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1. 发明申请

US20080283324A1 Hydraulically Driven Working Vehicle and Hydraulic Transaxle 有权
标题翻译：液压驱动工作车辆和液压传动桥
公开(公告)号：US20080283324A1
公开(公告)日：2008-11-20
申请号：US12178252
申请日：2008-07-23
申请人： Koji IWAKI , Shiro UENO , Norihiro ISHII , Hideaki OKADA , Hiroshi SUGIMOTO , Shinichi HIROSE , Hironori SUMOMOZAWA , Fumitoshi ISHINO
发明人： Koji IWAKI , Shiro UENO , Norihiro ISHII , Hideaki OKADA , Hiroshi SUGIMOTO , Shinichi HIROSE , Hironori SUMOMOZAWA , Fumitoshi ISHINO
IPC分类号： B60K17/356 , B60K17/10 , B60K8/00
CPC分类号： B60K17/356 , B60K17/105 , B60Y2200/223
摘要： In a hydraulic four-wheel drive vehicle, a rear transaxle incorporates a hydraulic motor for driving rear wheels, a front transaxle incorporates a hydraulic motor for driving front wheels, and hydraulic pressure fluid pipes interposed between the front and rear transaxles are extended along at least one of left and right side plates of a frame of the vehicle.
摘要翻译：在液压四轮驱动车辆中，后驱动桥包括用于驱动后轮的液压马达，前驱动桥包括用于驱动前轮的液压马达，并且插入在前驱动桥和后驱动桥之间的液压流体管至少延伸车辆的框架的左右侧板中的一个。

2. 发明申请

US20090237886A1 SHEET STRUCTURE AND METHOD OF MANUFACTURING SHEET STRUCTURE 有权
标题翻译：板材结构及其制造方法
公开(公告)号：US20090237886A1
公开(公告)日：2009-09-24
申请号：US12405578
申请日：2009-03-17
申请人： Taisuke IWAI , Daiyu KONDO , Yoshitaka YAMAGUCHI , Ikuo SOGA , Shinichi HIROSE
发明人： Taisuke IWAI , Daiyu KONDO , Yoshitaka YAMAGUCHI , Ikuo SOGA , Shinichi HIROSE
IPC分类号： H05K7/20 , B32B9/00
CPC分类号： H01L23/433 , H01L23/373 , H01L23/3733 , H01L24/31 , H01L2224/16225 , H01L2224/29499 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01018 , H01L2924/01019 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01041 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01072 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/04941 , H01L2924/04953 , H01L2924/15788 , H01L2924/16152 , Y10T428/30 , H01L2924/00 , H01L2924/3512
摘要： The sheet structure includes a plurality of linear structures of carbon atoms, a filling layer filled in gaps between the linear structures for supporting the plurality of linear structures, and a coating film formed over at least one ends of the plurality of linear structures and having a thermal conductivity of not less than 1 W/m·K.
摘要翻译：片状结构包括碳原子的多个线性结构，填充在用于支撑多个线性结构的线性结构之间的间隙中的填充层，以及形成在多个线性结构的至少一个端部上的涂膜，并且具有导热系数不低于1W / mK

3. 发明申请

US20120218715A1 ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING ELECTRONIC COMPONENT 有权
标题翻译：电子元件和制造电子元件的方法
公开(公告)号：US20120218715A1
公开(公告)日：2012-08-30
申请号：US13307029
申请日：2011-11-30
申请人： Shinichi HIROSE , Taisuke Iwai , Yoshitaka Yamaguchi , Yohei Yagishita , Yukie Sakita , Masaaki Norimatsu
发明人： Shinichi HIROSE , Taisuke Iwai , Yoshitaka Yamaguchi , Yohei Yagishita , Yukie Sakita , Masaaki Norimatsu
IPC分类号： H05K7/20 , H01L21/50
CPC分类号： H01L23/433 , H01L21/4871 , H01L21/50 , H01L23/373 , H01L23/3737 , H01L24/29 , H01L24/83 , H01L2224/16225 , H01L2224/16227 , H01L2224/29076 , H01L2224/2929 , H01L2224/29393 , H01L2224/32245 , H01L2224/73253 , H01L2224/83192 , H01L2224/8336 , H01L2224/8385 , H01L2924/00014 , H01L2924/15788 , H01L2924/16152 , Y10T428/24124 , Y10T428/24132 , Y10T428/24165 , Y10T428/24174 , Y10T428/2913 , Y10T428/30 , H01L2924/00 , H01L2224/0401
摘要： A method of manufacturing an electronic component includes disposing a heat radiation material including a plurality of linear structures of carbon atoms and a filling layer of a thermoplastic resin provided among the plurality of linear structures above a first substrate, disposing a blotting paper above the heat radiation material, making a heat treatment at a temperature higher than a melting temperature of the thermoplastic resin and absorbing the thermoplastic resin above the plurality of linear structures with the absorption paper, removing the blotting paper, and adhering the heat radiation material to the first substrate by cooling to solidify the thermoplastic resin.
摘要翻译：一种电子部件的制造方法，其特征在于，在第一基板的上方设置包含碳原子数的多个线状结构的热辐射材料和设置在所述多个线状结构体中的热塑性树脂填充层，在所述热辐射上设置吸墨纸材料，在高于热塑性树脂的熔融温度的温度下进行热处理，并用吸收纸吸收多个线性结构上方的热塑性树脂，除去吸墨纸，并将散热材料粘附到第一衬底上冷却固化热塑性树脂。

4. 发明申请

US20110279105A1 MICROCOMPUTER AND SWITCHING POWER SUPPLY DEVICE 有权
标题翻译：微型计算机和开关电源装置
公开(公告)号：US20110279105A1
公开(公告)日：2011-11-17
申请号：US13104563
申请日：2011-05-10
申请人： Shinichi HIROSE
发明人： Shinichi HIROSE
IPC分类号： G05F3/16
CPC分类号： H02M3/156 , H02M3/1584 , H02M3/1588 , H02M2001/0003 , Y02B70/1466
摘要： The present invention provides a switching power supply device that is capable of steadily operating even when a low supply voltage is employed. The present invention also provides a microcomputer equipped with the switching power supply device. A switching regulator includes an inductor that inputs an external supply voltage at one end, a main switch that is coupled to another end of the inductor, an auxiliary switch that is coupled to the other end of the inductor in parallel with the main switch, and a rectifying/smoothing circuit having a diode and a capacitor. A switching operation of the main switch is controlled by a control signal generated from a PFM control circuit, which is driven by an internal supply voltage. A switching operation of the auxiliary switch is controlled by a control signal generated from a ring oscillator, which is driven by the external supply voltage.
摘要翻译：本发明提供即使在采用低电源电压时也能稳定运行的开关电源装置。本发明还提供一种配备有开关电源装置的微型计算机。开关调节器包括一端输入外部电源电压的电感器，耦合到电感器另一端的主开关，与主开关并联耦合到电感器另一端的辅助开关，以及具有二极管和电容器的整流/平滑电路。通过由内部电源电压驱动的PFM控制电路产生的控制信号来控制主开关的开关动作。辅助开关的开关操作由由外部电源电压驱动的环形振荡器产生的控制信号控制。

5. 发明申请

US20100027221A1 SHEET STRUCTURE AND METHOD OF MANUFACTURING THE SAME 有权
标题翻译：表格结构及其制造方法
公开(公告)号：US20100027221A1
公开(公告)日：2010-02-04
申请号：US12255450
申请日：2008-10-21
申请人： Taisuke IWAI , Daiyu KONDO , Yoshitaka YAMAGUCHI , Ikuo SOGA , Shinichi HIROSE
发明人： Taisuke IWAI , Daiyu KONDO , Yoshitaka YAMAGUCHI , Ikuo SOGA , Shinichi HIROSE
IPC分类号： H05K7/20 , B32B3/00 , B05D5/12 , B32B37/00
CPC分类号： H01L23/373 , H01L23/3733 , H01L23/3735 , H01L23/433 , H01L24/29 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2924/00011 , H01L2924/00014 , H01L2924/01019 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/04941 , H01L2924/15788 , H01L2924/16152 , Y10T428/2462 , H01L2924/00 , H01L2224/0401
摘要： The sheet structure includes a plurality of linear structure bundles 12 each of which comprises a plurality of linear structures of carbon atoms arranged, spaced from each other at a first gap and which are arranged at a second gap which is larger than the first gap; and a filling layer 14 filled in the first gap and the second gap and supporting the plurality of linear structure bundles 12.
摘要翻译：片状结构包括多个线性结构束12，每个线性结构束12包括多个碳原子的线性结构，它们以第一间隙彼此间隔布置，并且布置在大于第一间隙的第二间隙处; 填充层14填充在第一间隙和第二间隙中并且支撑多个线性结构束12。

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