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1. 发明申请

US20100035072A1 Lead-Free Solder Paste and Its Use 有权
标题翻译：无铅焊膏及其用途
公开(公告)号：US20100035072A1
公开(公告)日：2010-02-11
申请号：US11990278
申请日：2006-08-11
申请人： Shizuharu Watanabe , Hidekiyo Takaoka , Kosuke Nakano , Masafumi Seino , Ko Inaba
发明人： Shizuharu Watanabe , Hidekiyo Takaoka , Kosuke Nakano , Masafumi Seino , Ko Inaba
IPC分类号： B32B15/04 , B23K35/22 , B23K31/02
CPC分类号： H05K3/3484 , B22F1/0059 , B22F2001/0066 , B23K35/0244 , B23K35/025 , B23K35/264 , B23K35/3613 , B23K35/362 , C22C12/00 , H05K3/3463 , Y10T428/31678
摘要： A solder paste comprising a solder alloy powder and a flux. The volumetric expansion at the time of melting of the solder alloy is at most 0.5%. The flux contains a bisphenol A epoxy resin and a curing agent selected from a carboxylic anhydride and a dicarboxylic acid. The solder paste can be used in applications suitable for high-temperature solders. The solder alloy has an alloy composition comprising, in mass percent, 70-98% of Bi, a total of 0-0.5% of at least one substance selected from Ag, Cu, Sb, In, Zn, Ni, Cr, Fe, Mo, P, Ge, and Ga, and a remainder of Sn.
摘要翻译：包含焊料合金粉末和焊剂的焊膏。焊料合金熔化时的体积膨胀为0.5％以下。助熔剂含有双酚A型环氧树脂和选自羧酸酐和二羧酸的固化剂。焊膏可用于适用于高温焊料的应用中。所述焊料合金具有以质量％计含有Bi的70-98％，Al，Cu，Sb，In，Zn，Ni，Cr，Fe中的至少一种物质的总计为0〜0.5％ Mo，P，Ge和Ga，余量为Sn。

2. 发明申请

US20070245852A1 Solder paste and electronic device 有权
标题翻译：焊膏和电子设备
公开(公告)号：US20070245852A1
公开(公告)日：2007-10-25
申请号：US11812005
申请日：2007-06-14
申请人： Hidekiyo Takaoka , Kosuke Nakano
发明人： Hidekiyo Takaoka , Kosuke Nakano
IPC分类号： C22C1/04
CPC分类号： B23K35/0244 , B23K35/025 , B23K35/226 , B23K35/262 , B23K35/3006 , B23K35/3013 , B23K35/302 , B23K35/3613 , B23K35/362 , H05K3/3463 , H05K3/3484 , H05K2201/0218 , H05K2201/0272
摘要： In solder paste of the present invention, a first metal powder, a second metal powder, and a third metal powder are dispersed in a flux or a thermosetting resin. The first metal powder includes a first metal material such as Cu, Ag, Au, or Pd that serves as a base metal. A second metal material such as Sn or In that has a melting point lower than that of the first metal material is coated on the surface of the first metal material. The second metal powder is made of a metal material such as Sn or In that has a melting point lower than that of the first metal material. The third metal powder such as a Cu, Ag, Au or Pd powder has an average particle diameter smaller than that of the first metal material and can form compounds with the second metal material and the second metal powder. Accordingly, the likelihood of unreacted components remaining after a heat treatment can be suppressed, and even when a reflow treatment is repeated a plurality of times, a decrease in the bonding strength of solder bonding can be prevented.
摘要翻译：在本发明的焊膏中，将第一金属粉末，第二金属粉末和第三金属粉末分散在助熔剂或热固性树脂中。第一金属粉末包括用作贱金属的第一金属材料如Cu，Ag，Au或Pd。具有比第一金属材料低的熔点的第二金属材料如Sn或In涂覆在第一金属材料的表面上。第二金属粉末由熔点低于第一金属材料的Sn或In等金属材料制成。第三金属粉末如Cu，Ag，Au或Pd粉末的平均粒径小于第一金属材料的平均粒径，并可与第二金属材料和第二金属粉末形成化合物。因此，可以抑制在热处理后残留的未反应成分的可能性，并且即使重复多次回流处理，也可以防止焊接接合的接合强度的降低。

3. 发明授权

US09162324B2 Solder paste and solder joint 有权
标题翻译：焊膏和焊点
公开(公告)号：US09162324B2
公开(公告)日：2015-10-20
申请号：US12084793
申请日：2006-11-10
申请人： Kosuke Nakano , Hidekiyo Takaoka , Minoru Ueshima
发明人： Kosuke Nakano , Hidekiyo Takaoka , Minoru Ueshima
IPC分类号： B23K35/362 , B23K35/26 , B23K35/02 , B23K35/30 , H05K3/34
CPC分类号： B23K35/264 , B23K35/0244 , B23K35/025 , B23K35/26 , B23K35/262 , B23K35/302 , B23K35/362 , H05K3/3484 , H05K2201/0272
摘要： The invention provides a solder paste which has a solidus temperature of 255° C. or above and is improved in the wettability between Bi and Cu or Ag electrode to attain approximately equivalent wettability to those of Pb-containing high-temperature solders even in low-temperature soldering. The solder paste comprises a metal powder component consisting of Bi or a Bi alloy, a solidus temperature lowering metal for Bi, and a solid-phase metal capable of forming an intermetallic compound with the solidus temperature lowering metal, and a flux component.
摘要翻译：本发明提供了固相线温度为255℃以上的焊锡膏，并且提高了Bi和Cu或Ag电极之间的润湿性，以达到与含Pb高温焊料即使在低温焊料中几乎相同的润湿性，温度焊接。焊膏包括由Bi或Bi合金构成的金属粉末成分，Bi的固相降温金属和能够与固相线降温金属形成金属间化合物的固相金属和助熔剂成分。

4. 发明授权

US08920580B2 Solder paste and electronic device 有权
标题翻译：焊膏和电子设备
公开(公告)号：US08920580B2
公开(公告)日：2014-12-30
申请号：US11812005
申请日：2007-06-14
申请人： Hidekiyo Takaoka , Kosuke Nakano
发明人： Hidekiyo Takaoka , Kosuke Nakano
IPC分类号： B23K35/34
CPC分类号： B23K35/0244 , B23K35/025 , B23K35/226 , B23K35/262 , B23K35/3006 , B23K35/3013 , B23K35/302 , B23K35/3613 , B23K35/362 , H05K3/3463 , H05K3/3484 , H05K2201/0218 , H05K2201/0272
摘要： In solder paste of the present invention, a first metal powder, a second metal powder, and a third metal powder are dispersed in a flux or a thermosetting resin. The first metal powder includes a first metal material such as Cu, Ag, Au, or Pd that serves as a base metal. A second metal material such as Sn or In that has a melting point lower than that of the first metal material is coated on the surface of the first metal material. The second metal powder is made of a metal material such as Sn or In that has a melting point lower than that of the first metal material. The third metal powder such as a Cu, Ag, Au or Pd powder has an average particle diameter smaller than that of the first metal material and can form compounds with the second metal material and the second metal powder. Accordingly, the likelihood of unreacted components remaining after a heat treatment can be suppressed, and even when a reflow treatment is repeated a plurality of times, a decrease in the bonding strength of solder bonding can be prevented.
摘要翻译：在本发明的焊膏中，将第一金属粉末，第二金属粉末和第三金属粉末分散在助熔剂或热固性树脂中。第一金属粉末包括用作贱金属的第一金属材料如Cu，Ag，Au或Pd。具有比第一金属材料低的熔点的第二金属材料如Sn或In涂覆在第一金属材料的表面上。第二金属粉末由熔点低于第一金属材料的Sn或In等金属材料制成。第三金属粉末如Cu，Ag，Au或Pd粉末的平均粒径小于第一金属材料的平均粒径，并可与第二金属材料和第二金属粉末形成化合物。因此，可以抑制在热处理后残留的未反应成分的可能性，并且即使重复多次回流处理，也可以防止焊接接合的接合强度的降低。

5. 发明授权

US08227536B2 Lead-free solder paste and its use 有权
标题翻译：无铅锡膏及其用途
公开(公告)号：US08227536B2
公开(公告)日：2012-07-24
申请号：US11990278
申请日：2006-08-11
申请人： Shizuharu Watanabe , Hidekiyo Takaoka , Kosuke Nakano , Masafumi Seino , Ko Inaba
发明人： Shizuharu Watanabe , Hidekiyo Takaoka , Kosuke Nakano , Masafumi Seino , Ko Inaba
IPC分类号： C04B26/12
CPC分类号： H05K3/3484 , B22F1/0059 , B22F2001/0066 , B23K35/0244 , B23K35/025 , B23K35/264 , B23K35/3613 , B23K35/362 , C22C12/00 , H05K3/3463 , Y10T428/31678
摘要： A solder paste comprising a solder alloy powder and a flux. The volumetric expansion at the time of melting of the solder alloy is at most 0.5%. The flux contains a bisphenol A epoxy resin and a curing agent selected from a carboxylic anhydride and a dicarboxylic acid. The solder paste can be used in applications suitable for high-temperature solders. The solder alloy has an alloy composition comprising, in mass percent, 70-98% of Bi, a total of 0-0.5% of at least one substance selected from Ag, Cu, Sb, In, Zn, Ni, Cr, Fe, Mo, P, Ge, and Ga, and a remainder of Sn.
摘要翻译：包含焊料合金粉末和焊剂的焊膏。焊料合金熔化时的体积膨胀为0.5％以下。助熔剂含有双酚A型环氧树脂和选自羧酸酐和二羧酸的固化剂。焊膏可用于适用于高温焊料的应用中。所述焊料合金具有以质量％计含有Bi的70-98％，Al，Cu，Sb，In，Zn，Ni，Cr，Fe中的至少一种物质的总计为0〜0.5％ Mo，P，Ge和Ga，余量为Sn。

6. 发明授权

US08222751B2 Electroconductive bonding material and electronic apparatus 有权
标题翻译：导电接合材料和电子设备
公开(公告)号：US08222751B2
公开(公告)日：2012-07-17
申请号：US12394113
申请日：2009-02-27
申请人： Akihiro Nomura , Hidekiyo Takaoka , Kosuke Nakano
发明人： Akihiro Nomura , Hidekiyo Takaoka , Kosuke Nakano
IPC分类号： H01L23/29
CPC分类号： H05K3/321 , C08K3/08 , C08K7/00 , C09J9/02 , C09J11/04 , H01B1/22 , H05K2201/0272 , H05K2201/10636 , H05K2203/0425 , Y02P70/611 , Y10T428/2857 , Y10T428/31678
摘要： An electroconductive bonding material contains a thermosetting resin, a low-melting-point metal powder which is melted at a temperature equal to or lower than the thermosetting temperature of the thermosetting resin, a high-melting-point metal powder which is not melted at a temperature equal to or lower than the thermosetting temperature of the thermosetting resin and which reacts with the low-melting-point metal powder to form a reaction product having a high melting point of 300° C. or higher during heat-hardening of the thermosetting resin, and a reducing substance which removes an oxide formed on the surface of the high-melting-point metal powder. The total content of the low-melting-point metal powder and the high-melting-point metal powder is 75% to 88% by weight, and the particle size ratio D1/D2 of the average particle size D1 of the low-melting-point metal powder to the average particle size D2 of the high-melting-point metal powder is 0.5 to 6.0. Thereby, an electroconductive bonding material is provided which has good conduction properties and high connection strength even when reflow heat treatment is repeatedly carried out or thermal shock accompanied with a rapid temperature change is applied to the electroconductive bonding material, and an electronic apparatus using such an electroconductive bonding material.
摘要翻译：导电接合材料包含热固性树脂，在等于或低于热固性树脂的热固化温度的温度下熔化的低熔点金属粉末，在温度等于或低于热固性树脂的热固化温度，并且与低熔点金属粉末反应以形成热固性树脂的热硬化期间具有300℃以上的高熔点的反应产物以及除去形成在高熔点金属粉末的表面上的氧化物的还原物质。低熔点金属粉末和高熔点金属粉末的总含量为75〜88重量％，低熔点金属粉末和高熔点金属粉末的平均粒径D1的粒径比D1 / 点金属粉末与高熔点金属粉末的平均粒径D2为0.5〜6.0。由此，即使在反复进行回流热处理时也具有良好的导电性和高连接强度的导电性接合材料，或者对导电性接合材料施加伴随着快速变化的热冲击，使用这样的电子设备导电接合材料。

7. 发明申请

US20110067912A1 Electroconductive Bonding Material and Electronic Apparatus 有权
标题翻译：导电粘合材料和电子设备
公开(公告)号：US20110067912A1
公开(公告)日：2011-03-24
申请号：US12959752
申请日：2010-12-03
申请人： Akhiro Nomura , Hidekiyo Takaoka , Kosuke Nakano
发明人： Akhiro Nomura , Hidekiyo Takaoka , Kosuke Nakano
IPC分类号： H05K1/11 , H01B1/22
CPC分类号： H05K3/321 , C08K3/08 , C08K7/00 , C09J9/02 , C09J11/04 , H01B1/22 , H05K2201/0272 , H05K2201/10636 , H05K2203/0425 , Y02P70/611 , Y10T428/2857 , Y10T428/31678
摘要： An electroconductive bonding material contains a thermosetting resin, a low-melting-point metal powder which is melted at a temperature equal to or lower than the thermosetting temperature of the thermosetting resin, a high-melting-point metal powder which is not melted at a temperature equal to or lower than the thermosetting temperature of the thermosetting resin and which reacts with the low-melting-point metal powder to form a reaction product having a high melting point of 300° C. or higher during heat-hardening of the thermosetting resin, and a reducing substance which removes an oxide formed on the surface of the high-melting-point metal powder. The total content of the low-melting-point metal powder and the high-melting-point metal powder is 75% to 88% by weight, and the particle size ratio D1/D2 of the average particle size D1 of the low-melting-point metal powder to the average particle size D2 of the high-melting-point metal powder is 0.5 to 6.0. Thereby, an electroconductive bonding material is provided which has good conduction properties and high connection strength even when reflow heat treatment is repeatedly carried out or thermal shock accompanied with a rapid temperature change is applied to the electroconductive bonding material, and an electronic apparatus using such an electroconductive bonding material.
摘要翻译：导电接合材料包含热固性树脂，在等于或低于热固性树脂的热固化温度的温度下熔化的低熔点金属粉末，在温度等于或低于热固性树脂的热固化温度，并且与低熔点金属粉末反应以形成热固性树脂的热硬化期间具有300℃以上的高熔点的反应产物以及除去形成在高熔点金属粉末的表面上的氧化物的还原物质。低熔点金属粉末和高熔点金属粉末的总含量为75〜88重量％，低熔点金属粉末和高熔点金属粉末的平均粒径D1的粒径比D1 / 点金属粉末与高熔点金属粉末的平均粒径D2为0.5〜6.0。由此，即使在反复进行回流热处理时也具有良好的导电性和高连接强度的导电性接合材料，或者对导电性接合材料施加伴随着快速变化的热冲击，使用这样的电子设备导电接合材料。

8. 发明申请

US20090155608A1 Electroconductive Bonding Material and Electronic Apparatus 有权
标题翻译：导电粘合材料和电子设备
公开(公告)号：US20090155608A1
公开(公告)日：2009-06-18
申请号：US12394113
申请日：2009-02-27
申请人： Akihiro Nomura , Hidekiyo Takaoka , Kosuke Nakano
发明人： Akihiro Nomura , Hidekiyo Takaoka , Kosuke Nakano
IPC分类号： B32B15/00 , H01B1/22
CPC分类号： H05K3/321 , C08K3/08 , C08K7/00 , C09J9/02 , C09J11/04 , H01B1/22 , H05K2201/0272 , H05K2201/10636 , H05K2203/0425 , Y02P70/611 , Y10T428/2857 , Y10T428/31678
摘要： An electroconductive bonding material contains a thermosetting resin, a low-melting-point metal powder which is melted at a temperature equal to or lower than the thermosetting temperature of the thermosetting resin, a high-melting-point metal powder which is not melted at a temperature equal to or lower than the thermosetting temperature of the thermosetting resin and which reacts with the low-melting-point metal powder to form a reaction product having a high melting point of 300° C. or higher during heat-hardening of the thermosetting resin, and a reducing substance which removes an oxide formed on the surface of the high-melting-point metal powder. The total content of the low-melting-point metal powder and the high-melting-point metal powder is 75% to 88% by weight, and the particle size ratio D1/D2 of the average particle size D1 of the low-melting-point metal powder to the average particle size D2 of the high-melting-point metal powder is 0.5 to 6.0. Thereby, an electroconductive bonding material is provided which has good conduction properties and high connection strength even when reflow heat treatment is repeatedly carried out or thermal shock accompanied with a rapid temperature change is applied to the electroconductive bonding material, and an electronic apparatus using such an electroconductive bonding material.
摘要翻译：导电接合材料包含热固性树脂，在等于或低于热固性树脂的热固化温度的温度下熔化的低熔点金属粉末，在温度等于或低于热固性树脂的热固化温度，并且与低熔点金属粉末反应以形成热固性树脂的热硬化期间具有300℃以上的高熔点的反应产物以及除去形成在高熔点金属粉末的表面上的氧化物的还原物质。低熔点金属粉末和高熔点金属粉末的总含量为75〜88重量％，低熔点金属粉末和高熔点金属粉末的平均粒径D1的粒径比D1 / 点金属粉末与高熔点金属粉末的平均粒径D2为0.5〜6.0。由此，即使在反复进行回流热处理时也具有良好的导电性和高连接强度的导电性接合材料，或者对导电性接合材料施加伴随着快速变化的热冲击，使用这样的电子设备导电接合材料。

9. 发明申请

US20120156512A1 Solder Paste, Joining Method Using the Same and Joined Structure 有权
标题翻译：焊膏，连接方法使用相同和结合结构
公开(公告)号：US20120156512A1
公开(公告)日：2012-06-21
申请号：US13404395
申请日：2012-02-24
申请人： Kosuke Nakano , Hidekiyo Takaoka
发明人： Kosuke Nakano , Hidekiyo Takaoka
IPC分类号： B32B15/04 , B23K1/20 , B23K35/24
CPC分类号： B23K35/025 , B23K1/00 , B23K1/0016 , B23K35/262 , B23K35/3613 , B23K35/362 , B23K2101/40 , C22C9/05 , C22C9/06 , C22C13/00 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/81 , H01L24/83 , H01L2224/0401 , H01L2224/04026 , H01L2224/05155 , H01L2224/05644 , H01L2224/1132 , H01L2224/1329 , H01L2224/13294 , H01L2224/13311 , H01L2224/13347 , H01L2224/16503 , H01L2224/16507 , H01L2224/2732 , H01L2224/29101 , H01L2224/29109 , H01L2224/29111 , H01L2224/2919 , H01L2224/2929 , H01L2224/29294 , H01L2224/29311 , H01L2224/29347 , H01L2224/32503 , H01L2224/32507 , H01L2224/81192 , H01L2224/81211 , H01L2224/81447 , H01L2224/81815 , H01L2224/83192 , H01L2224/83211 , H01L2224/83447 , H01L2224/83815 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01023 , H01L2924/01024 , H01L2924/01025 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01038 , H01L2924/0104 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01052 , H01L2924/01057 , H01L2924/01059 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/01327 , H01L2924/0133 , H01L2924/014 , H01L2924/0665 , H05K3/3484 , H05K2201/0215 , H05K2201/0272 , Y10T403/479 , Y10T428/31678 , H01L2924/01028 , H01L2924/00014 , H01L2924/00 , H01L2924/01014 , H01L2924/01015 , H01L2924/01026 , H01L2924/01027 , H01L2924/01046 , H01L2924/01083 , H01L2924/00015 , H01L2924/00012
摘要： A solder paste including a metal component consisting of a first metal powder and a second metal powder having a melting point higher than that of the first metal, and a flux component. The first metal is Sn or an alloy containing Sn, and the second metal is a metal or alloy which forms an intermetallic compound having a melting point of 310° C. or higher with the first metal and has a lattice constant difference, i.e. a difference in between the lattice constant of the intermetallic compound and the lattice constant of the second metal component, of 50% or greater.
摘要翻译：包括由第一金属粉末和熔点高于第一金属的第二金属粉末组成的金属成分的焊膏和焊剂成分。第一金属是Sn或含有Sn的合金，第二金属是与第一金属形成熔点为310℃以上的金属间化合物的金属或合金，并且具有晶格常数差，即差金属间化合物的晶格常数和第二金属成分的晶格常数之间的比例为50％以上。

10. 发明申请

US20090301607A1 Solder Paste and Solder Joint 有权
标题翻译：焊膏和焊接接头
公开(公告)号：US20090301607A1
公开(公告)日：2009-12-10
申请号：US12084793
申请日：2006-11-10
申请人： Kosuke Nakano , Hidekiyo Takaoka , Minoru Ueshima
发明人： Kosuke Nakano , Hidekiyo Takaoka , Minoru Ueshima
IPC分类号： B23K35/14
CPC分类号： B23K35/264 , B23K35/0244 , B23K35/025 , B23K35/26 , B23K35/262 , B23K35/302 , B23K35/362 , H05K3/3484 , H05K2201/0272
摘要： The invention provides a solder paste which has a solidus temperature of 255° C. or above and is improved in the wettability between Bi and Cu or Ag electrode to attain approximately equivalent wettability to those of Pb-containing high-temperature solders even in low-temperature soldering. The solder paste comprises a metal powder component consisting of Bi or a Bi alloy, a solidus temperature lowering metal for Bi, and a solid-phase metal capable of forming an intermetallic compound with the solidus temperature lowering metal, and a flux component.
摘要翻译：本发明提供了固相线温度为255℃以上的焊锡膏，并且提高了Bi和Cu或Ag电极之间的润湿性，以达到与含Pb高温焊料即使在低温焊料中几乎相同的润湿性，温度焊接。焊膏包括由Bi或Bi合金构成的金属粉末成分，Bi的固相降温金属和能够与固相线降温金属形成金属间化合物的固相金属和助熔剂成分。

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