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1. 发明授权

US07673382B2 External electrode forming method 有权
公开(公告)号：US07673382B2
公开(公告)日：2010-03-09
申请号：US11641911
申请日：2006-12-20
申请人： Ko Onodera , Satoshi Kurimoto , Yoji Tozawa , Shirou Ootsuki
发明人： Ko Onodera , Satoshi Kurimoto , Yoji Tozawa , Shirou Ootsuki
IPC分类号： H01C17/28
CPC分类号： H01G13/006 , Y10T29/49098 , Y10T29/49101 , Y10T29/49117 , Y10T29/49124 , Y10T29/49155
摘要： A method of forming an external electrode of an electronic component involving: a paste preparation step, a removal step, an element preparation step, a contact step, and a formation step. A jig with a groove into which an element forming the electronic component can be inserted is prepared. A conductive paste is filled in the groove, and then removed, so as to leave the conductive paste along a first wall surface of the groove and remove the rest. Then, element immediately above the groove is located, and inserted into the groove and moved toward the first wall surface. Finally, the element is moved along the first wall surface and toward the aperture in a state in which the ridgeline of the element is kept in contact with the first wall surface, and moved away from the first wall surface so as to separate the ridgeline from the first wall surface.

2. 发明授权

US07487815B2 Terminal electrode forming apparatus and system for holding electronic components 有权
标题翻译：用于保持电子部件的端子电极形成装置和系统
公开(公告)号：US07487815B2
公开(公告)日：2009-02-10
申请号：US11183751
申请日：2005-07-19
申请人： Ko Onodera , Satoshi Kurimoto
发明人： Ko Onodera , Satoshi Kurimoto
IPC分类号： B32B37/22 , B32B38/10
CPC分类号： H01G13/006 , Y10S156/922 , Y10S156/941 , Y10T29/417 , Y10T29/43 , Y10T29/435 , Y10T156/11 , Y10T156/17 , Y10T156/1702 , Y10T156/1707 , Y10T156/19 , Y10T156/1906
摘要： The invention provides an electrode forming method with steps of arraying chip-style electronic components on an arraying flat bed thereby positioning and aligning the components, lowering a film coated with an adhesive in relative manner together with an adhering top plate parallel to the arraying flat bed thereby adhering ends of the positioned and aligned chip-style electronic components to the adhesive, then lowering the first film to which the chip-style electronic components are adhered in relative manner together with a coating top plate parallel to a coating flat bed provided with a conductive paste layer of a constant thickness thereby pressing the other ends of the chip-style electronic components to the coating flat bed and coating the ends of the electronic components with the conductive paste.
摘要翻译：本发明提供了一种电极形成方法，该方法具有以下步骤：在阵列平板上排列芯片式电子部件，由此定位和对准部件，相对于平行于排列平板的粘合顶板，以相对的方式将涂覆有粘合剂的膜降低从而将定位的和对准的芯片式电子部件的端部粘合到粘合剂上，然后将与芯片式电子部件粘附的第一膜相对于平行于涂覆平板的涂层顶板相对降低，导电浆料层，从而将芯片式电子部件的另一端压入涂布平板，并用导电膏涂覆电子部件的端部。

3. 发明申请

US20060112546A1 Method of forming external electrode 有权
标题翻译：形成外部电极的方法
公开(公告)号：US20060112546A1
公开(公告)日：2006-06-01
申请号：US11288203
申请日：2005-11-29
申请人： Ko Onodera , Satoshi Kurimoto , Yoji Tozawa , Seiichi Nakagawa
发明人： Ko Onodera , Satoshi Kurimoto , Yoji Tozawa , Seiichi Nakagawa
IPC分类号： B05D5/12
CPC分类号： H01L23/4828 , H01L24/75 , H01L24/83 , H01L2224/838 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01078 , H01L2924/0781 , Y10T29/49117 , Y10T29/4913 , Y10T29/49144 , Y10T29/49147 , Y10T29/49169 , Y10T29/49204 , Y10T29/49213 , Y10T29/49222 , Y10T29/49224
摘要： The object of the invention is to provide a method of forming an external electrode of an electronic component whereby the external electrode can be formed in a stable fashion. In order to achieve this object, a method of fonning an external electrode according to the present invention includes: a step of forming an electrode portion 301a on a side face 30a of a chip 30 constituting an electronic component by applying a conductive paste 20 from a direction facing this side face 30a; a step of forming an electrode portion 301b on a side face 30b of the chip 30 facing the side face 30a by applying the conductive paste 20 from a direction facing this side face 30b; a step of forming an electrode portion 301c so as to connect the electrode portion 301a and electrode portion 301b on the bottom face of the chip 30 respectively adjacent to the side face 30a and the side face 30b; and a step of forming an external electrode 301 comprising the electrode portion 301a, electrode portion 301b and electrode portion 301c by drying this chip 30.
摘要翻译：本发明的目的是提供一种形成电子部件的外部电极的方法，由此能够以稳定的方式形成外部电极。为了实现该目的，根据本发明的外部电极的制造方法包括：通过施加导电膏20在构成电子部件的芯片30的侧面30a上形成电极部分301a的步骤从面向该侧面30a的方向; 通过从面向该侧面30b的方向施加导电膏20，在面向侧面30a的芯片30的侧面30b上形成电极部分301b的步骤; 形成电极部分301c以将电极部分301a和电极部分301b连接在分别与侧面30a和侧面30b相邻的芯片30的底面上的步骤; 以及通过干燥该芯片30形成包括电极部分301a，电极部分301b和电极部分301c的外部电极301的步骤。

4. 发明授权

US07458151B2 Method of forming external electrode 有权
标题翻译：形成外部电极的方法
公开(公告)号：US07458151B2
公开(公告)日：2008-12-02
申请号：US11288203
申请日：2005-11-29
申请人： Ko Onodera , Satoshi Kurimoto , Yoji Tozawa , Seiichi Nakagawa
发明人： Ko Onodera , Satoshi Kurimoto , Yoji Tozawa , Seiichi Nakagawa
IPC分类号： H01R43/00 , H05K3/30 , H01G2/20
CPC分类号： H01L23/4828 , H01L24/75 , H01L24/83 , H01L2224/838 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01078 , H01L2924/0781 , Y10T29/49117 , Y10T29/4913 , Y10T29/49144 , Y10T29/49147 , Y10T29/49169 , Y10T29/49204 , Y10T29/49213 , Y10T29/49222 , Y10T29/49224
摘要： The object of the invention is to provide a method of forming an external electrode of an electronic component whereby the external electrode can be formed in a stable fashion. In order to achieve this object, a method of forming an external electrode according to the present invention includes: a step of forming an electrode portion 301a on a side face 30a of a chip 30 constituting an electronic component by applying a conductive paste 20 from a direction facing this side face 30a; a step of forming an electrode portion 301b on a side face 30b of the chip 30 facing the side face 30a by applying the conductive paste 20 from a direction facing this side face 30b; a step of forming an electrode portion 301c so as to connect the electrode portion 301a and electrode portion 301b on the bottom face of the chip 30 respectively adjacent to the side face 30a and the side face 30b; and a step of forming an external electrode 301 comprising the electrode portion 301a, electrode portion 301b and electrode portion 301c by drying this chip 30.
摘要翻译：本发明的目的是提供一种形成电子部件的外部电极的方法，由此能够以稳定的方式形成外部电极。为了实现该目的，根据本发明的形成外部电极的方法包括：通过从导电膏20涂覆构成电子部件的芯片30的侧面30a上形成电极部分301a的步骤朝向该侧面30a的方向; 通过从面向该侧面30b的方向施加导电膏20，在面向侧面30a的芯片30的侧面30b上形成电极部分301b的步骤; 形成电极部分301c以将电极部分301a和分别邻近侧面30a和侧面30b的芯片30的底面上的电极部分301b连接的步骤; 以及通过干燥该芯片30形成包括电极部分301a，电极部分301b和电极部分301c的外部电极301的步骤。

5. 发明授权

US08254083B2 Ceramic electronic component and method for producing same 有权
标题翻译：陶瓷电子部件及其制造方法
公开(公告)号：US08254083B2
公开(公告)日：2012-08-28
申请号：US12851106
申请日：2010-08-05
申请人： Takashi Sakurai , Shinya Yoshihara , Ko Onodera , Hisayuki Abe , Masahiko Konno , Satoshi Kurimoto , Hiroshi Shindo , Akihiro Horita , Genichi Watanabe , Yoshikazu Ito
发明人： Takashi Sakurai , Shinya Yoshihara , Ko Onodera , Hisayuki Abe , Masahiko Konno , Satoshi Kurimoto , Hiroshi Shindo , Akihiro Horita , Genichi Watanabe , Yoshikazu Ito
IPC分类号： H01G4/06
CPC分类号： H01G4/2325 , B23K1/0016 , H01G4/30
摘要： There are provided a ceramic electronic component and a method for producing the ceramic electronic component, where a ground electrode layer can be directly coated with lead-free solder without lowering reliabilities. Terminal electrode 3 is provided with a ground electrode layer 21 of Cu having been formed by firing, a solder layer 22 formed of a lead-free solder based on five elements of Sn—Ag—Cu—Ni—Ge, and a diffusion layer 23 having been formed by the diffusion of Ni between the ground electrode layer 21 and the solder layer 22. Because the diffusion layer 23 of Ni is formed between the ground electrode layer 21 and the solder layer 22, the diffusion layer 23, which functions as a barrier layer, suppresses the solder leach of Cu from the ground electrode layer 21. The diffusion layer 23 of Ni can also suppress the growth of fragile intermetallic compounds of Sn—Cu. Therefore, a decrease in the bonding strength between the ground electrode layer 21 and the solder layer 22 can be prevented.
摘要翻译：提供陶瓷电子部件和陶瓷电子部件的制造方法，其中接地电极层可以直接涂覆无铅焊料，而不降低可靠性。端子电极3设置有通过烧制形成的Cu的接地电极层21，基于Sn-Ag-Cu-Ni-Ge的五个元素的无铅焊料形成的焊料层22和扩散层23 这是由于接地电极层21和焊料层22之间的Ni的扩散而形成的。由于在接地电极层21和焊料层22之间形成有Ni的扩散层23，所以作为从接地电极层21抑制Cu的浸出.Ni的扩散层23也可以抑制Sn-Cu的易碎金属间化合物的生长。因此，可以防止接地电极层21和焊料层22之间的接合强度的降低。

6. 发明申请

US20050247407A1 Terminal electrode forming apparatus and system for holding electronic components 有权
标题翻译：用于保持电子部件的端子电极形成装置和系统
公开(公告)号：US20050247407A1
公开(公告)日：2005-11-10
申请号：US11183751
申请日：2005-07-19
申请人： Ko Onodera , Satoshi Kurimoto
发明人： Ko Onodera , Satoshi Kurimoto
IPC分类号： H01L23/48 , H01G13/00 , B32B31/00
CPC分类号： H01G13/006 , Y10S156/922 , Y10S156/941 , Y10T29/417 , Y10T29/43 , Y10T29/435 , Y10T156/11 , Y10T156/17 , Y10T156/1702 , Y10T156/1707 , Y10T156/19 , Y10T156/1906
摘要： The invention provides an electrode forming method with steps of arraying chip-style electronic components on an arraying flat bed thereby positioning and aligning the components, lowering a film coated with an adhesive in relative manner together with an adhering top plate parallel to the arraying flat bed thereby adhering ends of the positioned and aligned chip-style electronic components to the adhesive, then lowering the first film to which the chip-style electronic components are adhered in relative manner together with a coating top plate parallel to a coating flat bed provided with a conductive paste layer of a constant thickness thereby pressing the other ends of the chip-style electronic components to the coating flat bed and coating the ends of the electronic components with the conductive paste.
摘要翻译：本发明提供了一种电极形成方法，该方法具有以下步骤：在阵列平板上排列芯片式电子部件，由此定位和对准部件，相对于平行于排列平板的粘合顶板，以相对的方式将涂覆有粘合剂的膜降低从而将定位的和对准的芯片式电子部件的端部粘合到粘合剂上，然后将与芯片式电子部件粘附的第一膜相对于平行于涂覆平板的涂层顶板相对降低，导电浆料层，从而将芯片式电子部件的另一端压入涂布平板，并用导电膏涂覆电子部件的端部。

7. 发明授权

US06749890B2 Terminal electrode forming method in chip-style electronic component and apparatus therefor 有权
公开(公告)号：US06749890B2
公开(公告)日：2004-06-15
申请号：US09820846
申请日：2001-03-30
申请人： Ko Onodera , Satoshi Kurimoto
发明人： Ko Onodera , Satoshi Kurimoto
IPC分类号： B05D512
CPC分类号： H01G13/006 , Y10S156/922 , Y10S156/941 , Y10T29/417 , Y10T29/43 , Y10T29/435 , Y10T156/11 , Y10T156/17 , Y10T156/1702 , Y10T156/1707 , Y10T156/19 , Y10T156/1906
摘要： The invention provides an electrode forming method with steps of arraying chip-style electronic components on an arraying flat bed thereby positioning and aligning the components, lowering a film coated with an adhesive in relative manner together with an adhering top plate parallel to the arraying flat bed thereby adhering ends of the positioned and aligned chip-style electronic components to the adhesive, then lowering the first film to which the chip-style electronic components are adhered in relative manner together with a coating top plate parallel to a coating flat bed provided with a conductive paste layer of a constant thickness thereby pressing the other ends of the chip-style electronic components to the coating flat bed and coating the ends of the electronic components with the conductive paste.

8. 发明授权

US07803421B2 External electrode forming method 有权
标题翻译：外部电极形成方法
公开(公告)号：US07803421B2
公开(公告)日：2010-09-28
申请号：US11636622
申请日：2006-12-11
申请人： Ko Onodera , Satoshi Kurimoto , Yoji Tozawa , Shirou Ootsuki
发明人： Ko Onodera , Satoshi Kurimoto , Yoji Tozawa , Shirou Ootsuki
IPC分类号： B05D5/12 , B05D1/18 , H01G7/00
CPC分类号： H01G13/006 , H01L21/4867 , H01L23/49805 , H01L24/11 , H01L2224/1131 , H01L2224/13099 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01033 , H01L2924/01082 , H05K3/403 , Y10T29/43
摘要： An element forming an electronic component has a first face and a second face facing each other, and a third face adjacent to each of the first face and the second face. A method of forming an external electrode of the electronic component involves a pre-formation step, first to third formation steps, and an electrode formation step. The pre-formation step is to apply a conductive paste onto the third face and to evaporate at least a part of a liquid contained in the applied conductive paste, to form a precoat portion expected to become a part of a third electrode portion. The first formation step is to apply the conductive paste from a direction opposite to the first face, onto the first face to form a first electrode portion. The second formation step is to apply the conductive paste from a direction opposite to the second face, onto the second face to form a second electrode portion. The third formation step is to apply the conductive paste onto the third face so as to cover the precoat portion, to form the third electrode portion. The electrode formation step is to dry the element to form the external electrode consisting of the first electrode portion, the second electrode portion, and the third electrode portion. The first electrode portion, the second electrode portion, and the third electrode portion are formed so as to connect with each other.
摘要翻译：形成电子部件的元件具有彼此相对的第一面和第二面以及与第一面和第二面中的每一个相邻的第三面。形成电子部件的外部电极的方法包括预成形工序，第一〜第三形成工序以及电极形成工序。预成形步骤是将导电浆料涂敷在第三面上，蒸发所涂敷的导电浆料中含有的液体的至少一部分，形成预期成为第三电极部分的一部分的预涂部分。第一形成步骤是将导电膏从与第一面相反的方向涂覆到第一面上以形成第一电极部分。第二形成步骤是将导电膏从与第二面相反的方向涂覆到第二面上以形成第二电极部分。第三形成步骤是将导电膏涂覆到第三面以覆盖预涂部分，以形成第三电极部分。电极形成步骤是干燥元件以形成由第一电极部分，第二电极部分和第三电极部分组成的外部电极。第一电极部分，第二电极部分和第三电极部分形成为彼此连接。

9. 发明申请

US20100043221A1 External electrode forming method 有权
标题翻译：外部电极形成方法
公开(公告)号：US20100043221A1
公开(公告)日：2010-02-25
申请号：US12588613
申请日：2009-10-21
申请人： Ko Onodera , Satoshi Kurimoto , Yoji Tozawa , Shirou Ootsuki
发明人： Ko Onodera , Satoshi Kurimoto , Yoji Tozawa , Shirou Ootsuki
IPC分类号： H01R43/00
CPC分类号： H01G13/006 , Y10T29/49098 , Y10T29/49101 , Y10T29/49117 , Y10T29/49124 , Y10T29/49155
摘要： A method of forming an external electrode of an electronic component involving: a paste preparation step, a removal step, an element preparation step, a contact step, and a formation step. A jig with a groove into which an element forming the electronic component can be inserted is prepared. A conductive paste is filled in the groove, and then removed, so as to leave the conductive paste along a first wall surface of the groove and remove the rest. Then, element immediately above the groove is located, and inserted into the groove and moved toward the first wall surface. Finally, the element is moved along the first wall surface and toward the aperture in a state in which the ridgeline of the element is kept in contact with the first wall surface, and moved away from the first wall surface so as to separate the ridgeline from the first wall surface.
摘要翻译：一种形成电子部件的外部电极的方法，包括：糊剂制备步骤，去除步骤，元件制备步骤，接触步骤和形成步骤。准备具有可插入形成电子部件的元件的槽的夹具。将导电浆料填充在凹槽中，然后除去，以便沿沟槽的第一壁表面离开导电膏，并将其余部分除去。然后，立即在凹槽上方的元件被定位并且插入凹槽中并朝向第一壁表面移动。最后，元件在元件的棱线与第一壁表面保持接触的状态下沿着第一壁表面移动并朝向孔径移动，并且从第一壁表面移开，以将棱线与第一壁表面分开第一个墙面。

10. 发明授权

US08291585B2 Method for manufacturing electronic component 有权
标题翻译：电子元件制造方法
公开(公告)号：US08291585B2
公开(公告)日：2012-10-23
申请号：US12195772
申请日：2008-08-21
申请人： Ko Onodera , Satoshi Kurimoto , Hisayuki Abe , Taketo Sasaki , Yoji Tozawa , Osamu Hirose
发明人： Ko Onodera , Satoshi Kurimoto , Hisayuki Abe , Taketo Sasaki , Yoji Tozawa , Osamu Hirose
IPC分类号： H01R9/00 , H05K3/00
CPC分类号： H01G4/2325 , H01G4/30 , Y10T29/417 , Y10T29/49126 , Y10T29/4913 , Y10T29/49149 , Y10T29/49155
摘要： A chip element in the form of a substantially rectangular parallelepiped having end surfaces and side surfaces is formed (step of forming chip element). An electrically conductive green sheet is formed (step of forming electrically conductive green sheet). An electrically conductive paste is applied to the end surfaces of the chip element (step of application electrically conductive paste). A chip element is formed in which the electrically conductive green sheet is attached to the end surface via the electrically conductive paste applied to the end surface of the chip element (step of attaching electrically conductive sheet). In the step of attaching, the end surface of the electrically conductive green sheet on the side of the side surfaces is positioned on the outside of the side surfaces, and the electrically conductive paste applied to the end surface is pressed out into a space between the electrically conductive green sheet and ridge portions.
摘要翻译：形成具有端面和侧面的大致长方体形状的芯片元件（形成芯片元件的步骤）。形成导电性生片（形成导电性生片的工序）。在芯片元件的端面施加导电性糊剂（涂敷导电糊剂的步骤）。形成芯片元件，其中导电生片通过施加到芯片元件的端面上的导电膏（附着导电片的步骤）附着到端表面。在安装的步骤中，导电性生片在侧面侧的端面位于侧面的外侧，并且施加到端面的导电糊被压出到导电生片和脊部。

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