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1. 发明授权

US06494987B1 Bonding system and method 失效
标题翻译：粘合系统和方法
公开(公告)号：US06494987B1
公开(公告)日：2002-12-17
申请号：US09495472
申请日：2000-02-01
申请人： Koji Yamaguchi , Masahiro Nakamura , Masahiko Kotoyori , Shinichi Shinohara , Hideo Kobayashi
发明人： Koji Yamaguchi , Masahiro Nakamura , Masahiko Kotoyori , Shinichi Shinohara , Hideo Kobayashi
IPC分类号： G11B726
CPC分类号： B29C65/521 , B29C65/483 , B29C65/7847 , B29C66/1122 , B29C66/452 , B29C66/723 , B29C66/8322 , B29L2017/005 , B32B37/0007 , B32B37/1284 , B32B2310/021 , B32B2429/02 , G11B7/26 , Y10T156/1744
摘要： In a plate bonding system for bonding first and second substrate discs (or other plates) with adhesive, there are provided a first section for bringing the first and second substrate discs closer to each other with the interposition of adhesive, and a second section for producing an electric field in the interspace between the first and second substrate discs. The second section produces the field and thereby deforms the adhesive into a tapered shape to minimize the initial contact area and thereby prevent voids from being involved in the adhesive.
摘要翻译：在用于用粘合剂粘合第一和第二基板盘（或其他板）的板接合系统中，设置有第一部分，用于通过插入粘合剂使第一和第二基板盘彼此更靠近，并且第二部分用于产生在第一和第二基板盘之间的间隙中的电场。第二部分产生场，从而使粘合剂变形成锥形，以使初始接触面积最小化，从而防止空隙参与粘合剂。

2. 发明授权

US06800168B2 Bonding system and method 失效
标题翻译：粘合系统和方法
公开(公告)号：US06800168B2
公开(公告)日：2004-10-05
申请号：US10150922
申请日：2002-05-21
申请人： Koji Yamaguchi , Masahiro Nakamura , Masahiko Kotoyori , Shinichi Shinohara , Hideo Kobayashi
发明人： Koji Yamaguchi , Masahiro Nakamura , Masahiko Kotoyori , Shinichi Shinohara , Hideo Kobayashi
IPC分类号： G11B726
CPC分类号： B29C65/521 , B29C65/483 , B29C65/7847 , B29C66/1122 , B29C66/452 , B29C66/723 , B29C66/8322 , B29L2017/005 , B32B37/0007 , B32B37/1284 , B32B2310/021 , B32B2429/02 , G11B7/26 , Y10T156/1744
摘要： In a plate bonding system for bonding first and second substrate discs (or other plates) with adhesive, there are provided a first section for bringing the first and second substrate discs closer to each other with the interposition of adhesive, and a second section for producing an electric field in the interspace between the first and second substrate discs. The second section produces the field and thereby deforms the adhesive into a tapered shape to minimize the initial contact area and thereby prevent voids from being involved in the adhesive.
摘要翻译：在用于用粘合剂粘合第一和第二基板盘（或其他板）的板接合系统中，设置有第一部分，用于通过插入粘合剂使第一和第二基板盘彼此更靠近，并且第二部分用于产生在第一和第二基板盘之间的间隙中的电场。第二部分产生场，从而使粘合剂变形成锥形，以使初始接触面积最小化，从而防止空隙参与粘合剂。

3. 发明授权

US06228203B1 Disk bonding method and system 有权
标题翻译：磁盘绑定方法和系统
公开(公告)号：US06228203B1
公开(公告)日：2001-05-08
申请号：US09304539
申请日：1999-05-04
申请人： Masahiko Kotoyori , Koji Yamaguchi , Hironobu Nishimura , Shinichi Shinohara , Hideo Kobayashi , Masahiro Nakamura
发明人： Masahiko Kotoyori , Koji Yamaguchi , Hironobu Nishimura , Shinichi Shinohara , Hideo Kobayashi , Masahiro Nakamura
IPC分类号： B32B714
CPC分类号： B29C65/7847 , B29C65/48 , B29C65/4845 , B29C65/78 , B29C66/1122 , B29C66/452 , B29C66/8242 , B29C66/8322 , B29L2017/005 , B32B37/1284 , B32B2310/0831 , B32B2429/02 , G11B7/265 , G11B23/0021 , Y10T156/1744 , B29C65/00
摘要： A disk bonding system or method comprises a first element for forming an annular adhesive layer on an upwardly facing joint surface of a lower side disk, and a second element for forming a dotted adhesive layer on a downwardly facing joint surface of an upper side disk. Then, a third element sets the upper and lower side disks in a confronting state, and reduces the spacing between the upper and lower side disks until the annular adhesive layer and the dotted adhesive layer are sandwiched between the upper and lower side disks. During this, the annular adhesive layer and the dotted adhesive layer are brought into contact with each other, and the contact region expands in a manner to prevent occurrence of bubbles.
摘要翻译：盘接合系统或方法包括用于在下侧盘的向上接合表面上形成环形粘合剂层的第一元件和用于在上侧盘的向下接合表面上形成虚线粘合剂层的第二元件。然后，第三元件将上，下侧盘设置在相对的状态，并且减小上下盘之间的间隔，直到环形粘合剂层和虚线粘合剂层夹在上下盘之间。在此期间，环状粘合剂层和虚线粘合剂层彼此接触，并且接触区域以防止气泡发生的方式膨胀。

4. 发明授权

US06773525B2 Plate shaped matter adhering apparatus and method 有权
标题翻译：板状粘合装置及方法
公开(公告)号：US06773525B2
公开(公告)日：2004-08-10
申请号：US10239564
申请日：2002-09-24
申请人： Shinichi Shinohara , Hideo Kobayashi , Masahiro Nakamura , Kanya Kaji
发明人： Shinichi Shinohara , Hideo Kobayashi , Masahiro Nakamura , Kanya Kaji
IPC分类号： B32B3120
CPC分类号： B29C65/52 , B29C65/483 , B29C65/4845 , B29C65/521 , B29C65/7847 , B29C66/1122 , B29C66/342 , B29C66/452 , B29C66/8322 , B29C66/93441 , B29C66/939 , B29C66/9392 , B29L2017/005 , G11B7/26 , Y10T156/1092
摘要： Adhering apparatus for plate shaped matter includes absorbing-and-holding means 10, 20 serving also as electrodes for absorbing and holding respectively first optical disc substrate 1 and second optical disc substrate 2, optical disc substrate moving means 40 for moving second optical disc substrate 2 to be approached to first optical disc substrate, distance detecting means 50 for detecting the distance between optical disc substrates, velocity controlling means 60 for controlling a relative velocity of the second plate shaped matter to the first plate shaped matter and controlling the plate shaped matter moving means in such a manner that the relative velocity immediately after and at a time point at which the adhesive applied onto the first plate shaped matter is brought in contact with the second plate shaped matter is slower than that immediately before the adhesive applied onto the first plate shaped matter is brought in contact with the second plate shaped matter; and voltage application means 71 for applying voltage between the first plate shaped matter and the second plate shaped matter before the adhesive applied onto the first plate shaped matter is brought in contact with the second plate shaped matter.
摘要翻译：用于板状物的粘合装置包括吸收和保持装置10,20，其也用作吸收和保持第一光盘基板1和第二光盘基板2的电极，用于移动第二光盘基板2的光盘基板移动装置40 靠近第一光盘基板的距离检测装置50，用于检测光盘基板之间的距离的距离检测装置50;用于控制第二板状物体相对于第一板状物质的相对速度的速度控制装置60，并控制板状物质移动意味着紧接着施加在第一板状物上的粘合剂与第二板状物质接触的时间点之后和之后的相对速度比施加到第一板状物上的粘合剂之前的相对速度慢形状的物质与第二板状物质接触; 并且在施加到第一板状物质上的粘合剂与第二板状物质接触之前，用于在第一板状物和第二板状物之间施加电压的电压施加装置71。

5. 发明授权

US07267790B2 Method and apparatus for treating a disc substrate 失效
公开(公告)号：US07267790B2
公开(公告)日：2007-09-11
申请号：US10309464
申请日：2002-12-03
申请人： Takayuki Suzuki , Masahiro Nakamura , Hideo Kobayashi , Shinichi Shinohara
发明人： Takayuki Suzuki , Masahiro Nakamura , Hideo Kobayashi , Shinichi Shinohara
IPC分类号： B29C71/00 , B29C45/00 , B29D11/00 , G11B7/00
CPC分类号： B29C35/16 , B29C2035/1658 , B29D17/005 , B29L2017/005 , Y10S425/81
摘要： A molded disc substrate obtained by injection molding is rotated at high speed before the molded disc substrate has solidified, and a gas is also made to flow in an outward radial direction along a bottom surface of the molded disc substrate while the molded disc substrate is rotating, and the rotation is stopped after the molded disc substrate has solidified. Thus, a disc substrate with little warping is obtained in a short time.

6. 发明授权

US07168940B2 Method and apparatus for treating a disc substrate 失效
标题翻译：用于处理盘基片的方法和装置
公开(公告)号：US07168940B2
公开(公告)日：2007-01-30
申请号：US11048384
申请日：2005-01-31
申请人： Takayuki Suzuki , Masahiro Nakamura , Hideo Kobayashi , Shinichi Shinohara
发明人： Takayuki Suzuki , Masahiro Nakamura , Hideo Kobayashi , Shinichi Shinohara
IPC分类号： B29D11/00
CPC分类号： B29C35/16 , B29C2035/1658 , B29D17/005 , B29L2017/005 , Y10S425/81
摘要： A molded disc substrate obtained by injection molding is rotated at high speed before the molded disc substrate has solidified, and a gas is also made to flow in an outward radial direction along a bottom surface of the molded disc substrate while the molded disc substrate is rotating, and the rotation is stopped after the molded disc substrate has solidified. Thus, a disc substrate with little warping is obtained in a short time.
摘要翻译：通过注射成型得到的成型盘基板在成型盘基板固化之前高速旋转，并且气体也沿着模制盘基片的底面向外径向流动，同时模制盘基片旋转并且在模制的盘基片已凝固之后停止旋转。因此，在短时间内获得了具有很小翘曲的盘基片。

7. 发明授权

US07198478B2 Method and apparatus of treating a disc plate 失效
标题翻译：处理盘片的方法和装置
公开(公告)号：US07198478B2
公开(公告)日：2007-04-03
申请号：US10846530
申请日：2004-05-17
申请人： Takayuki Suzuki , Masahiro Nakamura , Hideo Kobayashi , Shinichi Shinohara
发明人： Takayuki Suzuki , Masahiro Nakamura , Hideo Kobayashi , Shinichi Shinohara
IPC分类号： G11B7/26 , B29C71/02
CPC分类号： B29C53/18 , B29C35/16 , B29C45/0053 , B29C45/7207 , B29C47/0019 , B29C47/0033 , B29C47/0038 , B29C47/004 , B29C69/00 , B29L2017/003 , B29L2017/005 , Y10S425/81
摘要： A method of treating a disc plate. has the following operations of: molding a mold disc plate through an injection molding; and spinning the mold disc plate at a high spin speed. The spinning operation has at least one of the following two sub-operations of: reducing a warp of the mold disc plate with a centrifugal force caused during the spinning operation, and reducing a temperature of the mold disc plate during the spinning operation. Moreover, an apparatus of treating a disc plate has: a conveyer for conveying a mold disc plate obtained through an injection molding; a disc bench for receiving the mold disc plate conveyed with the conveyer; and a spin driver for spinning the disc bench when a temperature of the mold disc plate is higher than 90° C., to thereby spin the mold disc plate.
摘要翻译：一种盘片处理方法。具有以下操作：通过注塑成型模板盘; 并以高旋转速度旋转模具盘片。纺丝操作具有以下两个子操作中的至少一个：在纺丝操作期间由于离心力而减小模具盘片的翘曲，并且在纺丝操作期间降低模具盘片的温度。此外，一种处理盘片的设备具有：输送机，用于输送通过注射成型获得的模具盘片; 用于接收用输送机输送的模板的盘台; 以及当模盘盘的温度高于90℃时旋转盘台的旋转驱动器，从而旋转模具盘片。

8. 发明申请

US20050129804A1 Method and apparatus for treating a disc substrate 失效
标题翻译：用于处理盘基片的方法和装置
公开(公告)号：US20050129804A1
公开(公告)日：2005-06-16
申请号：US11048384
申请日：2005-01-31
申请人： Takayuki Suzuki , Masahiro Nakamura , Hideo Kobayashi , Shinichi Shinohara
发明人： Takayuki Suzuki , Masahiro Nakamura , Hideo Kobayashi , Shinichi Shinohara
IPC分类号： B29C45/17 , B29C35/16 , B29C45/72 , B29D17/00 , B29L17/00 , G11B7/26 , B29C45/06
CPC分类号： B29C35/16 , B29C2035/1658 , B29D17/005 , B29L2017/005 , Y10S425/81
摘要： A molded disc substrate obtained by injection molding is rotated at high speed before the molded disc substrate has solidified, and a gas is also made to flow in an outward radial direction along a bottom surface of the molded disc substrate while the molded disc substrate is rotating, and the rotation is stopped after the molded disc substrate has solidified. Thus, a disc substrate with little warping is obtained in a short time.
摘要翻译：通过注射成型得到的成型盘基板在成型盘基板固化之前高速旋转，并且气体也沿着模制盘基片的底面向外径向流动，同时模制盘基片旋转并且在模制的盘基片已凝固之后停止旋转。因此，在短时间内获得了具有很小翘曲的盘基片。

9. 发明授权

US06685794B2 Method and apparatus for bonding optical disc substrates together, and method for supplying liquid material 失效
公开(公告)号：US06685794B2
公开(公告)日：2004-02-03
申请号：US09778232
申请日：2001-02-06
申请人： Shinichi Shinohara , Hideo Kobayashi , Masahiro Nakamura , Kanya Kaji
发明人： Shinichi Shinohara , Hideo Kobayashi , Masahiro Nakamura , Kanya Kaji
IPC分类号： G02B4320
CPC分类号： B29C65/04 , B05C5/02 , B05C5/0212 , B05C9/12 , B05C11/08 , B29C65/483 , B29C65/521 , B29C65/7847 , B29C66/1122 , B29C66/21 , B29C66/452 , B29C66/723 , B29C66/8242 , B29C66/8322 , B29L2017/005 , G11B7/26
摘要： The object of the present invention is to significantly inhibit the formation of voids between substrates bonded together when a liquid adhesive is supplied onto an optical disc substrate or when the optical disc substrate is bonded to another optical disc substrate. Accordingly, the present invention discloses a method for bonding two optical disc substrates together which comprises the steps of joining the optical disc substrates together with an adhesive and curing the adhesive, wherein the adhesive is supplied onto the optical disc substrate by an electric field formed between the adhesive-supplying nozzle, for supplying the adhesive onto the optical disc substrate, and the optical disc substrate, and the two optical disc substrates are then joined together and subjected to spun by a spinning process.

10. 发明申请

US20080283192A1 METHOD AND APPARATUS FOR BONDING OPTICAL DISC SUBSTRATES TOGETHER, AND METHOD FOR SUPPLYING LIQUID MATERIAL 审中-公开
标题翻译：用于粘合光盘基板的方法和装置以及用于供应液体材料的方法
公开(公告)号：US20080283192A1
公开(公告)日：2008-11-20
申请号：US11856199
申请日：2007-09-17
申请人： Shinichi Shinohara , Hideo Kobayashi , Masahiro Nakamura , Kanya Kaji
发明人： Shinichi Shinohara , Hideo Kobayashi , Masahiro Nakamura , Kanya Kaji
IPC分类号： B29C65/04
CPC分类号： B29C65/521 , B29C65/04 , B29C65/483 , B29C65/524 , B29C65/7847 , B29C66/1122 , B29C66/342 , B29C66/452 , B29C66/723 , B29C66/8242 , B29C66/8322 , B29D17/005 , B29L2017/005 , B32B37/003 , B32B37/1284 , B32B2429/02 , G11B7/26
摘要： The object of the present invention is to significantly inhibit the formation of voids between substrates bonded together when a liquid adhesive is supplied onto an optical disc substrate or when the optical disc substrate is bonded to another optical disc substrate. Accordingly, the present invention discloses a method for bonding two optical disc substrates together which comprises the steps of joining the optical disc substrates together with an adhesive and curing the adhesive, wherein the adhesive is supplied onto the optical disc substrate by an electric field formed between the adhesive-supplying nozzle, for supplying the adhesive onto the optical disc substrate, and the optical disc substrate, and the two optical disc substrates are then joined together and subjected to spun by a spinning process.
摘要翻译：本发明的目的是在将液体粘合剂供应到光盘基片上时或者当光盘基片与另一个光盘基片接合时，显着地抑制粘合在一起的基片之间的空隙的形成。因此，本发明公开了一种将两个光盘基板接合在一起的方法，包括以下步骤：将光盘基板与粘合剂接合并固化粘合剂，其中粘合剂通过在用于将粘合剂供应到光盘基板上的粘合剂供给喷嘴和光盘基板以及两个光盘基板接合在一起，并通过旋转工艺进行纺丝。

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