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    • 2. 发明申请
    • Biaxial Drive Mechanism and Die Bonder
    • 双轴驱动机构和模具粘合机
    • US20130014904A1
    • 2013-01-17
    • US13226128
    • 2011-09-06
    • Koji HOSAKAShingo Fukasawa
    • Koji HOSAKAShingo Fukasawa
    • B29C65/52B65G47/74B29C65/48
    • H01L24/75H01L24/83H01L2224/32245H01L2224/7565H01L2224/75824H01L2224/83192Y10T156/17Y10T156/1798H01L2924/00
    • A biaxial drive mechanism including a Z axis capable of realizing a high speed elevation axis without an increment in torque on a horizontal drive axes and a die bonder using the biaxial drive mechanism is disclosed. The biaxial drive mechanism includes a handling part; a first linear motor having a first movable part that moves up/down the handling part and a first stationary part; a second linear motor having a second movable part and a second stationary part; a connecting part that directly or indirectly connects the first movable part to the second movable part via the first linear guide; a second linear guide that moves the first movable part; and a support body that fixes the first stationary part and the second stationary part with a predetermined length in parallel to each other in the horizontal direction.
    • 公开了一种双轴驱动机构,其包括能够实现高速仰角的Z轴,而不使用水平驱动轴上的扭矩增加,并且使用双轴驱动机构的芯片接合机。 双轴驱动机构包括处理部; 第一线性电动机,具有使操作部上下移动的第一可动部和第一静止部; 第二线性电动机,具有第二可动部和第二静止部; 连接部,其经由所述第一线性引导件将所述第一可动部直接或间接地连接到所述第二可动部; 使所述第一可动部移动的第二线性引导件; 以及支撑体,其在水平方向上以预定长度彼此平行地固定第一固定部分和第二固定部分。