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1. 发明授权

US06992250B2 Electronic component housing package and electronic apparatus 有权
标题翻译：电子元器件封装和电子设备
公开(公告)号：US06992250B2
公开(公告)日：2006-01-31
申请号：US11067518
申请日：2005-02-25
申请人： Kouji Kubota , Taizou Suemitsu , Takeo Satake , Akiko Matsuzaki , Atsushi Ogasawara , Nobuyuki Tanaka
发明人： Kouji Kubota , Taizou Suemitsu , Takeo Satake , Akiko Matsuzaki , Atsushi Ogasawara , Nobuyuki Tanaka
IPC分类号： H01L23/02
CPC分类号： H01L23/047 , H01L24/48 , H01L24/49 , H01L2224/48091 , H01L2224/48227 , H01L2224/49171 , H01L2924/00014 , H01L2924/01012 , H01L2924/0102 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/12032 , H01L2924/12042 , H01L2924/12043 , H01L2924/16195 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An electronic component housing package includes a base body made of a metal; a rectangular frame body made of a metal; an input/output terminal made of insulating material, which has line conductor for electrically conductively connecting the interior and exterior of the frame body; and an input/output terminal mounting portion, into which input/output terminal is fitted and which is formed as a notch extending across two adjacent corners of a frame body's lower part. The input/output terminal is so configured that its opposed end-face pair at two corners are made flush with opposed outer-side-surface pair including two corners of frame body, and that metal layer is applied to both of a part of an input/output terminal's end-face extending along the mounting portion and another part thereof extending along the base body.
摘要翻译：电子部件壳体包装体包括由金属制成的基体; 由金属制成的矩形框体; 由绝缘材料制成的输入/输出端子，其具有用于导电地连接框架体的内部和外部的线路导体; 以及输入/输出端子安装部分，输入/输出端子装配到该输入/输出端子安装部分中，并且形成为延伸穿过框体下部的两个相邻拐角的凹口。输入/输出端子被配置成使得其两个拐角处的相对的端面对与包括框架主体的两个角的相对的外侧表面对齐，并且该金属层被施加到输入的一部分 /输出端子的端面沿着安装部分延伸，另一部分沿基体延伸。

2. 发明申请

US20050207092A1 Electronic component housing package and electronic apparatus 有权
标题翻译：电子元器件封装和电子设备
公开(公告)号：US20050207092A1
公开(公告)日：2005-09-22
申请号：US11067518
申请日：2005-02-25
申请人： Kouji Kubota , Taizou Suemitsu , Takeo Satake , Akiko Matsuzaki , Atsushi Ogasawara , Nobuyuki Tanaka
发明人： Kouji Kubota , Taizou Suemitsu , Takeo Satake , Akiko Matsuzaki , Atsushi Ogasawara , Nobuyuki Tanaka
IPC分类号： H01G4/228 , H01L23/047
CPC分类号： H01L23/047 , H01L24/48 , H01L24/49 , H01L2224/48091 , H01L2224/48227 , H01L2224/49171 , H01L2924/00014 , H01L2924/01012 , H01L2924/0102 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/12032 , H01L2924/12042 , H01L2924/12043 , H01L2924/16195 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An electronic component housing package includes a base body made of a metal; a rectangular frame body made of a metal; an input/output terminal made of insulating material, which has line conductor for electrically conductively connecting the interior and exterior of the frame body; and an input/output terminal mounting portion, into which input/output terminal is fitted and which is formed as a notch extending across two adjacent corners of a frame body's lower part. The input/output terminal is so configured that its opposed end-face pair at two corners are made flush with opposed outer-side-surface pair including two corners of frame body, and that metal layer is applied to both of a part of an input/output terminal's end-face extending along the mounting portion and another part thereof extending along the base body.
摘要翻译：电子部件壳体包装体包括由金属制成的基体; 由金属制成的矩形框体; 由绝缘材料制成的输入/输出端子，其具有用于导电地连接框架体的内部和外部的线路导体; 以及输入/输出端子安装部分，输入/输出端子装配到该输入/输出端子安装部分中，并且形成为延伸穿过框体下部的两个相邻拐角的凹口。输入/输出端子被配置成使得其两个拐角处的相对的端面对与包括框架主体的两个角的相对的外侧表面对齐，并且该金属层被施加到输入的一部分 /输出端子的端面沿着安装部分延伸，另一部分沿基体延伸。

3. 发明授权

US07165899B2 Package for housing optical semiconductor element and optical semiconductor apparatus 失效
标题翻译：外壳光半导体元件和光半导体器件封装
公开(公告)号：US07165899B2
公开(公告)日：2007-01-23
申请号：US10977557
申请日：2004-10-29
申请人： Akiko Matsuzaki , Hiroshi Shibayama
发明人： Akiko Matsuzaki , Hiroshi Shibayama
IPC分类号： G02B6/36
CPC分类号： H01L31/0203 , G02B6/4202 , H01L2224/48091 , H01L2924/3011 , H01S5/02212 , H01S5/02284 , H01L2924/00014 , H01L2924/00
摘要： Provided is a package for housing an optical semiconductor element including: a metal-made base body; a metal-made lid body; a light-transmitting member; and an input/output terminal joined to the upper principal surface of the base body so as to cover a through bore. The input/output terminal includes: a dielectric-made first plate portion; a line conductor extending from one base body-side edge to another edge opposite thereto; a dielectric-made second plate portion stacked with its one base body-side end face made flush with the first plate portion; a metal plate made higher than the first plate portion and stacked with its one base body-side end face made flush with the first plate portion; and a lead terminal attached to the lower surface of the input/output terminal lying inside the through bore and electrically connected to the line conductor.
摘要翻译：提供一种用于容纳光学半导体元件的封装，包括：金属制的基体; 金属制的盖体; 透光构件; 以及连接到基体的上主表面以便覆盖通孔的输入/输出端子。输入/输出端子包括：电介质制造的第一板部分; 从一个基体侧边缘延伸到另一边缘的线路导体; 电介质制造的第二板部分，其与其第一板部分齐平的一个基体侧端面堆叠; 制成高于第一板部并与其一个基体侧端面堆叠的金属板与第一板部齐平; 以及引线端子，其连接到位于所述通孔内部的所述输入/输出端子的下表面并电连接到所述线路导体。

4. 发明申请

US20050141826A1 Package for housing optical semiconductor element and optical semiconductor apparatus 失效
标题翻译：外壳光半导体元件和光半导体器件封装
公开(公告)号：US20050141826A1
公开(公告)日：2005-06-30
申请号：US10977557
申请日：2004-10-29
申请人： Akiko Matsuzaki , Hiroshi Shibayama
发明人： Akiko Matsuzaki , Hiroshi Shibayama
IPC分类号： H01L23/02 , G02B6/42 , H01L31/0203 , H01S5/022 , G02B6/36
CPC分类号： H01L31/0203 , G02B6/4202 , H01L2224/48091 , H01L2924/3011 , H01S5/02212 , H01S5/02284 , H01L2924/00014 , H01L2924/00
摘要： Provided is a package for housing an optical semiconductor element including: a metal-made base body; a metal-made lid body; a light-transmitting member; and an input/output terminal joined to the upper principal surface of the base body so as to cover a through bore. The input/output terminal includes: a dielectric-made first plate portion; a line conductor extending from one base body-side edge to another edge opposite thereto; a dielectric-made second plate portion stacked with its one base body-side end face made flush with the first plate portion; a metal plate made higher than the first plate portion and stacked with its one base body-side end face made flush with the first plate portion; and a lead terminal attached to the lower surface of the input/output terminal lying inside the through bore and electrically connected to the line conductor.
摘要翻译：提供一种用于容纳光学半导体元件的封装，包括：金属制的基体; 金属制的盖体; 透光构件; 以及连接到基体的上主表面以便覆盖通孔的输入/输出端子。输入/输出端子包括：电介质制造的第一板部分; 从一个基体侧边缘延伸到另一边缘的线路导体; 电介质制造的第二板部分，其与其第一板部分齐平的一个基体侧端面堆叠; 制成高于第一板部并与其一个基体侧端面堆叠的金属板与第一板部齐平; 以及引线端子，其连接到位于所述通孔内部的所述输入/输出端子的下表面并电连接到所述线路导体。

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