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    • 4. 发明授权
    • Plating means
    • 电镀方式
    • US4348267A
    • 1982-09-07
    • US206873
    • 1980-11-14
    • Kouichi Shimamura
    • Kouichi Shimamura
    • H01H11/04C25D5/02C25D5/08H01L23/50H05K3/24C25D17/00C25D21/00
    • C25D5/02C25D5/08H01L2924/0002H05K3/241Y10S204/07
    • This invention relates to a plating means, wherein an accurate plating for a smaller work surface is carried out high-speedily. For this purpose, the smaller work surface is enclosed by a mask of the plating means, and a plating solution is jetted for the work surface from a nozzle disposed within a closed space of the mask inside. Further, the plating means according to this invention has means for suctioning and discharging speedily an extra plating solution together with atmosphere within the closed space as well as outer air induced by an outer air induction means. Further, the used plating solution is again returned to a plating solution tank by a preferred recycling system. Thus, consumption of the plating solution is saved greatly.
    • 电镀装置技术领域本发明涉及一种电镀装置,其中对于较小的工作表面进行高精度的电镀。 为此,较小的工作表面被电镀装置的掩模包围,并且从设置在掩模内部的封闭空间内的喷嘴喷射用于工作表面的电镀液。 此外,根据本发明的电镀装置具有用于在封闭空间内的气氛以及由外部空气感应装置引起的外部空气的同时,将额外的电镀液与空气一起快速抽吸和排出的装置。 此外,通过优选的再循环系统将所用的电镀溶液再次返回到镀液槽中。 因此,大大节省了电镀液的消耗。
    • 6. 发明授权
    • Plating process
    • 电镀工艺
    • US4287029A
    • 1981-09-01
    • US133130
    • 1980-03-24
    • Kouichi Shimamura
    • Kouichi Shimamura
    • H01H11/04C25D5/02C25D5/08H01L23/50H05K3/24
    • C25D5/02C25D5/08H01L2924/0002H05K3/241Y10S204/07
    • This invention relates to a plating process and its means, wherein an accurate plating for a smaller work surface is carried out high-speedily. For this purpose, the smaller work surface is enclosed by a mask of the plating means, and a plating solution is jetted for the work surface from a nozzle disposed within a closed space of the mask inside. Further, the plating process according to this invention has a step for suctioning and discharging speedily an extra plating solution together with atmosphere within the closed space as well as outer air induced by an outer air induction means. Further, the used plating solution is again returned to a plating solution tank by a preferred recycling system. Thus, the consumption of the plating solution is saved greatly.
    • 电镀工艺及其装置技术领域本发明涉及一种电镀工艺及其装置,其中对于较小的工作表面的精确镀层进行高速化。 为此,较小的工作表面被电镀装置的掩模包围,并且从设置在掩模内部的封闭空间内的喷嘴喷射用于工作表面的电镀液。 此外,根据本发明的电镀方法具有一个步骤,用于在封闭空间内的气氛以及由外部空气感应装置引起的外部空气的同时,将额外的电镀液与空气一起快速抽吸和排出。 此外,通过优选的再循环系统将所用的电镀溶液再次返回到镀液槽中。 因此,大大节省了电镀液的消耗。