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    • 1. 发明申请
    • DIFFERENTIAL GEAR FOR VEHICLE AND VEHICLE
    • 用于车辆和车辆的差速器
    • US20110130239A1
    • 2011-06-02
    • US12958804
    • 2010-12-02
    • Koji SATOEiichi SuzukiBunzo Seki
    • Koji SATOEiichi SuzukiBunzo Seki
    • F16H48/06
    • F16H48/30B60K17/346F16H48/14F16H48/24F16H2048/305
    • A diff case is attached to a side face of a ring gear wheel on the opposite side to the side on which the ring gear wheel and a pinion gear wheel mesh with each other. The ring gear wheel integrally has a boss portion, in which a driven shaft is fitted, on the meshing side with the pinion gear wheel. An annular member slidably movable in an axial direction thereof is provided on the boss portion with a guide portion for guiding the annular member. A lock pin is provided on the annular member for inserting into pin holes formed in the ring gear wheel and a left output side cam to place the differential mechanism into a locked state. A sliding region within which the annular member slidably moves is disposed so as to be included in a projection region of the diameter of the pinion gear wheel
    • 在环形齿轮的与环形齿轮和小齿轮相啮合的一侧的相对侧上的侧面附着有差速器壳体。 环形齿轮在与小齿轮的啮合侧一体地具有嵌入从动轴的凸台部。 可滑动地沿其轴向移动的环形构件设置在凸台部分上,其具有用于引导环形构件的引导部分。 在环形构件上设置有锁销,用于插入形成在环形齿轮中的销孔和左输出侧凸轮中,以将差速机构置于锁定状态。 环形构件可滑动移动的滑动区域设置成包括在小齿轮直径的突出区域中
    • 6. 发明申请
    • SEMICONDUCTOR INTEGRATED CIRCUIT AND OPERATION METHOD FOR THE SAME
    • 半导体集成电路及其操作方法
    • US20090295458A1
    • 2009-12-03
    • US12422854
    • 2009-04-13
    • Tadashi KAMEYAMATakayasu ITOSeiichi SAITOKoji SATO
    • Tadashi KAMEYAMATakayasu ITOSeiichi SAITOKoji SATO
    • H01L35/00
    • G05F3/30G05F3/227
    • The semiconductor integrated circuit is provided, in which an external temperature control or temperature monitoring is possible, with little influence by the noise of a system board which mounts the semiconductor integrated circuit. The semiconductor integrated circuit includes the temperature detection circuit which detects the chip temperature, and the functional module which flows a large operating current. An external terminal which supplies operating voltage, and an external terminal which supplies ground voltage are coupled to the functional module. The temperature detection circuit generates a temperature detection signal and a reference signal. The reference signal and the temperature detection signal are led out to the exterior of the semiconductor integrated circuit via a first external output terminal and a second external output terminal, respectively, and are supplied to an external temperature control/monitoring circuit which has a circuitry type of a differential amplifier circuit.
    • 提供了半导体集成电路,其中可以进行外部温度控制或温度监视,几乎不受安装半导体集成电路的系统板的噪声的影响。 半导体集成电路包括检测芯片温度的温度检测电路和流过大的工作电流的功能模块。 提供工作电压的外部端子和提供接地电压的外部端子耦合到功能模块。 温度检测电路产生温度检测信号和参考信号。 参考信号和温度检测信号分别经由第一外部输出端子和第二外部输出端子被引出到半导体集成电路的外部,并且被提供给具有电路类型的外部温度控制/监视电路 的差分放大电路。