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    • 4. 发明申请
    • IMAGING DEVICE, IMAGING MODULE AND METHOD FOR MANUFACTURING IMAGING DEVICE
    • 成像装置,成像模块和制造成像装置的方法
    • US20120056291A1
    • 2012-03-08
    • US13051413
    • 2011-03-18
    • Kazuhiro SuzukiRisako UenoHonam KwonKoichi IshiiHideyuki Funaki
    • Kazuhiro SuzukiRisako UenoHonam KwonKoichi IshiiHideyuki Funaki
    • H01L27/146H01L31/18
    • H01L27/14618H01L27/14649H01L2224/13
    • According to one embodiment, an imaging device includes a substrate, a photodetecting portion, a circuit portion and a through interconnect. The substrate has a first major surface, a second major surface on a side opposite to the first major surface, a recess portion provided on the first major surface and retreated in a first direction going from the first major surface to the second major surface, and a through hole communicating with the first major surface and the second major surface and extending in the first direction. The photodetecting portion is provided above the recess portion and away from the substrate. The circuit portion is electrically connected to the photodetecting portion and provided on the first major surface. The through interconnect is electrically connected to the circuit portion and provided inside the through hole. The recess portion has a first inclined surface. The through hole has a second inclined surface.
    • 根据一个实施例,成像装置包括基板,光电检测部分,电路部分和通孔互连。 基板具有第一主表面,与第一主表面相对的一侧的第二主表面,设置在第一主表面上并沿着从第一主表面到第二主表面的第一方向退回的凹部,以及 与所述第一主表面和所述第二主表面连通并且沿所述第一方向延伸的通孔。 光电检测部分设置在凹部的上方并远离基板。 电路部分电连接到光电检测部分并设置在第一主表面上。 通孔互连电连接到电路部分并设置在通孔的内部。 凹部具有第一倾斜面。 通孔具有第二倾斜面。