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    • 3. 发明授权
    • Photosensitive resin film and cured film made therefrom
    • 感光树脂膜和由其制成的固化膜
    • US07214471B2
    • 2007-05-08
    • US10551447
    • 2004-03-25
    • Shin-ichiro IwanagaTooru KimuraKouji Nishikawa
    • Shin-ichiro IwanagaTooru KimuraKouji Nishikawa
    • G03F7/033
    • G03F7/031C08L33/04G03F7/029G03F7/033Y10S430/111Y10S430/121Y10S430/124C08L2666/02
    • The photosensitive resin film in an uncured state of the invention comprises (A) a specific alkali-soluble copolymer, (B) a compound having at least one ethylenically unsaturated double bond and (C) a radiation-sensitive radical polymerization initiator by the use of which a coating film having a dry film thickness of 70 μm in an uncured state has a 365 nm radiation transmittance of not less than 10% and a 405 nm radiation transmittance of not less than 60%, contains the radiation-sensitive radical polymerization initiator (C) in an amount of 20 to 40 parts by weight based on 100 parts by weight of the component (A), and has a dry film thickness of not less than 50 μm. According to the photosensitive resin film, a high bump having a height of not less than 50 μm can be readily formed on a chip substrate with high precision though formation of such a high bump is difficult by the conventional technique. Moreover, connection failure of an element can be inhibited, and reliability of an element can be enhanced.
    • 本发明的未固化状态的感光性树脂膜包含(A)特定的碱溶性共聚物,(B)具有至少一个烯键式不饱和双键的化合物和(C)使用辐射敏感性自由基聚合引发剂的 在未固化状态下具有70μm的干膜厚度的涂膜具有不小于10%的365nm辐射透射率和不小于60%的405nm辐射透射率,其含有辐射敏感性自由基聚合引发剂( C)相对于100重量份组分(A)为20至40重量份,干膜厚度不小于50微米。 根据感光性树脂膜,通过以往的技术难以形成这样高的凸起,难以高精度地在芯片基板上形成高度不小于50μm的高凸点。 此外,可以抑制元件的连接故障,并且可以提高元件的可靠性。
    • 5. 发明申请
    • Photosensitive resin film and cured film made therefrom
    • 感光树脂膜和由其制成的固化膜
    • US20060210912A1
    • 2006-09-21
    • US10551447
    • 2004-03-25
    • Shin-ichiro IwanagaTooru KimuraKouji Nishikawa
    • Shin-ichiro IwanagaTooru KimuraKouji Nishikawa
    • G03C1/76
    • G03F7/031C08L33/04G03F7/029G03F7/033Y10S430/111Y10S430/121Y10S430/124C08L2666/02
    • The photosensitive resin film in an uncured state of the invention comprises (A) a specific alkali-soluble copolymer, (B) a compound having at least one ethylenically unsaturated double bond and (C) a radiation-sensitive radical polymerization initiator by the use of which a coating film having a dry film thickness of 70 μm in an uncured state has a 365 nm radiation transmittance of not less than 10% and a 405 nm radiation transmittance of not less than 60%, contains the radiation-sensitive radical polymerization initiator (C) in an amount of 20 to 40 parts by weight based on 100 parts by weight of the component (A), and has a dry film thickness of not less than 50 μm. According to the photosensitive resin film, a high bump having a height of not less than 50 μm can be readily formed on a chip substrate with high precision though formation of such a high bump is difficult by the conventional technique. Moreover, connection failure of an element can be inhibited, and reliability of an element can be enhanced.
    • 本发明的未固化状态的感光性树脂膜包含(A)特定的碱溶性共聚物,(B)具有至少一个烯键式不饱和双键的化合物和(C)使用辐射敏感性自由基聚合引发剂的 在未固化状态下具有70μm的干膜厚度的涂膜具有不小于10%的365nm辐射透射率和不小于60%的405nm辐射透射率,其含有辐射敏感性自由基聚合引发剂( C)相对于100重量份组分(A)为20至40重量份,干膜厚度不小于50微米。 根据感光性树脂膜,通过以往的技术难以形成这样高的凸起,难以高精度地在芯片基板上形成高度不小于50μm的高凸点。 此外,可以抑制元件的连接故障,并且可以提高元件的可靠性。
    • 7. 发明申请
    • RADIATION-SENSITIVE POSITIVE RESIN COMPOSITION FOR PRODUCING PLATINGS, TRANSFER FILM, AND PROCESS FOR PRODUCING PLATINGS
    • 用于生产镀层的辐射敏感性阳性树脂组合物,转印膜和用于生产镀层的方法
    • US20070196765A1
    • 2007-08-23
    • US11677339
    • 2007-02-21
    • Kousuke MORIKouji Nishikawa
    • Kousuke MORIKouji Nishikawa
    • G03C1/00
    • G03F7/0392G03F7/40
    • A radiation-sensitive positive resin composition is excellent in sensitivity, resolution and adhesion to a substrate and is developed to form clear apertures without residues. The composition does not contaminate a plating solution and is capable of forming a resin film (resist) that is resistant to cracks after plating, resistant to indentation by platings, and resistant to lifting. A transfer film has the composition. A process of the invention produces thick platings as bumps or wirings with high precision.The radiation-sensitive positive resin composition for producing platings includes a polymer (A) that has at least one end terminated with —SR (wherein R is a linear or branched alkyl group of 1 to 20 carbon atoms, a cyclic alkyl group of 3 to 20 carbon atoms, or a derivative thereof) and includes a structural unit having an acid-dissociative functional group which is dissociated by an acid to yield an acidic functional group; a radiation-sensitive acid generator (B); and an organic solvent (C).
    • 辐射敏感的阳性树脂组合物的灵敏度,分辨率和对基材的粘附性优异,并被开发以形成没有残留物的透明孔。 该组合物不会污染电镀液,能够形成耐电镀后的裂纹的树脂膜(抗蚀剂),耐电镀压痕,耐起重。 转印膜具有组成。 本发明的方法产生具有高精度的作为凸起或布线的厚电镀。 用于制备电镀的辐射敏感性阳性树脂组合物包括具有至少一个末端以-SR(其中R为碳原子数1〜20的直链或支链烷基),环烷基3〜 20个碳原子或其衍生物),并且包括具有酸解离官能团的结构单元,其被酸解离以产生酸性官能团; 辐射敏感酸产生剂(B); 和有机溶剂(C)。
    • 9. 发明申请
    • TONER
    • 托尼
    • US20090197193A1
    • 2009-08-06
    • US12420336
    • 2009-04-08
    • Yoshihiro OgawaYusuke HasegawaKouji NishikawaMiho OkazakiTakashige Kasuya
    • Yoshihiro OgawaYusuke HasegawaKouji NishikawaMiho OkazakiTakashige Kasuya
    • G03G9/08
    • G03G9/08782G03G9/0812
    • To provide a toner which has superior low-temperature fixing performance, high-temperature anti-offsetting properties and developing performance and may cause neither melt sticking of toner to photosensitive member nor turn-up of cleaning blade. The toner contains at least a binder resin, a colorant and a wax, and the wax is characterized by i) being an oxidized hydrocarbon wax, ii) having a hydroxyl value of from 5 mgKOH/g or more to 150 mgKOH/g or less, and iii) having, in molecular weight distribution measured by gel permeation chromatography of tetrahydrofuran-soluble matter, a main peak within the range of molecular weight of from 200 or more to 600 or less, and a component with a molecular weight of 700 or more in a content of 3% by mass or less.
    • 为了提供具有优异的低温定影性能,高温抗粘着性和显影性能的调色剂,并且不会使调色剂熔融粘附到感光构件上,也不会导致清洁刮片的翻转。 调色剂至少含有粘合剂树脂,着色剂和蜡,并且蜡的特征在于i)是氧化烃蜡,ii)羟值为5mgKOH / g以上至150mgKOH / g以下 ,和iii)在分子量为200以上且600以下的主峰和分子量为700以下的成分中,具有通过四氢呋喃可溶物质的凝胶渗透色谱法测定的分子量分布, 更多的是3质量%以下的含量。