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    • 4. 发明授权
    • Piezoelectric actuator and method for manufacturing the same
    • 压电致动器及其制造方法
    • US6140743A
    • 2000-10-31
    • US35717
    • 1998-03-05
    • Koichiro KishimaTetsuo NakayamaTakaaki Murakami
    • Koichiro KishimaTetsuo NakayamaTakaaki Murakami
    • B41J2/045B41J2/055B41J2/135B41J2/14B41J2/16C23C2/34H01L41/09H01L41/22H02N2/00H01L41/04
    • H01L41/29H01L41/313Y10T29/42
    • A plate material 1 and piezoelectric ceramics 2 are bonded together through an alloy layer 3 formed by an alloy forming reaction due to the mutual diffusion phenomena between a liquid metal including at least galium and the plate material 1 or the piezoelectric ceramics 2, or the mutual diffusion phenomena between the liquid metal and metal powder. The alloy layer 3 may include at least one or more of indium, tin and zinc and at least one or more of copper, silver, gold, and palladium. Further, a metal may be provided on at least one of the bonded surfaces of the plate material 1 and the piezoelectric ceramics 2. This metal may include one or more of copper, silver, gold, tin and palladum. In addition, a metal layer may be formed on the bonded surface 1a side of the plate material 1. Still further, an amorphous layer may be formed on at least one of the parts between the plate material 1 and the alloy layer 3, and between the piezoelectric ceramics 2 and the alloy layer 3.
    • 板材1和压电陶瓷2由于通过合金成形反应而形成的合金层3,由于至少含有镓的液体金属与板材1或压电陶瓷2之间的相互扩散现象, 液态金属与金属粉末之间的扩散现象。 合金层3可以包括铟,锡和锌中的至少一种或多种,​​以及铜,银,金和钯中的至少一种。 此外,可以在板材1和压电陶瓷2的至少一个接合表面上设置金属。该金属可以包括铜,银,金,锡和薄荷中的一种或多种。 此外,可以在板材1的接合表面1a侧上形成金属层。此外,非晶层可以形成在板材1和合金层3之间的至少一个部分之间,以及 压电陶瓷2和合金层3。
    • 9. 发明授权
    • Method of manufacturing a piezoelectric actuator
    • 制造压电致动器的方法
    • US6021552A
    • 2000-02-08
    • US35716
    • 1998-03-05
    • Koichiro KishimaTetsuo NakayamaTakaaki Murakami
    • Koichiro KishimaTetsuo NakayamaTakaaki Murakami
    • B41J2/045B41J2/055B41J2/135B41J2/14B41J2/16C23C2/34H01L41/09H01L41/22H02N2/00
    • H01L41/29H01L41/313Y10T29/42
    • A plate material 1 and piezoelectric ceramics 2 are bonded together through an alloy layer 3 formed by an alloy forming reaction due to the mutual diffusion phenomena between a liquid metal including at least galium and the plate material 1 or the piezoelectric ceramics 2, or the mutual diffusion phenomena between the liquid metal and metal powder. The alloy layer 3 may include at least one or more of indium, tin and zinc and at least one or more of copper, silver, gold, and palladium. Further, a metal may be provided on at least one of the bonded surfaces of the plate material 1 and the piezoelectric ceramics 2. This metal may include one or more of copper, silver, gold, tin and palladum. In addition, a metal layer may be formed on the bonded surface 1a side of the plate material 1. Still further, an amorphous layer may be formed on at least one of the parts between the plate material 1 and the alloy layer 3, and between the piezoelectric ceramics 2 and the alloy layer 3.
    • 板材1和压电陶瓷2由于通过合金成形反应而形成的合金层3,由于至少含有镓的液体金属与板材1或压电陶瓷2之间的相互扩散现象, 液态金属与金属粉末之间的扩散现象。 合金层3可以包括铟,锡和锌中的至少一种或多种,​​以及铜,银,金和钯中的至少一种。 此外,可以在板材1和压电陶瓷2的至少一个接合表面上设置金属。该金属可以包括铜,银,金,锡和薄荷中的一种或多种。 此外,可以在板材1的接合表面1a侧上形成金属层。此外,非晶层可以形成在板材1和合金层3之间的至少一个部分之间,以及 压电陶瓷2和合金层3。
    • 10. 发明授权
    • Piezoelectric actuator and method for manufacturing
    • 压电致动器及其制造方法
    • US5898255A
    • 1999-04-27
    • US686377
    • 1996-07-25
    • Koichiro KishimaTetsuo NakayamaTakaaki Murakami
    • Koichiro KishimaTetsuo NakayamaTakaaki Murakami
    • B41J2/045B41J2/055B41J2/135B41J2/14B41J2/16C23C2/34H01L41/09H01L41/22H02N2/00H01L41/08
    • H01L41/29H01L41/313Y10T29/42
    • A plate material 1 and piezoelectric ceramics 2 are bonded together through an alloy layer 3 formed by an alloy forming reaction due to the mutual diffusion phenomena between a liquid metal including at least galium and the plate material 1 or the piezoelectric ceramics 2, or the mutual diffusion phenomena between the liquid metal and metal powder. The alloy layer 3 may include at least one or more of indium, tin and zinc and at least one or more of copper, silver, gold, and palladium. Further, a metal may be provided on at least one of the bonded surfaces of the plate material 1 and the piezoelectric ceramics 2. This metal may include one or more of copper, silver, gold, tin and palladum. In addition, a metal layer may be formed on the bonded surface 1a side of the plate material 1. Still further, an amorphous layer may be formed on at least one of the parts between the plate material 1 and the alloy layer 3, and between the piezoelectric ceramics 2 and the alloy layer 3.
    • 板材1和压电陶瓷2由于通过合金成形反应而形成的合金层3,由于至少含有镓的液体金属与板材1或压电陶瓷2之间的相互扩散现象, 液态金属与金属粉末之间的扩散现象。 合金层3可以包括铟,锡和锌中的至少一种或多种,​​以及铜,银,金和钯中的至少一种。 此外,可以在板材1和压电陶瓷2的至少一个接合表面上设置金属。该金属可以包括铜,银,金,锡和薄荷中的一种或多种。 此外,可以在板材1的接合表面1a侧上形成金属层。此外,非晶层可以形成在板材1和合金层3之间的至少一个部分之间,以及 压电陶瓷2和合金层3。