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1. 发明授权

US08076437B2 Encapsulant material for optical component and light-emitting device 有权
标题翻译：用于光学元件和发光器件的封装材料
公开(公告)号：US08076437B2
公开(公告)日：2011-12-13
申请号：US12440503
申请日：2008-06-09
申请人： Kouki Hatsuda , Hiroshi Samukawa , Katsuhiko Komuro
发明人： Kouki Hatsuda , Hiroshi Samukawa , Katsuhiko Komuro
IPC分类号： C08G77/00
CPC分类号： C08G77/04 , C08G77/38 , C08G77/388 , H01L33/56 , H01L2224/45144 , H01L2224/48091 , H01L2924/12044 , H01L2924/00014 , H01L2924/00
摘要： A light-emitting device is provided which uses an encapsulant material made from a polymer having a high relative light output. The light-emitting device includes a light-emitting element and a member sealing the light-emitting element. The encapsulant material has one or more than two kinds of units given by the following formula (1) and a refractive index of 1.55 or more. where R is a hydrogen atom, alkyl group or phenyl group, Y is an alkyl group of which the carbon number is 1 to 6 or an alkyloxy group of which the carbon number is 1 to 6 and Z is an aromatic compound that meets predetermined requirements.
摘要翻译：提供一种使用由具有高相对光输出的聚合物制成的密封材料的发光器件。发光装置包括发光元件和密封发光元件的构件。密封剂材料具有由下式（1）给出的一种或两种以上的单位，折射率为1.55以上。其中R为氢原子，烷基或苯基，Y为碳数为1至6的烷基或碳数为1至6的烷氧基，Z为满足预定要求的芳族化合物。

2. 发明申请

US20100059774A1 ENCAPSULANT MATERIAL FOR OPTICAL COMPONENT AND LIGHT-EMITTING DEVICE 有权
标题翻译：光学元件和发光器件的封装材料
公开(公告)号：US20100059774A1
公开(公告)日：2010-03-11
申请号：US12440503
申请日：2008-06-09
申请人： Kouki Hatsuda , Hiroshi Samukawa , Katsuhiko Komuro
发明人： Kouki Hatsuda , Hiroshi Samukawa , Katsuhiko Komuro
IPC分类号： H01L33/00 , C08G77/26
CPC分类号： C08G77/04 , C08G77/38 , C08G77/388 , H01L33/56 , H01L2224/45144 , H01L2224/48091 , H01L2924/12044 , H01L2924/00014 , H01L2924/00
摘要： A light-emitting device is provided which uses an encapsulant material made from a polymer having a high relative light output. The light-emitting device includes a light-emitting element and a member sealing the light-emitting element. The encapsulant material has one or more than two kinds of units given by the following formula (1) and a refractive index of 1.55 or more. where R is a hydrogen atom, alkyl group or phenyl group, Y is an alkyl group of which the carbon number is 1 to 6 or an alkyloxy group of which the carbon number is 1 to 6 and Z is an aromatic compound that meets predetermined requirements.
摘要翻译：提供一种使用由具有高相对光输出的聚合物制成的密封材料的发光器件。发光装置包括发光元件和密封发光元件的构件。密封剂材料具有由下式（1）给出的一种或两种以上的单位，折射率为1.55以上。其中R为氢原子，烷基或苯基，Y为碳数为1至6的烷基或碳数为1至6的烷氧基，Z为满足预定要求的芳族化合物。

3. 发明申请

US20080114100A1 Encapsulating resin composition and light-emitting device 有权
标题翻译：封装树脂组合物和发光装置
公开(公告)号：US20080114100A1
公开(公告)日：2008-05-15
申请号：US11976888
申请日：2007-10-29
申请人： Kouki Hatsuda , Hiroshi Samukawa
发明人： Kouki Hatsuda , Hiroshi Samukawa
IPC分类号： C08K5/136
CPC分类号： C08F220/30 , C08K5/101 , C08K5/134 , C09D4/00 , H01L33/56 , Y10T428/31855 , C08L33/08
摘要： An encapsulating resin composition is provided, which gives a cured product having heat resistance, light resistance, and flexibility equivalent to those of silicone resins and having a refractive index of 1.57 or greater which is larger than that of epoxy resins. The encapsulating resin composition contains: a high refractive index acrylic-based or methacrylic-based monomer having a refractive index of 1.55 or greater; and a nonfunctional fluorene compound. In a preferred form, each of the high refractive index acrylic-based or methacrylic-based monomer and the nonfunctional fluorene compound has a 9,9-bisphenylfluorene skeleton.
摘要翻译：提供了一种封装树脂组合物，其产生具有与硅树脂相当的耐热性，耐光性和柔性的固化产物，其折射率大于环氧树脂的1.57或更大。包封树脂组合物包含：折射率为1.55以上的高折射率丙烯酸类或甲基丙烯酸类单体; 和非功能性芴化合物。在优选形式中，高折射率丙烯酸类或甲基丙烯酸类单体和非功能性芴化合物各自具有9,9-双苯芴骨架。

4. 发明授权

US08072139B2 Light emitting element module and method for sealing light emitting element 有权
标题翻译：发光元件模块及密封发光元件的方法
公开(公告)号：US08072139B2
公开(公告)日：2011-12-06
申请号：US11996724
申请日：2006-03-09
申请人： Kouki Hatsuda , Hiroshi Samukawa
发明人： Kouki Hatsuda , Hiroshi Samukawa
IPC分类号： H05B33/00 , H05B33/04 , H05B33/10
CPC分类号： H01L33/54 , B29C33/0022 , B29C43/18 , B29C43/28 , B29C43/46 , B29C2043/3623 , B41J2/45 , B41J2/451 , H01L33/52 , H01L33/60 , H01L2224/45144 , H01L2224/48091 , H01L2933/005 , H01L2924/00014 , H01L2924/00
摘要： Disclosed is a method for sealing a light-emitting device wherein formation of air bubbles in a light-emitting device module can be prevented by performing no gelation after fitting of a cover member. This method also enables to seal a light-emitting device by using a gel sealing material composed of a gel precursor which uses a solvent. Also disclosed is a light-emitting module formed by such a sealing method. In this method for sealing a light-emitting device, gelation of the gel precursor of a gel sealing material is performed before placing the precursor on the light-emitting device, and thus no gelation is necessary after fitting of a cover member. Consequently, a gel precursor having high viscosity that is difficult to be used in an injection method can be used in this method. Furthermore, a substance which requires use of a solvent can be used as a gel precursor of a gel sealing material. A light-emitting device module with high luminance wherein no air bubbles are included can be obtained by this method.
摘要翻译：公开了一种密封发光器件的方法，其中可以通过在安装盖构件之后不进行凝胶化来防止在发光器件模块中形成气泡。该方法还能够通过使用由使用溶剂的凝胶前体组成的凝胶密封材料来密封发光器件。还公开了通过这种密封方法形成的发光模块。在这种密封发光装置的方法中，在将前体放置在发光装置上之前，进行凝胶密封材料的凝胶前体的凝胶化，因此在安装盖部件之后不需要凝胶化。因此，在该方法中可以使用难以在注射方法中使用的具有高粘度的凝胶前体。此外，需要使用溶剂的物质可以用作凝胶密封材料的凝胶前体。通过该方法可以获得不具有气泡的高亮度的发光装置模块。

5. 发明授权

US07868109B2 Curable resin composition 有权
标题翻译：可固化树脂组合物
公开(公告)号：US07868109B2
公开(公告)日：2011-01-11
申请号：US12084707
申请日：2007-03-14
申请人： Hiroshi Samukawa , Kouki Hatsuda
发明人： Hiroshi Samukawa , Kouki Hatsuda
IPC分类号： C08K5/3417 , C08L33/06 , C08L39/04 , C08F20/10
CPC分类号： C09D133/08 , C08F222/1006 , C08K5/3417 , C09D133/14 , H01L33/56 , C08L2666/28
摘要： A curable resin composition is provided which has an appropriate viscosity suitable for encapsulating a light-emitting device. The cured product of the curable resin composition has a refractive index equal to or larger than that of epoxy resins, is excellent in heat resistance and light resistance, and has thermal stress relaxation properties. The curable resin composition contains a high refractive index acrylic-based monomer having a refractive index of 1.52 or more and a non-polymerizable carbazole, and further contains a polymerizable carbazole in accordance with need. An acrylate or methacrylate having a fluorene skeleton, a bisphenol-A skeleton, a biphenyl skeleton, a naphthalene skeleton, or an anthracene skeleton is used as the high refractive index acrylic-based monomer.
摘要翻译：提供一种具有适合于封装发光装置的适当粘度的可固化树脂组合物。固化性树脂组合物的固化物的折射率等于或大于环氧树脂的折射率，耐热性和耐光性优异，并且具有热应力松弛性。固化性树脂组合物含有折射率为1.52以上的高折射率丙烯酸类单体和不可聚合咔唑，并且根据需要还含有可聚合咔唑。使用具有芴骨架的丙烯酸酯或甲基丙烯酸酯，双酚A骨架，联苯骨架，萘骨架或蒽骨架作为高折射率丙烯酸类单体。

6. 发明授权

US08022126B2 Encapsulating resin composition and light-emitting device 有权
标题翻译：封装树脂组合物和发光装置
公开(公告)号：US08022126B2
公开(公告)日：2011-09-20
申请号：US11976888
申请日：2007-10-29
申请人： Kouki Hatsuda , Hiroshi Samukawa
发明人： Kouki Hatsuda , Hiroshi Samukawa
IPC分类号： C08K5/00
CPC分类号： C08F220/30 , C08K5/101 , C08K5/134 , C09D4/00 , H01L33/56 , Y10T428/31855 , C08L33/08
摘要： An encapsulating resin composition is provided, which gives a cured product having heat resistance, light resistance, and flexibility equivalent to those of silicone resins and having a refractive index of 1.57 or greater which is larger than that of epoxy resins. The encapsulating resin composition contains: a high refractive index acrylic-based or methacrylic-based monomer having a refractive index of 1.55 or greater; and a nonfunctional fluorene compound. In a preferred form, each of the high refractive index acrylic-based or methacrylic-based monomer and the nonfunctional fluorene compound has a 9,9-bisphenylfluorene skeleton.
摘要翻译：提供了一种封装树脂组合物，其产生具有与硅树脂相当的耐热性，耐光性和柔性的固化产物，其折射率大于环氧树脂的1.57或更大。包封树脂组合物包含：折射率为1.55以上的高折射率丙烯酸类或甲基丙烯酸类单体; 和非功能性芴化合物。在优选形式中，高折射率丙烯酸类或甲基丙烯酸类单体和非功能性芴化合物各自具有9,9-双苯芴骨架。

7. 发明申请

US20100140654A1 LIGHT EMITTING ELEMENT MODULE AND METHOD FOR SEALING LIGHT EMITTING ELEMENT 有权
标题翻译：用于密封发光元件的发光元件模块和方法
公开(公告)号：US20100140654A1
公开(公告)日：2010-06-10
申请号：US11996724
申请日：2006-03-09
申请人： Kouki Hatsuda , Hiroshi Samukawa
发明人： Kouki Hatsuda , Hiroshi Samukawa
IPC分类号： H01L33/00 , B29C45/14
CPC分类号： H01L33/54 , B29C33/0022 , B29C43/18 , B29C43/28 , B29C43/46 , B29C2043/3623 , B41J2/45 , B41J2/451 , H01L33/52 , H01L33/60 , H01L2224/45144 , H01L2224/48091 , H01L2933/005 , H01L2924/00014 , H01L2924/00
摘要： Disclosed is a method for sealing a light-emitting device wherein formation of air bubbles in a light-emitting device module can be prevented by performing no gelation after fitting of a cover member. This method also enables to seal a light-emitting device by using a gel sealing material composed of a gel precursor which uses a solvent. Also disclosed is a light-emitting module formed by such a sealing method. In this method for sealing a light-emitting device, gelation of the gel precursor of a gel sealing material is performed before placing the precursor on the light-emitting device, and thus no gelation is necessary after fitting of a cover member. Consequently, a gel precursor having high viscosity that is difficult to be used in an injection method can be used in this method. Furthermore, a substance which requires use of a solvent can be used as a gel precursor of a gel sealing material. A light-emitting device module with high luminance wherein no air bubbles are included can be obtained by this method.
摘要翻译：公开了一种密封发光器件的方法，其中可以通过在安装盖构件之后不进行凝胶化来防止在发光器件模块中形成气泡。该方法还能够通过使用由使用溶剂的凝胶前体组成的凝胶密封材料来密封发光器件。还公开了通过这种密封方法形成的发光模块。在这种密封发光装置的方法中，在将前体放置在发光装置上之前，进行凝胶密封材料的凝胶前体的凝胶化，因此在安装盖部件之后不需要凝胶化。因此，在该方法中可以使用难以在注射方法中使用的具有高粘度的凝胶前体。此外，需要使用溶剂的物质可以用作凝胶密封材料的凝胶前体。通过该方法可以获得不具有气泡的高亮度的发光装置模块。

8. 发明申请

US20090143505A1 Curable Resin Composition 有权
标题翻译：可固化树脂组合物
公开(公告)号：US20090143505A1
公开(公告)日：2009-06-04
申请号：US12084707
申请日：2007-03-14
申请人： Hiroshi Samukawa , Kouki Hatsuda
发明人： Hiroshi Samukawa , Kouki Hatsuda
IPC分类号： C08K5/3417
CPC分类号： C09D133/08 , C08F222/1006 , C08K5/3417 , C09D133/14 , H01L33/56 , C08L2666/28
摘要： A curable resin composition is provided which has an appropriate viscosity suitable for encapsulating a light-emitting device. The cured product of the curable resin composition has a refractive index equal to or larger than that of epoxy resins, is excellent in heat resistance and light resistance, and has thermal stress relaxation properties. The curable resin composition contains a high refractive index acrylic-based monomer having a refractive index of 1.52 or more and a non-polymerizable carbazole, and further contains a polymerizable carbazole in accordance with need. An acrylate or methacrylate having a fluorene skeleton, a bisphenol-A skeleton, a biphenyl skeleton, a naphthalene skeleton, or an anthracene skeleton is used as the high refractive index acrylic-based monomer.
摘要翻译：提供一种具有适合于封装发光装置的适当粘度的可固化树脂组合物。固化性树脂组合物的固化物的折射率等于或大于环氧树脂的折射率，耐热性和耐光性优异，并且具有热应力松弛性。固化性树脂组合物含有折射率为1.52以上的高折射率丙烯酸类单体和不可聚合咔唑，并且根据需要还含有可聚合咔唑。使用具有芴骨架的丙烯酸酯或甲基丙烯酸酯，双酚A骨架，联苯骨架，萘骨架或蒽骨架作为高折射率丙烯酸类单体。

9. 发明授权

US07446159B1 Curable resin composition 有权
标题翻译：可固化树脂组合物
公开(公告)号：US07446159B1
公开(公告)日：2008-11-04
申请号：US11902286
申请日：2007-09-20
申请人： Hiroshi Samukawa , Kouki Hatsuda , Yoshito Ikeda , Hisashi Ando , Norikazu Yamamoto
发明人： Hiroshi Samukawa , Kouki Hatsuda , Yoshito Ikeda , Hisashi Ando , Norikazu Yamamoto
IPC分类号： C08F222/14 , C08F2/46
CPC分类号： C08F222/1006 , C08F220/30
摘要： A resin composition having a viscosity suitable for encapsulating optical devices such as light-emitting devices is provided. Specifically, the cured product of the resin composition has a refractive index greater than or equal to that of epoxy resins, exhibits excellent heat resistance and light resistance, and has thermal stress relaxation properties. The curable resin composition contains a fluorene group-containing acrylate or methacrylate represented by the following formula and a specific monofunctional acrylate or methacrylate: wherein X is —(CH2CH2O)n— or —(CH2CH2O)—CH2CH(OH)CH2O— with n being 1 to 5 and R is an acrylic or methacrylic group.
摘要翻译：提供了一种具有适合于封装诸如发光装置的光学装置的粘度的树脂组合物。具体而言，树脂组合物的固化物的折射率大于或等于环氧树脂的折射率，耐热性和耐光性优异，具有热应力松弛性。可固化树脂组合物含有由下式表示的含芴基的丙烯酸酯或甲基丙烯酸酯和特定的单官能丙烯酸酯或甲基丙烯酸酯：其中X是 - （CH 2 CH 2 CH 2 O ） - 或 - （CH 2 CH 2 CH 2）-CH 2 CH（OH）CH

10. 发明授权

US06288148B1 Acrylic emulsions containing tackifiers, processes for preparing them, and adhesive tape containing acrylic emulsions containing tackifiers 有权
标题翻译：含有增粘剂的丙烯酸乳液，其制备方法和含有增粘剂的丙烯酸乳液的胶带
公开(公告)号：US06288148B1
公开(公告)日：2001-09-11
申请号：US09341866
申请日：1999-07-30
申请人： Hiroshi Samukawa , Kazuki Shibata
发明人： Hiroshi Samukawa , Kazuki Shibata
IPC分类号： C08F244
CPC分类号： C09J151/003 , C08F265/06 , C09J7/385 , Y10S526/931 , Y10T428/28 , Y10T428/2891 , C08F2/22
摘要： Acrylic emulsions are obtained by carrying out a polymerization reaction of a first acrylic monomer dispersion, adding a second acrylic monomer dispersion, and carrying out a further polymerization reaction wherein the first acrylic monomer dispersion contains acrylic monomer and tackifier in a first proportion to acrylic monomer contained in the first acrylic monomer dispersion and wherein the second acrylic monomer dispersion contains acrylic monomer and tackifier in a second proportion to acrylic monomer contained in the second acrylic monomer dispersion, and wherein the proportion of tackifier in the first acrylic monomer dispersion is lower than the proportion of tackifier in the second acrylic monomer dispersion. A high molecular weight acrylic polymer is obtained when the first acrylic monomer dispersion is polymerization reacted. The second acrylic monomer dispersion is added to the first acrylic monomer dispersion after the first acrylic monomer dispersion is polymerization reacted. The tackifier is added to the acrylic polymer when the first acrylic monomer dispersion is further polymerized with the second acrylic monomer dispersion. Thus, holding power and adhesion are improved at the same time.
摘要翻译：丙烯酸乳液通过进行第一丙烯酸类单体分散体的聚合反应，加入第二丙烯酸类单体分散体和进行进一步的聚合反应而获得，其中第一丙烯酸类单体分散体含有丙烯酸类单体和增粘剂以与丙烯酸单体成比例的第一比例在所述第一丙烯酸系单体分散体中，所述第二丙烯酸系单体分散体含有与所述第二丙烯酸类单体分散体中所含的丙烯酸类单体成比例的丙烯酸系单体和增粘剂，并且其中，所述第一丙烯酸系单体分散体中的增粘剂的比例低于所述第的第二丙烯酸类单体分散体中的增粘剂。当第一丙烯酸单体分散体聚合反应时，获得高分子量丙烯酸聚合物。在第一丙烯酸类单体分散体聚合反应后，将第二丙烯酸类单体分散体加入到第一丙烯酸类单体分散体中。当第一丙烯酸类单体分散体与第二丙烯酸类单体分散体进一步聚合时，将增粘剂加入到丙烯酸类聚合物中。因此，同时提高了保持力和附着力。

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