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1. 发明申请

US20050074912A1 Method for manufacturing solid-state imaging devices 有权
标题翻译：固态成像装置的制造方法
公开(公告)号：US20050074912A1
公开(公告)日：2005-04-07
申请号：US10927715
申请日：2004-08-27
申请人： Kouichi Yamauchi , Masanori Minamio , Katsutoshi Shimizu , Haruto Nagata
发明人： Kouichi Yamauchi , Masanori Minamio , Katsutoshi Shimizu , Haruto Nagata
IPC分类号： H01L27/14 , H01L21/00 , H01L21/50 , H01L23/00 , H01L23/02 , H01L23/34 , H01L23/50 , H01L27/146 , H01L31/0203 , H04N5/335 , H04N101/00
CPC分类号： H01L27/14618 , H01L24/73 , H01L24/97 , H01L27/14625 , H01L27/14683 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01078 , H01L2924/01082 , H01L2924/15153 , H01L2924/15165 , H01L2924/16195 , H01L2924/181 , H01L2924/00014 , H01L2224/83 , H01L2224/85 , H01L2924/00 , H01L2924/00012
摘要： A solid-state imaging device is manufactured according to the steps below. A lattice-shaped rib forming member, which is an aggregation of a plurality of frame-shaped ribs for configuring a plurality of solid-state imaging devices, is resin-molded. An aggregate wiring board is used, which has regions corresponding to a plurality of the wiring boards, and in which a plurality of the wiring members are provided in each of the regions, and the imaging element is fastened to each region of the aggregate wiring board and the electrodes of the imaging elements and the wiring members are connected by a thin metal wire. The rib forming member is placed on the wiring board face and joined to the wiring board face, so that the imaging element is disposed inside the lattice elements of the rib forming member. The transparent plate is fastened to an upper face of the rib forming member, and each housing is cut in a direction perpendicular to the base portion, and in a direction dividing into two the width of the rib forming member, and separating the solid-state imaging devices into individual pieces It is possible to make a low cost housing, avoiding deformations caused by a difference in thermal expansion between the wiring board and the ribs made of a resin, when forming a plurality of housings together.
摘要翻译：根据以下步骤制造固态成像装置。作为用于配置多个固态成像装置的多个框状肋的聚集体的格子状肋形成构件被树脂模制。使用具有与多个布线板对应的区域的集合布线板，并且在各区域中设置有多个布线构件，并且将摄像元件紧固到聚集布线板的各个区域并且成像元件的电极和布线构件通过细金属丝连接。肋形成构件被放置在布线板面上并且接合到布线板面，使得成像元件设置在肋形成构件的格子元件的内部。将透明板紧固到肋形成构件的上表面，并且将每个壳体沿垂直于基部的方向切割，并且沿着分成肋形成构件的宽度的两个方向切割，并且将固态成像装置成为单独的部件当将多个壳体一起形成时，可以制造低成本的壳体，以避免由布线板和由树脂制成的肋之间的热膨胀差引起的变形。

2. 发明授权

US07247509B2 Method for manufacturing solid-state imaging devices 有权
标题翻译：固态成像装置的制造方法
公开(公告)号：US07247509B2
公开(公告)日：2007-07-24
申请号：US10927715
申请日：2004-08-27
申请人： Kouichi Yamauchi , Masanori Minamio , Katsutoshi Shimizu , Haruto Nagata
发明人： Kouichi Yamauchi , Masanori Minamio , Katsutoshi Shimizu , Haruto Nagata
IPC分类号： H01L21/00
CPC分类号： H01L27/14618 , H01L24/73 , H01L24/97 , H01L27/14625 , H01L27/14683 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01078 , H01L2924/01082 , H01L2924/15153 , H01L2924/15165 , H01L2924/16195 , H01L2924/181 , H01L2924/00014 , H01L2224/83 , H01L2224/85 , H01L2924/00 , H01L2924/00012
摘要： A solid-state imaging device is manufactured according to the steps below. A lattice-shaped rib forming member, which is an aggregation of a plurality of frame-shaped ribs for configuring a plurality of solid-state imaging devices, is resin-molded. An aggregate wiring board is used, which has regions corresponding to a plurality of the wiring boards, and in which a plurality of the wiring members are provided in each of the regions, and the imaging element is fastened to each region of the aggregate wiring board and the electrodes of the imaging elements and the wiring members are connected by a thin metal wire. The rib forming member is placed on the wiring board face and joined to the wiring board face, so that the imaging element is disposed inside the lattice elements of the rib forming member. The transparent plate is fastened to an upper face of the rib forming member, and each housing is cut in a direction perpendicular to the base portion, and in a direction dividing into two the width of the rib forming member, and separating the solid-state imaging devices into individual pieces It is possible to make a low cost housing, avoiding deformations caused by a difference in thermal expansion between the wiring board and the ribs made of a resin, when forming a plurality of housings together.
摘要翻译：根据以下步骤制造固态成像装置。作为用于配置多个固态成像装置的多个框状肋的聚集体的格子状肋形成构件被树脂模制。使用具有与多个布线板对应的区域的集合布线板，并且在各区域中设置有多个布线构件，并且将摄像元件紧固到聚集布线板的各个区域并且成像元件的电极和布线构件通过细金属丝连接。肋形成构件被放置在布线板面上并且接合到布线板面，使得成像元件设置在肋形成构件的格子元件的内部。将透明板紧固到肋形成构件的上表面，并且将每个壳体沿垂直于基部的方向切割，并且沿着分成肋形成构件的宽度的两个方向切割，并且将固态成像装置成为单独的部件当将多个壳体一起形成时，可以制造低成本的壳体，以避免由布线板和由树脂制成的肋之间的热膨胀差引起的变形。

3. 发明申请

US20050088565A1 Solid-state imaging device 有权
标题翻译：固态成像装置
公开(公告)号：US20050088565A1
公开(公告)日：2005-04-28
申请号：US10969822
申请日：2004-10-21
申请人： Katsutoshi Shimizu , Masanori Minamio , Kouichi Yamauchi
发明人： Katsutoshi Shimizu , Masanori Minamio , Kouichi Yamauchi
IPC分类号： H01L27/14 , H01L23/02 , H01L23/04 , H01L23/08 , H01L23/50 , H01L27/146 , H01L31/0203 , H04N5/335 , H04N5/372 , H04N5/225
CPC分类号： H01L27/14618 , H01L24/32 , H01L24/97 , H01L27/14683 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/181 , H01L2924/00014 , H01L2924/00
摘要： A solid-state imaging-device includes a base, frame-shaped ribs provided on the base and forming an internal space, a plurality of wiring members for electrically leading the internal space of a housing formed by the base and the ribs to an external portion, an imaging element fixed to the base inside the internal space, a transparent plate fixed to an upper surface of the ribs, and connecting members electrically connecting electrodes of the imaging element to the wiring members, wherein a plurality of protrusions are provided in a region of the base that faces the imaging element, and the imaging element is fixed by adhesive to the base while being supported by the protrusions. The protrusions enable the imaging element to avoid distortion caused by following the surface of the base, thereby suppressing the effect on electrical properties of the imaging element.
摘要翻译：固态成像装置包括基部，设置在基部上并形成内部空间的框状肋，多个布线构件，用于将由基部和肋形成的壳体的内部空间电引导到外部部分，固定在内部空间内的基座的成像元件，固定到肋的上表面的透明板，以及将成像元件的电极电连接到布线构件的连接构件，其中在区域中设置多个突起面向成像元件的基部，并且成像元件通过粘合剂固定到基部，同时由突起支撑。突起使得成像元件能够避免由于跟随基底的表面引起的变形，从而抑制对成像元件的电性能的影响。

4. 发明授权

US07719585B2 Solid-state imaging device 有权
标题翻译：固态成像装置
公开(公告)号：US07719585B2
公开(公告)日：2010-05-18
申请号：US12510562
申请日：2009-07-28
申请人： Katsutoshi Shimizu , Masanori Minamio , Kouichi Yamauchi
发明人： Katsutoshi Shimizu , Masanori Minamio , Kouichi Yamauchi
IPC分类号： H04N3/14 , H04N5/225 , H01J40/14 , H01L21/00
CPC分类号： H01L27/14618 , H01L24/32 , H01L24/97 , H01L27/14683 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/181 , H01L2924/00014 , H01L2924/00
摘要： A solid-state imaging-device includes a base, frame-shaped ribs provided on the base and forming an internal space, a plurality of wiring members for electrically leading the internal space of a housing formed by the base and the ribs to an external portion, an imaging element fixed to the base inside the internal space, a transparent plate fixed to an upper surface of the ribs, and connecting members electrically connecting electrodes of the imaging element to the wiring members, wherein a plurality of protrusions are provided in a region of the base that faces the imaging element, and the imaging element is fixed by adhesive to the base while being supported by the protrusions. The protrusions enable the imaging element to avoid distortion caused by following the surface of the base, thereby suppressing the effect on electrical properties of the imaging element.
摘要翻译：固态成像装置包括基部，设置在基部上并形成内部空间的框状肋，多个布线构件，用于将由基部和肋形成的壳体的内部空间电引导到外部部分，固定在内部空间内的基座的成像元件，固定到肋的上表面的透明板，以及将成像元件的电极电连接到布线构件的连接构件，其中在区域中设置多个突起面向成像元件的基部，并且成像元件通过粘合剂固定到基部，同时由突起支撑。突起使得成像元件能够避免由于跟随基底的表面引起的变形，从而抑制对成像元件的电性能的影响。

5. 发明申请

US20050109926A1 Solid-state imaging device and method for manufacturing the same 有权
标题翻译：固态成像装置及其制造方法
公开(公告)号：US20050109926A1
公开(公告)日：2005-05-26
申请号：US10970533
申请日：2004-10-21
申请人： Masanori Minamio , Kouichi Yamauchi , Katsutoshi Shimizu
发明人： Masanori Minamio , Kouichi Yamauchi , Katsutoshi Shimizu
IPC分类号： H01L27/14 , H01L23/02 , H01L27/146 , H01L31/0203 , H04N5/335 , H01J40/14
CPC分类号： H01L27/14683 , H01L27/14618 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： A solid-state imaging device includes a wiring board composed of an insulating resin, frame-shaped ribs arranged on the wiring board, a transparent plate arranged on an upper surface of the ribs, a plurality of wiring members that electrically lead from an internal space of a case formed by the wiring board and the ribs to the outside, an imaging element fixed on the wiring board within the internal space, and connecting members which connect electrodes of the imaging element and the wiring members. The ribs are formed by resin molding directly onto a face of the transparent plate, and a lower surface of the ribs is fixed to the wiring board with an adhesive. The package is configured without adhesive interposed between the ribs and the transparent sealing plate, thereby reducing the effect on incident light.
摘要翻译：一种固态成像装置，包括由绝缘树脂构成的布线基板，配置在布线基板上的框状的肋，配置在肋的上表面的透明板，从内部空间由布线板和肋构成的壳体的外部，固定在内部空间内的配线基板上的摄像元件和连接摄像元件的电极和配线构件的连接构件。肋通过树脂成型直接形成在透明板的表面上，并且肋的下表面用粘合剂固定到布线板。该封装被构造成没有粘合剂插入在肋和透明密封板之间，从而减少对入射光的影响。

6. 发明申请

US20050044618A1 Solid-state imaging device and method for manufacturing the same 有权
标题翻译：固态成像装置及其制造方法
公开(公告)号：US20050044618A1
公开(公告)日：2005-03-03
申请号：US10931101
申请日：2004-08-31
申请人： Katsutoshi Shimizu , Masanori Minamio , Kouichi Yamauchi
发明人： Katsutoshi Shimizu , Masanori Minamio , Kouichi Yamauchi
IPC分类号： H01L27/14 , E04H4/00 , H01L23/00 , H01L23/02 , H01L23/08 , H01L23/10 , H01L23/50 , H01L27/146 , H01L31/0203 , H04N5/335 , H04N101/00
CPC分类号： H01L27/14618 , H01L24/97 , H01L31/0203 , H01L2224/48247 , H01L2224/48465 , H01L2224/49171 , H01L2224/73265 , H01L2924/181 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要： A solid-state imaging device comprises a housing in which a base and ribs forming a rectangular frame are formed in one piece by a resin; a plurality of metal lead pieces embedded in the housing, each of which has an internal terminal portion facing an internal space of the housing and an external terminal portion exposed at an outer portion of the housing; an imaging element arranged on the base in the internal space of the housing; connecting members connecting electrodes of the imaging element to the internal terminal portions of the metal lead pieces; and a transparent plate fastened to an upper face of the ribs. The upper face of the ribs is provided with a lower step portion that is lowered along an external periphery, and the transparent plate is fastened to the upper face of the ribs by an adhesive filled at least into the lower step portion. The joint between the ribs and the transparent plate has a cushioning effect with respect to stress caused by thermal deformation and the like, improving durability.
摘要翻译：固态成像装置包括壳体，其中形成矩形框架的基部和肋部由树脂一体地形成; 嵌入在所述壳体中的多个金属引线片，每个所述金属引线片具有面向所述壳体的内部空间的内部端子部分和暴露在所述壳体的外部的外部端子部分; 成像元件，布置在所述基座的所述壳体的内部空间中; 连接构件将摄像元件的电极连接到金属引线片的内部端子部分; 以及固定到肋的上表面的透明板。肋的上表面设置有沿着外周降低的下台阶部，并且透明板通过至少填充到下台阶部中的粘合剂紧固到肋的上表面。肋和透明板之间的接合对于由热变形等引起的应力具有缓冲效果，提高了耐久性。

7. 发明授权

US07691678B2 Solid-state imaging device and method for manufacturing the same 失效
标题翻译：固态成像装置及其制造方法
公开(公告)号：US07691678B2
公开(公告)日：2010-04-06
申请号：US12080557
申请日：2008-04-03
申请人： Katsutoshi Shimizu , Masanori Minamio , Kouichi Yamauchi
发明人： Katsutoshi Shimizu , Masanori Minamio , Kouichi Yamauchi
IPC分类号： H01L21/00
CPC分类号： H01L27/14618 , H01L24/97 , H01L31/0203 , H01L2224/48247 , H01L2224/48465 , H01L2224/49171 , H01L2224/73265 , H01L2924/181 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要： A solid-state imaging device comprises a housing in which a base and ribs forming a rectangular frame are formed in one piece by a resin; a plurality of metal lead pieces embedded in the housing, each of which has an internal terminal portion facing an internal space of the housing and an external terminal portion exposed at an outer portion of the housing; an imaging element arranged on the base in the internal space of the housing; connecting members connecting electrodes of the imaging element to the internal terminal portions of the metal lead pieces; and a transparent plate fastened to an upper face of the ribs. The upper face of the ribs is provided with a lower step portion that is lowered along an external periphery, and the transparent plate is fastened to the upper face of the ribs by an adhesive filled at least into the lower step portion. The joint between the ribs and the transparent plate has a cushioning effect with respect to stress caused by thermal deformation and the like, improving durability.
摘要翻译：固态成像装置包括壳体，其中形成矩形框架的基部和肋部由树脂一体地形成; 嵌入在所述壳体中的多个金属引线片，每个所述金属引线片具有面向所述壳体的内部空间的内部端子部分和暴露在所述壳体的外部的外部端子部分; 成像元件，布置在所述基座的所述壳体的内部空间中; 连接构件将摄像元件的电极连接到金属引线片的内部端子部分; 以及固定到肋的上表面的透明板。肋的上表面设置有沿着外周降低的下台阶部，并且透明板通过至少填充到下台阶部中的粘合剂紧固到肋的上表面。肋和透明板之间的接合对于由热变形等引起的应力具有缓冲效果，提高了耐久性。

8. 发明授权

US07378748B2 Solid-state imaging device and method for manufacturing the same 有权
标题翻译：固态成像装置及其制造方法
公开(公告)号：US07378748B2
公开(公告)日：2008-05-27
申请号：US10931101
申请日：2004-08-31
申请人： Katsutoshi Shimizu , Masanori Minamio , Kouichi Yamauchi
发明人： Katsutoshi Shimizu , Masanori Minamio , Kouichi Yamauchi
IPC分类号： H01L23/29
CPC分类号： H01L27/14618 , H01L24/97 , H01L31/0203 , H01L2224/48247 , H01L2224/48465 , H01L2224/49171 , H01L2224/73265 , H01L2924/181 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要： A solid-state imaging device comprises a housing in which a base and ribs forming a rectangular frame are formed in one piece by a resin; a plurality of metal lead pieces embedded in the housing, each of which has an internal terminal portion facing an internal space of the housing and an external terminal portion exposed at an outer portion of the housing; an imaging element arranged on the base in the internal space of the housing; connecting members connecting electrodes of the imaging element to the internal terminal portions of the metal lead pieces; and a transparent plate fastened to an upper face of the ribs. The upper face of the ribs is provided with a lower step portion that is lowered along an external periphery, and the transparent plate is fastened to the upper face of the ribs by an adhesive filled at least into the lower step portion. The joint between the ribs and the transparent plate has a cushioning effect with respect to stress caused by thermal deformation and the like, improving durability.
摘要翻译：固态成像装置包括壳体，其中形成矩形框架的基部和肋部由树脂一体地形成; 嵌入在所述壳体中的多个金属引线片，每个所述金属引线片具有面向所述壳体的内部空间的内部端子部分和暴露在所述壳体的外部的外部端子部分; 成像元件，布置在所述基座的所述壳体的内部空间中; 连接构件将摄像元件的电极连接到金属引线片的内部端子部分; 以及固定到肋的上表面的透明板。肋的上表面设置有沿着外周降低的下台阶部，并且透明板通过至少填充到下台阶部中的粘合剂紧固到肋的上表面。肋和透明板之间的接合对于由热变形等引起的应力具有缓冲效果，提高了耐久性。

9. 发明授权

US07586529B2 Solid-state imaging device 有权
标题翻译：固态成像装置
公开(公告)号：US07586529B2
公开(公告)日：2009-09-08
申请号：US10969822
申请日：2004-10-21
申请人： Katsutoshi Shimizu , Masanori Minamio , Kouichi Yamauchi
发明人： Katsutoshi Shimizu , Masanori Minamio , Kouichi Yamauchi
IPC分类号： H04N3/14 , H01J40/14 , H01L21/00 , H04N5/225
CPC分类号： H01L27/14618 , H01L24/32 , H01L24/97 , H01L27/14683 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/181 , H01L2924/00014 , H01L2924/00
摘要： A solid-state imaging-device includes a base, frame-shaped ribs provided on the base and forming an internal space, a plurality of wiring members for electrically leading the internal space of a housing formed by the base and the ribs to an external portion, an imaging element fixed to the base inside the internal space, a transparent plate fixed to an upper surface of the ribs, and connecting members electrically connecting electrodes of the imaging element to the wiring members, wherein a plurality of protrusions are provided in a region of the base that faces the imaging element, and the imaging element is fixed by adhesive to the base while being supported by the protrusions. The protrusions enable the imaging element to avoid distortion caused by following the surface of the base, thereby suppressing the effect on electrical properties of the imaging element.
摘要翻译：固态成像装置包括基部，设置在基部上并形成内部空间的框状肋，多个布线构件，用于将由基部和肋形成的壳体的内部空间电引导到外部部分，固定在内部空间内的基座的成像元件，固定到肋的上表面的透明板，以及将成像元件的电极电连接到布线构件的连接构件，其中在区域中设置多个突起面向成像元件的基部，并且成像元件通过粘合剂固定到基部，同时由突起支撑。突起使得成像元件能够避免由于跟随基底的表面引起的变形，从而抑制对成像元件的电性能的影响。

10. 发明申请

US20080194055A1 Solid-state imaging device and method for manufacturing the same 失效
公开(公告)号：US20080194055A1
公开(公告)日：2008-08-14
申请号：US12080557
申请日：2008-04-03
申请人： Katsutoshi Shimizu , Masanori Minamio , Kouichi Yamauchi
发明人： Katsutoshi Shimizu , Masanori Minamio , Kouichi Yamauchi
IPC分类号： H01L21/00
CPC分类号： H01L27/14618 , H01L24/97 , H01L31/0203 , H01L2224/48247 , H01L2224/48465 , H01L2224/49171 , H01L2224/73265 , H01L2924/181 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要： A solid-state imaging device comprises a housing in which a base and ribs forming a rectangular frame are formed in one piece by a resin; a plurality of metal lead pieces embedded in the housing, each of which has an internal terminal portion facing an internal space of the housing and an external terminal portion exposed at an outer portion of the housing; an imaging element arranged on the base in the internal space of the housing; connecting members connecting electrodes of the imaging element to the internal terminal portions of the metal lead pieces; and a transparent plate fastened to an upper face of the ribs. The upper face of the ribs is provided with a lower step portion that is lowered along an external periphery, and the transparent plate is fastened to the upper face of the ribs by an adhesive filled at least into the lower step portion. The joint between the ribs and the transparent plate has a cushioning effect with respect to stress caused by thermal deformation and the like, improving durability.

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