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1. 发明申请

US20080036565A1 Transformer 有权
公开(公告)号：US20080036565A1
公开(公告)日：2008-02-14
申请号：US11974015
申请日：2007-10-10
申请人： Kouji Yamashita , Youji Matsuda , Kazuo Nishiyama , Masao Hosokawa , Kazuyuki Fukui , Hidemasa Yamaguchi , Tooru Honma , Hiroyuki Endou , Makoto Shinohara
发明人： Kouji Yamashita , Youji Matsuda , Kazuo Nishiyama , Masao Hosokawa , Kazuyuki Fukui , Hidemasa Yamaguchi , Tooru Honma , Hiroyuki Endou , Makoto Shinohara
IPC分类号： H01F27/24
CPC分类号： H01F27/263 , H01F27/25 , H01F27/34
摘要： There is provided a joint structure of a wound iron core in which iron core characteristics can be enhanced by improving the distribution of magnetic flux within an iron core. A wound iron core is formed to provide a joining structure or a butt joining structure and a lap joining structure disposed in an appropriate arrangement in which the a margin of overlapping is more increased as being closer to an outer periphery from an inner periphery of the iron core, taking a distribution of magnetic flux density within the iron core into consideration.

2. 发明授权

US07471183B2 Transformer 有权
标题翻译：变压器
公开(公告)号：US07471183B2
公开(公告)日：2008-12-30
申请号：US11974015
申请日：2007-10-10
申请人： Kouji Yamashita , Youji Matsuda , Kazuo Nishiyama , Masao Hosokawa , Kazuyuki Fukui , Hidemasa Yamaguchi , Tooru Honma , Hiroyuki Endou , Makoto Shinohara
发明人： Kouji Yamashita , Youji Matsuda , Kazuo Nishiyama , Masao Hosokawa , Kazuyuki Fukui , Hidemasa Yamaguchi , Tooru Honma , Hiroyuki Endou , Makoto Shinohara
IPC分类号： H01F27/24
CPC分类号： H01F27/263 , H01F27/25 , H01F27/34
摘要： There is provided a joint structure of a wound iron core in which iron core characteristics can be enhanced by improving the distribution of magnetic flux within an iron core. A wound iron core is formed to provide a joining structure or a butt joining structure and a lap joining structure disposed in an appropriate arrangement in which the a margin of overlapping is more increased as being closer to an outer periphery from an inner periphery of the iron core, taking a distribution of magnetic flux density within the iron core into consideration.
摘要翻译：提供了一种卷绕铁芯的接合结构，其中通过改善铁芯内的磁通量的分布可以提高铁芯特性。卷绕的铁芯形成为提供接合结构或对接接合结构和搭接接合结构，其布置成适当的布置，其中重叠边缘更多地从铁的内周更靠近外周核心，考虑铁芯内的磁通密度分布。

3. 发明申请

US20050280491A1 Transformer 有权
标题翻译：变压器
公开(公告)号：US20050280491A1
公开(公告)日：2005-12-22
申请号：US11138234
申请日：2005-05-25
申请人： Kouji Yamashita , Youji Matsuda , Kazuo Nishiyama , Masao Hosokawa , Kazuyuki Fukui , Hidemasa Yamaguchi , Tooru Honma , Hiroyuki Endou , Makoto Shinohara
发明人： Kouji Yamashita , Youji Matsuda , Kazuo Nishiyama , Masao Hosokawa , Kazuyuki Fukui , Hidemasa Yamaguchi , Tooru Honma , Hiroyuki Endou , Makoto Shinohara
IPC分类号： H01F27/25 , H01F27/26 , H01F27/34 , H02K41/00
CPC分类号： H01F27/263 , H01F27/25 , H01F27/34
摘要： There is provided a joint structure of a wound iron core in which iron core characteristics can be enhanced by improving the distribution of magnetic flux within an iron core. A wound iron core is formed to provide a joining structure or a butt joining structure and a lap joining structure disposed in an appropriate arrangement in which the a margin of overlapping is more increased as being closer to an outer periphery from an inner periphery of the iron core, taking a distribution of magnetic flux density within the iron core into consideration.
摘要翻译：提供了一种卷绕铁芯的接合结构，其中通过改善铁芯内的磁通量的分布可以提高铁芯特性。卷绕的铁芯形成为提供接合结构或对接接合结构和搭接接合结构，其布置成适当的布置，其中重叠边缘更多地从铁的内周更靠近外周核心，考虑铁芯内的磁通密度分布。

4. 发明授权

US07292127B2 Transformer 有权
标题翻译：变压器
公开(公告)号：US07292127B2
公开(公告)日：2007-11-06
申请号：US11138234
申请日：2005-05-25
申请人： Kouji Yamashita , Youji Matsuda , Kazuo Nishiyama , Masao Hosokawa , Kazuyuki Fukui , Hidemasu Yamaguchi , Tooru Honma , Hiroyuki Endou , Makoto Shinohara
发明人： Kouji Yamashita , Youji Matsuda , Kazuo Nishiyama , Masao Hosokawa , Kazuyuki Fukui , Hidemasu Yamaguchi , Tooru Honma , Hiroyuki Endou , Makoto Shinohara
IPC分类号： H01F27/24
CPC分类号： H01F27/263 , H01F27/25 , H01F27/34
摘要： There is provided a joint structure of a wound iron core in which iron core characteristics can be enhanced by improving the distribution of magnetic flux within an iron core. A wound iron core is formed to provide a joining structure or a butt joining structure and a lap joining structure disposed in an appropriate arrangement in which the a margin of overlapping is more increased as being closer to an outer periphery from an inner periphery of the iron core, taking a distribution of magnetic flux density within the iron core into consideration.
摘要翻译：提供了一种卷绕铁芯的接合结构，其中通过改善铁芯内的磁通量的分布可以提高铁芯特性。卷绕的铁芯形成为提供接合结构或对接接合结构和搭接接合结构，其布置成适当的布置，其中重叠边缘更多地从铁的内周更靠近外周核心，考虑铁芯内的磁通密度分布。

5. 发明授权

US4203780A Fe Ion implantation into semiconductor substrate for reduced lifetime sensitivity to temperature 失效
标题翻译： Fe离子注入半导体衬底，降低寿命对温度的敏感性
公开(公告)号：US4203780A
公开(公告)日：1980-05-20
申请号：US936104
申请日：1978-08-23
申请人： Takeshi Matsushita , Takayoshi Mamine , Hisao Hayashi , Kazuo Nishiyama
发明人： Takeshi Matsushita , Takayoshi Mamine , Hisao Hayashi , Kazuo Nishiyama
IPC分类号： H01L21/22 , H01L29/167 , H01L21/263
CPC分类号： H01L29/167 , H01L21/221 , Y10S438/917
摘要： A method of an iron Fe ion implantation into a semiconductor substrate of an N-type conductivity is disclosed. The method comprises the steps of implanting Fe ions into an N-type semiconductor substrate from its one surface with the dose amount of 10.sup.10 to 10.sup.15 cm.sup.-2 and heat-treating the semiconductor substrate with Fe ions at 850.degree. to 1250.degree. C. to control the lifetime of the minority carrier in the substrate and hence to reduce the temperature dependency of the lifetime.
摘要翻译：公开了将铁Fe离子注入到N型电导率的半导体衬底中的方法。该方法包括以下步骤：从其一个表面将剂量为1010至1015cm -2的Fe离子注入到N型半导体衬底中，并用850°至1250℃的Fe离子对半导体衬底进行热处理，控制底物中少数载体的寿命，从而降低寿命的温度依赖性。

6. 发明授权

US6107685A Semiconductor part and fabrication method thereof, and structure and method for mounting semiconductor part 失效
标题翻译：半导体部件及其制造方法以及半导体部件的安装结构和方法
公开(公告)号：US6107685A
公开(公告)日：2000-08-22
申请号：US398762
申请日：1999-09-17
申请人： Kazuo Nishiyama
发明人： Kazuo Nishiyama
IPC分类号： H01L21/60 , H01L21/56 , H01L23/31 , H01L23/48
CPC分类号： H01L24/12 , H01L21/563 , H01L23/3114 , H01L24/11 , H01L24/16 , H01L2224/05001 , H01L2224/05022 , H01L2224/05548 , H01L2224/05568 , H01L2224/05569 , H01L2224/13099 , H01L2224/1403 , H01L2224/16 , H01L2224/73203 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01075 , H01L2924/01078 , H01L2924/014 , H01L2924/10253 , H01L2924/351
摘要： Disclosed is a semiconductor part improved to enhance the connection strength of land terminals upon mounting of the semiconductor part and to give a sufficient margin to the arrangement pitch of wires passing through the land terminals, a fabrication method thereof, and a structure and method of mounting the semiconductor part. The semiconductor part includes land terminals for bumps (or land terminals provided with bumps), arranged in a grid pattern, which are connected to surfaces of electrode pads via re-arrangement wires on a base; wherein the land terminals for bumps (or land terminals provided with bumps) are classified into outer land terminals arranged on the outer peripheral side of the base and inner land terminals arranged inside the outer land terminals; and the outer land terminals each have a diameter larger than that of each of the inner land terminals and/or have a pitch larger than an arrangement pitch of the inner land terminals.
摘要翻译：公开了一种改进的半导体部件，其用于在半导体部件的安装时提高接地端子的连接强度，并且赋予通过接地端子的电线的布置间距足够的余量，其制造方法以及安装结构和方法半导体部分。半导体部件包括以栅格图案布置的用于凸起的凸起（或接地端子）的接地端子，其通过基座上的布置布线连接到电极焊盘的表面; 其特征在于，所述凸起用的焊盘端子（或者设置有凸点的焊盘端子）分为设置在所述基座的外周侧的外侧接地端子和配置在所述外部接地端子的内侧的内部接地端子。并且所述外侧接地端子的直径大于所述内部接地端子的直径，和/或具有比所述内部接地端子的配置间距大的间距。

7. 发明申请

US20100272251A1 ECHO REMOVING APPARATUS, ECHO REMOVING METHOD, AND COMMUNICATION APPARATUS 审中-公开
标题翻译： ECHO移除装置，ECHO移除方法和通信装置
公开(公告)号：US20100272251A1
公开(公告)日：2010-10-28
申请号：US12751003
申请日：2010-03-31
申请人： Tatsushi BANBA , Hiroshi Yamashita , Hidetoshi Ichioka , Kazuo Nishiyama , Shiro Omori , Kenji Suzuki , Shuichi Takizawa , Shinichi Sameshima
发明人： Tatsushi BANBA , Hiroshi Yamashita , Hidetoshi Ichioka , Kazuo Nishiyama , Shiro Omori , Kenji Suzuki , Shuichi Takizawa , Shinichi Sameshima
IPC分类号： H04M9/08
CPC分类号： H04N7/15 , G10L2021/02082 , H04B3/20 , H04M9/082 , H04N7/141 , H04N21/42203 , H04N21/4223 , H04N21/439 , H04N21/4788 , H04R3/02
摘要： Disclosed herein is an echo removing apparatus including: a sound input terminal configured to input an external sound signal from external equipment; a first echo removing device configured to, after admitting as input signals the external sound signal coming from the external equipment and input through the sound input terminal and a receiver sound signal transmitted from a calling party, estimate a first pseudo echo component from the external sound signal in order to remove the first pseudo echo component from the receiver sound signal; and a second echo removing device configured to, after admitting as input signals the external sound signal coming from the external equipment and input through the sound input terminal and a transmitter sound signal input from a microphone, estimate a second pseudo echo component from the external sound signal in order to remove the second pseudo echo component from the transmitter sound signal.
摘要翻译：这里公开了一种回波消除装置，包括：声音输入端子，被配置为从外部设备输入外部声音信号; 第一回波消除装置，被配置为在从外部设备接收到来自外部设备的外部声音信号并通过声音输入端子输入并从主叫方发送的接收机声音信号作为输入信号之后，从外部声音估计第一伪回波分量信号，以从接收机声音信号中去除第一伪回波分量; 以及第二回波去除装置，被配置为在从外部设备接收到来自外部设备的外部声音信号并通过声音输入端子输入并从麦克风输入的发射机声音信号作为输入信号之后，从外部声音估计第二伪回波分量信号以从发射机声音信号中去除第二伪回波分量。

8. 发明授权

US06936525B2 Chip-like electronic components, a method of manufacturing the same, a pseudo wafer therefor and a method of manufacturing thereof 有权
标题翻译：片状电子元件及其制造方法，其制造方法及其制造方法
公开(公告)号：US06936525B2
公开(公告)日：2005-08-30
申请号：US10236771
申请日：2002-09-06
申请人： Kazuo Nishiyama , Hiroshi Ozaki , Yuji Takaoka , Teruo Hirayama
发明人： Kazuo Nishiyama , Hiroshi Ozaki , Yuji Takaoka , Teruo Hirayama
IPC分类号： H01L21/683 , H01L21/301 , H01L21/48 , H01L21/56 , H01L21/60 , H01L21/68 , H01L23/12 , H01L23/31 , H01L23/485 , H01L21/46 , H01L21/78
CPC分类号： H01L21/568 , H01L21/561 , H01L21/563 , H01L23/3114 , H01L24/11 , H01L24/12 , H01L24/48 , H01L24/96 , H01L24/97 , H01L2224/02166 , H01L2224/05001 , H01L2224/05022 , H01L2224/05571 , H01L2224/1131 , H01L2224/12105 , H01L2224/13099 , H01L2224/16 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/97 , H01L2924/00014 , H01L2924/00015 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0103 , H01L2924/01033 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/3011 , H01L2224/73203 , H01L2924/00 , H01L2224/05599 , H01L2224/45099 , H01L2224/85399 , H01L2224/05541 , H01L2224/05005 , H01L2224/45015 , H01L2924/207
摘要： A method of manufacturing the semiconductor chips comprises the steps of: pasting on a substrate an adhesive sheet having a property to retain its adhesive strength prior to a processing, then lose its adhesive strength after the processing; fixing a plurality of non-defective bare chips on this adhesive sheet, with their Al electrode pad surfaces facing down; coating a resin on a whole area other than the Al electrode pad surfaces of the plurality of non-defective bare chips including interspaces therebetween; applying a predetermined process to the adhesive sheet to weaken its adhesive strength of the adhesive sheet; peeling off a pseudo wafer bonding non-defective bare chips; and dicing the plurality of non-defective bare chips into a discrete non-defective electronic part by cutting the pseudo wafer at a position of the resin between respective non-defective bare chips.
摘要翻译：制造半导体芯片的方法包括以下步骤：在基板上粘贴具有在加工之前保持其粘合强度的性能的粘合片，然后在加工后失去其粘合强度; 在该粘合片上固定多个无缺陷裸芯片，其Al电极焊盘表面朝下; 在除了包括它们之间的间隙的多个无缺陷裸芯片的Al电极焊盘表面以外的整个区域上涂覆树脂; 对粘合片施加预定的处理以削弱其粘合片的粘合强度; 剥离伪晶片结合无缺陷裸芯片; 并且通过在各个无缺陷裸芯片之间的树脂的位置处切割伪晶片将多个无缺陷裸芯片切割成离散的无缺陷电子部件。

9. 发明申请

US20050167851A1 Semiconductor part for component mounting, mounting structure and mounting method 审中-公开
标题翻译：元件安装半导体零件，安装结构和安装方法
公开(公告)号：US20050167851A1
公开(公告)日：2005-08-04
申请号：US11084429
申请日：2005-03-18
申请人： Kazuo Nishiyama
发明人： Kazuo Nishiyama
IPC分类号： H01L23/12 , H01L21/60 , H01L23/48 , H01L23/498 , H05K1/11 , H05K3/34
CPC分类号： H01L23/49838 , H01L24/48 , H01L2224/05599 , H01L2224/48227 , H01L2224/73265 , H01L2224/85399 , H01L2924/00014 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H05K1/111 , H05K3/3436 , H05K2201/094 , H05K2201/10734 , H05K2203/0465 , Y02P70/613 , H01L2924/00012 , H01L2224/45015 , H01L2924/207 , H01L2924/00 , H01L2224/45099
摘要： A semiconductor part for component mounting, a mounting structure and a mounting method providing ample surplus wiring pitch and width between terminals in order to improve the strength of the connection with the printed circuit board in view of the recent trends towards a greater number of pins and greater component mounting density on printed circuit boards or substrates. A semiconductor component for mounting has area terminals comprised of area terminals mounted on the outer circumferential side and area terminals mounted on the inner circumferential side of the board. The area terminals on the outer circumferential side of the board are arranged with a larger pitch and or diameter than the area terminals on the inner circumferential side. A mounting method and mounting structure having land terminals arrayed on a printed circuit board or substrate with the same arrangement as the area terminals of the semiconductor component, and the land terminals are connected with the area terminals by a conductive bonding agent.
摘要翻译：考虑到最近趋向于更多数量的引脚的趋势，用于元件安装的半导体部件，安装结构和安装方法在端子之间提供足够的剩余布线间距和宽度，以便提高与印刷电路板的连接强度在印刷电路板或基板上更大的元件安装密度。用于安装的半导体部件具有由安装在外周侧的区域端子和安装在基板的内周侧的区域端子构成的区域端子。板的外周侧的区域端子配置成比内周侧的区域端子更大的间距或直径。一种安装方法和安装结构，其具有以与半导体部件的区域端子相同的方式排列在印刷电路板或基板上的接地端子，并且接地端子通过导电接合剂与区域端子连接。

10. 发明授权

US08224970B2 Web-screen sharing system, web-screen sharing terminals, and sharing program thereof 失效
标题翻译：网络共享系统，网页共享终端及其共享程序
公开(公告)号：US08224970B2
公开(公告)日：2012-07-17
申请号：US12250142
申请日：2008-10-13
申请人： Kazuo Nishiyama
发明人： Kazuo Nishiyama
IPC分类号： G06F15/16
CPC分类号： G06F21/31 , G06F21/84 , G06F2221/2129 , H04L63/08 , H04L63/168
摘要： A Web-screen sharing system including a first and a second terminals, and a mediation server. The system includes: the terminals exchanging addresses through the mediation server; connecting the terminals using the addresses; when the first terminal is connected to any Web server, detecting whether a content in the Web server is security-protected; if protected, performing predetermined authentication processing with the Web server; when the authentication is successful, the Web server transmitting a content following the authentication processing to the first terminal; the first terminal displaying the content as a Web screen, and capturing the Web screen; transmitting an image file of the Web screen to the second terminal to display the screen on the second terminal, if not protected, the first terminal receiving the content from the Web server, and transmitting a URL at that time to the second terminal to display the Web screen.
摘要翻译：包括第一和第二终端的网络共享系统以及中介服务器。系统包括：终端通过中介服务器交换地址; 使用地址连接终端; 当第一终端连接到任何Web服务器时，检测Web服务器中的内容是否受到安全保护; 如果被保护，则执行与所述Web服务器的预定认证处理; 当所述认证成功时，所述Web服务器将认证处理之后的内容发送到所述第一终端; 所述第一终端将所述内容显示为Web屏幕，并且捕获所述Web屏幕; 将所述Web屏幕的图像文件发送到所述第二终端，以在所述第二终端上显示所述屏幕，如果不受保护，则所述第一终端从所述Web服务器接收所述内容，并且在该时间将URL发送到所述第二终端，网页画面。

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