路上印刷了电子部件。 电导体印刷在第一级电路上,电连接到电子部件。 电介质材料层印在印刷电导体上。 电介质层包含沿电介质层垂直延伸到电导体的孔或开口。 然后将第二组电导体印刷在位于孔周围的电介质层上。 导电材料印刷在孔中,使得从第二组电导体到下层的电导体形成电连接。 然后在介电层和第二组导体上形成具有附加电子部件的第二电平电路,使得这些电子部件通过印刷的第二组电导体的路径电连接到第一电平电路上的电子部件 ,印刷的导电材料和下层的印刷电导体。