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    • 10. 发明授权
    • Radiation sensitive resin composition and material for forming bumps
containing the same
    • 辐射敏感性树脂组合物和用于形成含有它的凸块的材料
    • US5965328A
    • 1999-10-12
    • US925427
    • 1997-09-08
    • Kimiyasu SanoHideki ChibaKatsutoshi IgarashiToshiyuki OtaYoshiyuki MichinoHozumi Sato
    • Kimiyasu SanoHideki ChibaKatsutoshi IgarashiToshiyuki OtaYoshiyuki MichinoHozumi Sato
    • G02F1/133C08F2/48C08F2/54C08L33/00C08L33/02C08L33/04C25F3/14G02F1/1333G03F7/033H01L21/321H01L21/60H05K3/00H05K3/24G03F7/40
    • G03F7/033H05K3/243H05K2203/0793H05K3/0076Y10S430/111
    • A radiation sensitive resin composition comprising:(A) an alkali-soluble copolymer comprising:(a) 10 to 50% by weight of a first unit consisting of a radical polymerizable compound having a carboxylic group,(b) 20 to 60% by weight of a second unit consisting of a radical polymerizable compound having a cycloalkyl group, the unit containing no carboxyl group, and(c) 5 to 40% by weight of a third unit consisting of a radical polymerizable compound other than the radical polymerizable compounds in (a) and (b) above;(B) a polymerizable compound having at least one ethylenically unsaturated double bond; and(C) a radiation sensitive radical initiator. Also is disclosed a material for forming bumps containing the radiation sensitive resin composition. The radiation sensitive resin composition has sufficient developability with an alkali developer and sufficient resolution when the composition is in the form of a 20 .mu.m or more thick film. The composition and material of the present invention have excellent resistance to plating liquids and good wettability to plating liquids, and improved adhesion to substrates upon development. Therefore, the composition and material of the present invention can form bumps having sufficient characteristics by plating and give rise to a cured product which has excellent peelability from the substrate on which it is formed.
    • 一种辐射敏感性树脂组合物,其包含:(A)碱溶性共聚物,其包含:(a)10至50重量%的由具有羧基的自由基聚合性化合物组成的第一单元,(b)20至60重量% 由具有环烷基的自由基聚合性化合物,不含羧基的单元构成的第二单元,和(c)5〜40重量%的第三单元,由( a)和(b) (B)具有至少一个烯键式不饱和双键的聚合性化合物; 和(C)辐射敏感的自由基引发剂。 还公开了用于形成包含辐射敏感性树脂组合物的凸块的材料。 当组合物为20μm或更厚的膜的形式时,辐射敏感性树脂组合物与碱性显影剂具有足够的显影性和足够的分辨率。 本发明的组合物和材料具有优异的耐电镀性和对电镀液的良好润湿性,并且在显影时具有改进的与基材的粘合性。 因此,本发明的组合物和材料可以通过电镀形成具有足够特性的凸块,并产生与其形成的基板具有优异的剥离性的固化产物。