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1. 发明申请

US20100331477A1 ADHESIVE COMPOSITION AND FILM ADHESIVE 有权
标题翻译：胶粘组合物和胶粘剂
公开(公告)号：US20100331477A1
公开(公告)日：2010-12-30
申请号：US12824548
申请日：2010-06-28
申请人： Koki TAMURA , Takahiro Asai , Hirofumi Imai , Takahiro Yoshioka , Atsushi Miyanari
发明人： Koki TAMURA , Takahiro Asai , Hirofumi Imai , Takahiro Yoshioka , Atsushi Miyanari
IPC分类号： C08L39/04 , C08L29/00
CPC分类号： C09J125/18 , C09J133/00
摘要： The adhesive composition according to the present invention includes a resin containing a polymer having an alkoxystyrene structure as a repeating unit, and an acid generator. In accordance with the present invention, it is possible to provide a novel adhesive composition which is excellent in heat resistance and which is easily stripped.
摘要翻译：根据本发明的粘合剂组合物包括含有作为重复单元的烷氧基苯乙烯结构的聚合物和酸产生剂的树脂。根据本发明，可以提供耐热性优异且易剥离的新型粘合剂组合物。

2. 发明授权

US08357750B2 Adhesive composition and film adhesive 有权
标题翻译：粘合剂组合物和胶粘剂
公开(公告)号：US08357750B2
公开(公告)日：2013-01-22
申请号：US12824548
申请日：2010-06-28
申请人： Koki Tamura , Takahiro Asai , Hirofumi Imai , Takahiro Yoshioka , Atsushi Miyanari
发明人： Koki Tamura , Takahiro Asai , Hirofumi Imai , Takahiro Yoshioka , Atsushi Miyanari
IPC分类号： C08F222/40
CPC分类号： C09J125/18 , C09J133/00
摘要： The adhesive composition according to the present invention includes a resin containing a polymer having an alkoxystyrene structure as a repeating unit, and an acid generator. In accordance with the present invention, it is possible to provide a novel adhesive composition which is excellent in heat resistance and which is easily stripped.
摘要翻译：根据本发明的粘合剂组合物包括含有作为重复单元的烷氧基苯乙烯结构的聚合物和酸产生剂的树脂。根据本发明，可以提供耐热性优异且易剥离的新型粘合剂组合物。

3. 发明授权

US08298365B2 Sticking method and sticking apparatus 失效
标题翻译：粘贴方法和粘贴装置
公开(公告)号：US08298365B2
公开(公告)日：2012-10-30
申请号：US12796872
申请日：2010-06-09
申请人： Hirofumi Imai , Koki Tamura , Takahiro Asai , Takahiro Yoshioka , Yoshihiro Inao
发明人： Hirofumi Imai , Koki Tamura , Takahiro Asai , Takahiro Yoshioka , Yoshihiro Inao
IPC分类号： B32B38/10 , B32B37/12
CPC分类号： C09J5/00 , B32B37/12 , B32B2457/14 , H01L21/67132 , H01L21/6836 , H01L2221/68318 , H01L2221/68327 , H01L2221/68381 , Y10T156/1111 , Y10T156/16
摘要： A sticking method for sticking a support plate onto a substrate in such a way that the support plate can be removed in quickly and easily is provided. The sticking method according to the present invention includes the step of sticking a support plate 3 onto a wafer 2 via a first adhesive layer 4 provided on the wafer 2, a separate film 5 provided on the first adhesive layer 4, and a second adhesive layer 6, provided on the separation film layer 5, which either is higher in rate of dissolution in a solution than the first adhesive layer 4 or dissolves in a solvent different from the solvent in which the first adhesive layer 4 dissolves.
摘要翻译：提供了一种用于将支撑板粘贴到基板上以使得能够快速且容易地移除支撑板的方式的粘贴方法。根据本发明的粘贴方法包括通过设置在晶片2上的第一粘合层4，设置在第一粘合剂层4上的分离膜5和第二粘合剂层将支撑板3粘贴到晶片2上的步骤 6，设置在分离膜层5上，或者溶解在比第一粘合剂层4溶解的溶解速度高的溶剂中，或溶解在与第一粘合层4溶解的溶剂不同的溶剂中。

4. 发明授权

US08333869B2 Stripping method and stripping solution 有权
标题翻译：剥离方法和剥离溶液
公开(公告)号：US08333869B2
公开(公告)日：2012-12-18
申请号：US13077481
申请日：2011-03-31
申请人： Koki Tamura , Takahiro Asai , Atsushi Kubo , Hirofumi Imai , Takahiro Yoshioka
发明人： Koki Tamura , Takahiro Asai , Atsushi Kubo , Hirofumi Imai , Takahiro Yoshioka
IPC分类号： B32B38/10
CPC分类号： H01L21/02057 , C09D9/005 , C11D7/5027 , H01L21/6835 , H01L2221/68327 , H01L2221/68381 , Y10T156/1111 , Y10T156/1116 , Y10T156/19
摘要： A method for stripping a wafer from a supporting plate to which the wafer is adhered via an adhesive agent, wherein the supporting plate has a through hole penetrating the supporting plate in a thickness direction thereof, the method including dissolving the adhesive agent with a stripping solution by contacting the stripping solution with the adhesive agent via the through hole. The adhesive agent has a hydrocarbon resin as a viscous component, and the stripping solution is a hydrocarbon-based solvent having a viscosity of 1.3 mPa·s or less and a dissolving rate of 30 nm/sec or greater to dissolve the adhesive agent.
摘要翻译：一种通过粘合剂从晶片附着的支撑板剥离晶片的方法，其中支撑板具有在其厚度方向上穿透支撑板的通孔，该方法包括用粘合剂溶解剥离溶液通过通孔使剥离溶液与粘合剂接触。粘合剂具有作为粘性成分的烃树脂，剥离液是粘度为1.3mPa·s以下，溶解速度为30nm / sec以上的烃类溶剂，以溶解粘合剂。

5. 发明申请

US20120073741A1 ADHESIVE COMPOSITION 审中-公开
标题翻译：粘合剂组合物
公开(公告)号：US20120073741A1
公开(公告)日：2012-03-29
申请号：US13375163
申请日：2010-05-20
申请人： Takahiro Asai , Hirofumi Imai , Koki Tamura , Takahiro Yoshioka , Nobuyuki Matsuoka , Mariko Watanabe , Takahiko Tsukuda
发明人： Takahiro Asai , Hirofumi Imai , Koki Tamura , Takahiro Yoshioka , Nobuyuki Matsuoka , Mariko Watanabe , Takahiko Tsukuda
IPC分类号： B32B38/10 , C09J11/08 , C09J145/00 , C09J157/00 , C09J193/04
CPC分类号： C09J145/00 , C08L91/00 , C08L91/06 , C08L93/04
摘要： An adhesive composition for forming an adhesive layer for temporarily fixing a substrate, such as a wafer, to a support when processing the substrate, the adhesive composition including a resin (A) produced by polymerizing a monomer component containing a cycloolefin-based monomer, at least one terpene-based resin, rosin-based resin, or petroleum resin (resin B), and an organic solvent capable of dissolving the resins (A) and (B). The resin (A) has a glass transition point of 60° C. or higher, the resin (B) has a softening point of 80 to 160° C. and a molecular weight of 300 to 3000, and the blending ratio of the resin (A) to the resin (B) is (A):(B)=80:20 to 55:45 (mass ratio).
摘要翻译：一种粘合剂组合物，用于在加工基材时，将诸如晶片的基材临时固定到载体上的粘合剂层，所述粘合剂组合物包括通过将含有环烯烃类单体的单体组分聚合而制备的树脂（A）至少一种萜烯系树脂，松香系树脂，石油树脂（树脂B）和能够溶解树脂（A）和（B）的有机溶剂。树脂（A）的玻璃化转变点为60℃以上，树脂（B）的软化点为80〜160℃，分子量为300〜3000，树脂（A）与树脂（B）的摩尔比为（A）：（B）= 80:20〜55:45（质量比）。

6. 发明授权

US08354157B2 Support plate, method for producing the same, and method for processing substrate 有权
标题翻译：支撑板，其制造方法以及基板的处理方法
公开(公告)号：US08354157B2
公开(公告)日：2013-01-15
申请号：US12794096
申请日：2010-06-04
申请人： Hirofumi Imai , Koki Tamura , Takahiro Asai , Takahiro Yoshioka , Yoshihiro Inao
发明人： Hirofumi Imai , Koki Tamura , Takahiro Asai , Takahiro Yoshioka , Yoshihiro Inao
IPC分类号： B32B3/02 , B32B37/00 , G03F7/20
CPC分类号： B32B38/06 , B32B2309/105 , B32B2457/14 , H01L21/67132 , H01L21/6836 , H01L21/68757 , H01L2221/68318 , Y10T428/24091 , Y10T428/24149 , Y10T428/24174 , Y10T428/24793 , Y10T428/24802
摘要： This invention provides a support plate which makes it possible to stably perform a step for separating from a support plate a wafer which has been processed while preventing delay in time taken for this step. The support plate of this invention is a support plate for supporting a substrate via an adhesive, including: a plate-shaped part having a surface which is in contact with the adhesive; and at least one spacer provided on the surface which is in contact with the adhesive.
摘要翻译：本发明提供了一种支撑板，其使得可以稳定地执行从支撑板分离已经被处理的晶片的步骤，同时防止该步骤所花费的时间延迟。本发明的支撑板是用于通过粘合剂支撑基底的支撑板，包括：具有与粘合剂接触的表面的板状部分; 以及设置在与粘合剂接触的表面上的至少一个间隔物。

7. 发明授权

US08980997B2 Adhesive composition 有权
标题翻译：粘合剂组合物
公开(公告)号：US08980997B2
公开(公告)日：2015-03-17
申请号：US13157568
申请日：2011-06-10
申请人： Koki Tamura , Takahiro Asai , Atsushi Kubo , Hirofumi Imai , Takahiro Yoshioka
发明人： Koki Tamura , Takahiro Asai , Atsushi Kubo , Hirofumi Imai , Takahiro Yoshioka
IPC分类号： C08G61/08 , C08L55/00 , C09J123/08
CPC分类号： C09J123/0823
摘要： Disclosed is an adhesive composition in which a solid component is dissolved in a solvent, the solid component being dissolved in the solvent to have a solid component content of not less than 20% by weight with respect to a total amount of the solid component and the solvent, the solid component containing resin obtained by polymerizing a monomer composition that contains a cycloolefin monomer, the solvent having no carbon-carbon double bond, and an alcohol content contained in the solvent being not more than 0.45% by weight with respect to an entire amount of the solvent.
摘要翻译：公开了一种粘合剂组合物，其中固体成分溶解在溶剂中，固体成分溶解在溶剂中，固体成分含量相对于固体成分的总量为20重量％以上，溶剂中，通过使包含环烯烃单体的单体组合物，不含碳 - 碳双键的溶剂和溶剂中所含的醇含量聚合而获得的含固体成分的树脂相对于整体为不超过0.45重量％溶剂量。

8. 发明授权

US09064915B2 Support method, high-temperature treatment method using same, and support jig 有权
标题翻译：支撑方法，采用高温处理方法，支撑夹具
公开(公告)号：US09064915B2
公开(公告)日：2015-06-23
申请号：US13404254
申请日：2012-02-24
申请人： Atsushi Kubo , Hirofumi Imai , Koki Tamura , Takahiro Yoshioka
发明人： Atsushi Kubo , Hirofumi Imai , Koki Tamura , Takahiro Yoshioka
IPC分类号： H01L21/00 , H01L21/673 , H01L21/687
CPC分类号： H01L21/67309 , H01L21/6875
摘要： A method for supporting a support to which a wafer is attached, by supporting the support against gravitational force by supporting three or more support points of an inner circumference section of a support surface of the support. The support surface of the support is opposite to a side on which the wafer is attached to the support.
摘要翻译：通过支撑支撑体的支撑表面的内周部分的三个或更多个支撑点来支撑抵靠重力的支撑件来支撑安装有晶片的支撑件的方法。支撑体的支撑表面与晶片附着在支撑体上的一侧相反。

9. 发明授权

US08124685B2 Adhesive composition and film adhesive 有权
标题翻译：粘合剂组合物和胶粘剂
公开(公告)号：US08124685B2
公开(公告)日：2012-02-28
申请号：US12683688
申请日：2010-01-07
申请人： Hirofumi Imai , Koki Tamura , Koichi Misumi , Takahiro Asai
发明人： Hirofumi Imai , Koki Tamura , Koichi Misumi , Takahiro Asai
IPC分类号： C08L37/00
CPC分类号： C09J133/14 , Y10T428/2891
摘要： An adhesive composition of the present invention is an adhesive composition including a polymer obtained by copolymerizing a monomer composition containing a (meth)acrylic acid ester and a monomer having a maleimide group, the (meth)acrylic acid ester has a structure represented by General Formula (1): wherein R1 is a hydrogen atom or a methyl group, and R2 is a C4 to C20 alkyl group, and the (meth)acrylic acid ester is contained in the monomer composition by 10 to 50 parts by mass where an amount of the monomer composition is 100 parts by mass. With the arrangement, it is possible to provide an adhesive agent and a film adhesive each of which can be suitably used in high temperature processing.
摘要翻译：本发明的粘合剂组合物是包含通过共聚包含（甲基）丙烯酸酯的单体组合物和具有马来酰亚胺基团的单体而获得的聚合物的粘合剂组合物，所述（甲基）丙烯酸酯具有由通式（1）表示：其中，R1为氢原子或甲基，R2为C4〜C20烷基，单体组合物含有（甲基）丙烯酸酯10〜50质量份，单体组成为100质量份。通过这种布置，可以提供粘合剂和薄膜粘合剂，它们都可以适用于高温加工。

10. 发明申请

US20120083561A1 ADHESIVE COMPOSITION 有权
标题翻译：粘合剂组合物
公开(公告)号：US20120083561A1
公开(公告)日：2012-04-05
申请号：US13240415
申请日：2011-09-22
申请人： Hirofumi Imai , Koki Tamura , Atsushi Kubo , Takahiro Yoshioka
发明人： Hirofumi Imai , Koki Tamura , Atsushi Kubo , Takahiro Yoshioka
IPC分类号： C09J123/24 , C08K5/13 , C08K5/01
CPC分类号： C09J123/0823 , C08K5/01 , C08K5/101 , C08K5/1345 , C09J123/02 , C09J123/24
摘要： An adhesive composition of this invention includes a hydrocarbon resin and a solvent for dissolving the hydrocarbon resin, the solvent containing a condensed polycyclic hydrocarbon. Thus, an adhesive composition having excellent product stability is provided.
摘要翻译：本发明的粘合剂组合物包括烃树脂和用于溶解烃树脂的溶剂，所述溶剂含有缩合多环烃。因此，提供了具有优异的产品稳定性的粘合剂组合物。

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