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1. 发明授权

US06402014B1 Method of forming bumps 失效
标题翻译：形成凸块的方法
公开(公告)号：US06402014B1
公开(公告)日：2002-06-11
申请号：US09689804
申请日：2000-10-13
申请人： Kosuke Inoue , Asao Nishimura , Takamichi Suzuki , Teru Fujii , Masayuki Morishima , Yasuyuki Nakajima , Noriyuki Oroku
发明人： Kosuke Inoue , Asao Nishimura , Takamichi Suzuki , Teru Fujii , Masayuki Morishima , Yasuyuki Nakajima , Noriyuki Oroku
IPC分类号： B23K3512
CPC分类号： H05K3/3478 , B23K3/0623 , B23K2101/40 , H01L21/6835 , H01L24/11 , H01L2224/05001 , H01L2224/05023 , H01L2224/05568 , H01L2224/11003 , H01L2224/11334 , H01L2224/13099 , H01L2224/45144 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H05K2203/0278 , H05K2203/0292 , H05K2203/041 , H05K2203/043 , H05K2203/0557 , H01L2924/00 , H01L2224/05599 , H01L2224/05099
摘要： In the conventional bump forming method that can be applied to a semiconductor device in which a large number of bumps are required to form, there are various limitations to the material of which the bumps are made, to enough cubic volume of bumps and to small scattering of the bump height. According to the invention, solder balls and a tool having a large number of through-holes are used, and under the condition that the through-holes of the tool are aligned with the pads of the semiconductor device, the solder balls are charged into the through-holes, pressed to be fixed on the pads, and then reflowed to form bumps.
摘要翻译：在可以应用于需要大量凸块的半导体器件的常规凸点形成方法中，对于形成凸块的材料，足够的立方体积的凸块和小的散射存在各种限制的凸起高度。根据本发明，使用焊球和具有多个通孔的工具，并且在工具的通孔与半导体器件的焊盘对准的条件下，将焊球充入通孔被按压固定在垫上，然后回流以形成凸块。

2. 发明授权

US06869008B2 Method of forming bumps 失效
标题翻译：形成凸块的方法
公开(公告)号：US06869008B2
公开(公告)日：2005-03-22
申请号：US10155730
申请日：2002-05-28
申请人： Kosuke Inoue , Asao Nishimura , Takamichi Suzuki , Teru Fujii , Masayuki Morishima , Yasuyuki Nakajima , Noriyuki Oroku
发明人： Kosuke Inoue , Asao Nishimura , Takamichi Suzuki , Teru Fujii , Masayuki Morishima , Yasuyuki Nakajima , Noriyuki Oroku
IPC分类号： B23K3/06 , H01L21/60 , H01L21/68 , H05K3/34 , B23K31/02 , B23K35/12
CPC分类号： H01L24/11 , B23K3/0623 , B23K2101/40 , H01L21/6835 , H01L2224/05001 , H01L2224/05023 , H01L2224/05568 , H01L2224/11003 , H01L2224/11334 , H01L2224/13099 , H01L2224/45144 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H05K3/3478 , H05K2203/0278 , H05K2203/0292 , H05K2203/041 , H05K2203/043 , H05K2203/0557 , H01L2924/00 , H01L2224/05541 , H01L2224/05005 , H01L2224/05599 , H01L2224/05099
摘要： In the conventional bump forming method that can be applied to a semiconductor device in which a large number of bumps are required to be formed, there are various limitations on the material of which the bumps are made, due to enough cubic volume of bumps and to small scattering of the bump height. According to the invention, solder balls and a tool having a large number of through-holes are used, and under the condition that the through-holes of the tool are aligned with the pads of the semiconductor device, the solder balls are charged into the through-holes, pressed to be fixed on the pads, and then reflowed to form bumps.
摘要翻译：在可以应用于需要形成大量凸块的半导体器件的常规凸点形成方法中，由于足够的立方体积的凸块，对于形成凸块的材料存在各种限制，并且小散射的凸起高度。根据本发明，使用焊球和具有多个通孔的工具，并且在工具的通孔与半导体器件的焊盘对准的条件下，将焊球充入通孔被按压固定在垫上，然后回流以形成凸块。

3. 发明授权

US06213386B1 Method of forming bumps 有权
标题翻译：形成凸块的方法
公开(公告)号：US06213386B1
公开(公告)日：2001-04-10
申请号：US09315818
申请日：1999-05-21
申请人： Kosuke Inoue , Asao Nishimura , Takamichi Suzuki , Teru Fujii , Masayuki Morishima , Yasuyuki Nakajima , Noriyuki Oroku
发明人： Kosuke Inoue , Asao Nishimura , Takamichi Suzuki , Teru Fujii , Masayuki Morishima , Yasuyuki Nakajima , Noriyuki Oroku
IPC分类号： B23K3512
CPC分类号： H05K3/3478 , B23K3/0623 , B23K2101/40 , H01L21/6835 , H01L24/11 , H01L2224/11003 , H01L2224/11005 , H01L2224/11334 , H01L2224/1184 , H01L2224/13099 , H01L2224/45144 , H01L2924/01005 , H01L2924/01006 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H05K2203/0278 , H05K2203/0292 , H05K2203/041 , H05K2203/043 , H05K2203/0557 , H01L2924/00
摘要： In the conventional bump forming method that can be applied to a semiconductor device in which a large number of bumps are required to form, there are various limitations to the material of which the bumps are made, to enough cubic volume of bumps and to small scattering of the bump height. According to the invention, solder balls and a tool having a large number of through-holes are used, and under the condition that the through-holes of the tool are aligned with the pads of the semiconductor device, the solder balls are charged into the through-holes, pressed to be fixed on the pads, and then reflowed to form bumps.
摘要翻译：在可以应用于需要大量凸块的半导体器件的常规凸点形成方法中，对于形成凸块的材料，足够的立方体积的凸块和小的散射存在各种限制的凸起高度。根据本发明，使用焊球和具有多个通孔的工具，并且在工具的通孔与半导体器件的焊盘对准的条件下，将焊球充入通孔被按压固定在垫上，然后回流以形成凸块。

4. 发明授权

US4556770A Induction heating cooking apparatus 失效
标题翻译：感应加热烹调器
公开(公告)号：US4556770A
公开(公告)日：1985-12-03
申请号：US548290
申请日：1983-11-03
申请人： Yoshihisa Tazima , Masayuki Morishima , Hiroshi Okumura , Shin-ichi Kasahara
发明人： Yoshihisa Tazima , Masayuki Morishima , Hiroshi Okumura , Shin-ichi Kasahara
IPC分类号： H05B6/06 , H05B6/12
CPC分类号： H05B6/062
摘要： An induction heating coil and a self-excited inverter are connected to a ripple voltage source. The self-excited inverter comprises a transistor as a switching element and the transistor is rendered conductive responsive to a drive voltage applied for each cycle of the ripple voltage source, whereby the self-excited inverter is started at each cycle of the ripple voltage source. The self-excited inverter stops the oscillation when the voltage of the ripple voltage source becomes lower than a predetermined value. During the non-oscillation period of the intermittent oscillation, the oscillation output of the self-excited inverter is detected. If and when the oscillation output is detected at that time, the oscillation of the inverter is stopped. Furthermore, the pulses of the attenuating oscillation of the self-excited inverter during the oscillation rest period are counted. If and when the count value of the counter is smaller than a predetermined value, the oscillation of the self-excited inverter is started, whereas if and when the count value of the counter exceeds the predetermined value, the oscillation stop state is continued.
摘要翻译：感应加热线圈和自激逆变器连接到纹波电压源。自激逆变器包括作为开关元件的晶体管，并且响应于施加到纹波电压源的每个周期的驱动电压而使晶体管导通，由此在脉动电压源的每个周期启动自激逆变器。当脉动电压源的电压变得低于预定值时，自激逆变器停止振荡。在间歇振荡的非振荡周期期间，检测出自激逆变器的振荡输出。如果在此时检测到振荡输出，则停止逆变器的振荡。另外，在振荡停止期间，对自激逆变器的衰减振荡的脉冲进行计数。如果当计数器的计数值小于预定值时，自激逆变器的振荡开始，而当计数器的计数值超过预定值时，振荡停止状态继续。

5. 发明授权

US4536631A Induction heating cooking apparatus 失效
公开(公告)号：US4536631A
公开(公告)日：1985-08-20
申请号：US548289
申请日：1983-11-03
申请人： Yoshihisa Tazima , Masayuki Morishima , Hiroshi Okumura , Shin-ichi Kasahara
发明人： Yoshihisa Tazima , Masayuki Morishima , Hiroshi Okumura , Shin-ichi Kasahara
IPC分类号： H05B6/06 , H05B6/12
CPC分类号： H05B6/062
摘要： An induction heating coil and a self-excited inverter are connected to a ripple voltage source. The self-excited inverter comprises a transistor as a switching element and the transistor is rendered conductive responsive to a drive voltage applied for each cycle of the ripple voltage source, whereby the self-excited inverter is started at each cycle of the ripple voltage source. The self-excited inverter stops the oscillation when the voltage of the ripple voltage source becomes lower than a predetermined value. During the non-oscillation period of the intermittent oscillation, the oscillation output of the self-excited inverter is detected. If and when the oscillation output is detected at that time, the oscillation of the inverter is stopped. Furthermore, the pulses of the attenuating oscillation of the self-excited inverter during the oscillation rest period are counted. If and when the count value of the counter is smaller than a predetermined value, the oscillation of the self-excited inverter is started, whereas if and when the count value of the counter exceeds the predetermined value, the oscillation stop state is continued.

6. 发明授权

US4438311A Induction heating cooking apparatus 失效
标题翻译：感应加热烹调器
公开(公告)号：US4438311A
公开(公告)日：1984-03-20
申请号：US163088
申请日：1980-06-26
申请人： Yoshihisa Tazima , Masayuki Morishima , Hiroshi Okumura , Shin-ichi Kasahara
发明人： Yoshihisa Tazima , Masayuki Morishima , Hiroshi Okumura , Shin-ichi Kasahara
IPC分类号： H05B6/06 , H05B6/12
CPC分类号： H05B6/062
摘要： An induction heating coil and a self-excited inverter are connected to a ripple voltage source. The self-excited inverter comprises a transistor as a switching element and the transistor is rendered conductive responsive to a drive voltage applied for each cycle of the ripple voltage source, whereby the self-excited inverter is started at each cycle of the ripple voltage source. The self-excited inverter stops the oscillation when the voltage of the ripple voltage source becomes lower than a predetermined value. During the non-oscillation period of the intermittent oscillation, the oscillation output of the self-excited inverter is detected. If and when the oscillation output is detected at that time, the oscillation of the inverter is stopped. Furthermore, the pulses of the attenuating oscillation of the self-excited inverter during the oscillation rest period are counted. If and when the count value of the counter is smaller than a predetermined value, the oscillation of the self-excited inverter is started, whereas if and when the count value of the counter exceeds the predetermined value, the oscillaton stop state is continued.
摘要翻译：感应加热线圈和自激逆变器连接到纹波电压源。自激式逆变器包括作为开关元件的晶体管，并且响应于施加到纹波电压源的每个周期的驱动电压而使晶体管导通，由此在脉动电压源的每个周期启动自激逆变器。当脉动电压源的电压变得低于预定值时，自激逆变器停止振荡。在间歇振荡的非振荡周期期间，检测出自激逆变器的振荡输出。如果在此时检测到振荡输出，则停止逆变器的振荡。另外，在振荡停止期间，对自激逆变器的衰减振荡的脉冲进行计数。如果当计数器的计数值小于预定值时，自激逆变器的振荡开始，而当计数器的计数值超过预定值时，振荡停止状态继续。

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