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1. 发明申请

US20110044001A1 COOLING DEVICE FOR A PLURALITY OF POWER MODULES 有权
标题翻译：用于多个功率模块的冷却装置
公开(公告)号：US20110044001A1
公开(公告)日：2011-02-24
申请号：US12990007
申请日：2009-04-27
申请人： Klaus Kristen Olesen , Lars Paulsen , Jens Klinghagen
发明人： Klaus Kristen Olesen , Lars Paulsen , Jens Klinghagen
IPC分类号： H05K7/20
CPC分类号： H05K7/20254 , H01L23/473 , H01L2924/0002 , H05K7/20927 , H01L2924/00
摘要： The invention relates to a cooling device for a plurality of power modules (16), comprising a heat-conducting body (15) through which a coolant flows. Said cooling device comprises external cooling ribs (14) on a first housing shell of the body through which a coolant flows for receiving the plurality of power modules adjacent to each other. Each individual cooling rib is aligned to come into fixed heat-conducting contact on at least one upper or lower side of one of the plurality of power modules, and the housing shell, on the inner side in the region of the respective cooling rib(s), comprises means for the fluidic communication with the volume of the coolant in the inside the body through which the coolant flows.
摘要翻译：本发明涉及一种用于多个功率模块（16）的冷却装置，其包括冷却剂流过的导热体（15）。所述冷却装置包括在主体的第一壳体壳体上的外部冷却肋（14），冷却剂通过该冷却肋流动以接收彼此相邻的多个功率模块。每个单独的冷却肋对准以在多个功率模块中的一个的至少一个上侧或下侧上进入固定的导热接触，并且壳体壳体在相应冷却肋（s）的区域中的内侧）包括用于与冷却剂流过的主体内部的冷却剂的体积流体连通的装置。

2. 发明授权

US07529091B2 Power semiconductor module and method for cooling a power semiconductor module 有权
标题翻译：功率半导体模块和用于冷却功率半导体模块的方法
公开(公告)号：US07529091B2
公开(公告)日：2009-05-05
申请号：US11597158
申请日：2005-05-24
申请人： Klaus Kristen Olesen , Ronald Eisele
发明人： Klaus Kristen Olesen , Ronald Eisele
IPC分类号： H05K7/20 , H01L23/473
CPC分类号： H01L23/473 , H01L25/072 , H01L2924/0002 , H01L2924/00
摘要： The invention relates to a power semiconductor module comprising a plurality of power semiconductors that are fixed to a first side of a printed circuit board (26), and a cooling device that acts by means of a coolant, on a second side of the printed circuit board (26), opposite the first side, the cooling device comprising a plurality of cells through which the coolant is guided. The aim of the invention is to minimise the risk of failure of one such power semiconductor module. To this end, a non-cooled region (d, e, f) is arranged between at least two cells.
摘要翻译：本发明涉及一种功率半导体模块，其包括固定到印刷电路板（26）的第一侧的多个功率半导体以及在印刷电路的第二面上借助于冷却剂作用的冷却装置板（26），与第一侧相对，冷却装置包括多个单元，冷却剂通过该单元被引导。本发明的目的是最小化一个这样的功率半导体模块故障的风险。为此，非冷却区域（d，e，f）布置在至少两个单元之间。

3. 发明授权

US08490681B2 Fluid cooling system 失效
标题翻译：流体冷却系统
公开(公告)号：US08490681B2
公开(公告)日：2013-07-23
申请号：US10592249
申请日：2005-03-09
申请人： Ronald Eisele , Klaus Kristen Olesen
发明人： Ronald Eisele , Klaus Kristen Olesen
IPC分类号： F28F7/02
CPC分类号： F28F3/12 , F28F9/0268 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： The invention provides a fluid cooling system comprising a heat exchanger with an outer wall forming a chamber with an inlet and an outlet for circulating a heat exchange medium in the chamber. The chamber has an opening towards the component which is to be cooled, and to protect the component, the opening is closed by a flexible wall which is attached to the outer wall. To protect the cover and the component against overload, the flexible wall is attached to an inner wall inside the chamber. The cooling system could be applied to electronic systems, e.g. for cooling a DCB substrate or similar electronic components.
摘要翻译：本发明提供了一种流体冷却系统，其包括具有外壁的热交换器，所述外壁形成具有用于使所述室中的热交换介质循环的入口和出口的室。腔室具有朝向要被冷却的部件的开口，并且为了保护部件，开口被附接到外壁的柔性壁封闭。为了保护盖和部件免受过载，柔性壁附接到室内的内壁。冷却系统可以应用于电子系统，例如，用于冷却DCB基板或类似的电子部件。

4. 发明授权

US08066057B2 Flow distributing unit and cooling unit 有权
标题翻译：流量分配单元和冷却单元
公开(公告)号：US08066057B2
公开(公告)日：2011-11-29
申请号：US10577140
申请日：2004-10-26
申请人： Klaus Kristen Olesen
发明人： Klaus Kristen Olesen
IPC分类号： F28F7/00 , F28D15/00
CPC分类号： F28F9/0268 , F28F3/12 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A distributor (1) for distributing a flow of cooling fluid over one or more surface(s) (3) to be cooled has a housing (13) that may be manufactured in a single piece together with inlet (8) and outlet (9) manifolds and a plurality of flow cells (26, 27, 28, 29). The flow cells (26, 27, 28, 29) may be connected in parallel between the manifolds (8, 9), and may be adapted to cool multiple surfaces (3) simultaneously. The present invention is also directed to a fluid-coolable unit comprising a distributor (1) for removing heat from an electronic circuit, such as integrated circuit or CPU.
摘要翻译：用于将冷却流体流分配在要冷却的一个或多个表面（3）上的分配器（1）具有壳体（13），其可以与入口（8）和出口（9）一起制成单件）歧管和多个流动池（26,27,28,29）。流动池（26,27,28,29）可以在歧管（8,9）之间并联连接，并且可以适于同时冷却多个表面（3）。本发明还涉及一种流体冷却单元，其包括用于从诸如集成电路或CPU的电子电路移除热量的分配器（1）。

5. 发明授权

US07360582B2 Flow distributing unit and cooling unit having bypass flow 有权
标题翻译：流量分配单元和具有旁路流量的冷却单元
公开(公告)号：US07360582B2
公开(公告)日：2008-04-22
申请号：US10577027
申请日：2004-10-26
申请人： Klaus Kristen Olesen
发明人： Klaus Kristen Olesen
IPC分类号： F28F7/02
CPC分类号： F28F9/0268 , F28F3/12 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A cooling unit for cooling in particular power semiconductors contains a distributor for guiding liquid across a surface to be cooled. The distributor comprises an inlet manifold (8) and outlet manifold (9), whereby the inlet and outlet manifolds are connected through a flow cell, which has a main flow channel (50). The main channel is formed as a meandering sequence of channel segments (61,62,63,64). It has been found, that the transfer of heat by the liquid in the main flow channel can be improved by introducing a bypass flow channel (71,72,73) which allows the flow of liquid from the cell inlet to the cell outlet, wherein the bypass flow channel interconnects the channel segments of the main flow channel.
摘要翻译：用于冷却特定功率半导体的冷却单元包含用于引导液体穿过待冷却表面的分配器。分配器包括入口歧管（8）和出口歧管（9），由此入口歧管和出口歧管通过具有主流动通道（50）的流动池连接。主通道形成为通道段的曲折序列（61,62,63,64）。已经发现，可以通过引入允许液体从细胞入口流到细胞出口的旁路流动通道（71,72,73）来改善主流道中的液体的热传递，其中旁通流动通道将主流动通道的通道段相互连接。

6. 发明授权

US07339788B2 Cooling unit and flow distributing element for use in such unit 有权
标题翻译：冷却单元和用于这种单元的流量分配元件
公开(公告)号：US07339788B2
公开(公告)日：2008-03-04
申请号：US10512902
申请日：2003-05-07
申请人： Klaus Kristen Olesen , Ronald Eisele , Steen Lauridsen
发明人： Klaus Kristen Olesen , Ronald Eisele , Steen Lauridsen
IPC分类号： H05K7/20 , F28F7/00
CPC分类号： F28F9/0268 , F28D2021/0029 , F28F3/12 , F28F13/06 , H01L23/473 , H01L2924/0002 , H05K7/20927 , H01L2924/00
摘要： A liquid-cooled power semiconductor unit has components to be cooled arranged on the upper side of a plate. The bottom side of the plate is cooled by liquid, which is guided along the plate by means of a distributing element, and the liquid inlet and the liquid outlet of the distributing element are preferably arranged perpendicular to the plate. The distributing element is divided into cells, where each cell has a liquid inlet and a liquid outlet perpendicular to the cooled plate, and the distributing element has multiple cells along the plate.
摘要翻译：液冷功率半导体单元具有布置在板的上侧的要冷却的部件。板的底侧由液体冷却，液体通过分配元件沿着板引导，分配元件的液体入口和液体出口优选地垂直于板布置。分配元件分为单元，其中每个单元具有液体入口和垂直于冷却板的液体出口，并且分配元件沿着该板具有多个单元。

7. 发明申请

US20140076522A1 COOLING SYSTEM FOR A POWER MODULE 审中-公开
标题翻译：电源模块冷却系统
公开(公告)号：US20140076522A1
公开(公告)日：2014-03-20
申请号：US14007801
申请日：2012-04-02
申请人： Klaus Kristen Olesen , Joergen Holst , Georg Fosel , Peter Brandt , Perer Jensen , Steen Hornsleth , Carsten Rothmann
发明人： Klaus Kristen Olesen , Joergen Holst , Georg Fosel , Peter Brandt , Perer Jensen , Steen Hornsleth , Carsten Rothmann
IPC分类号： F25B39/04
CPC分类号： F25B39/04 , H05K7/20309 , H05K7/20936
摘要： A cooling system for a power module (or some other power electronics device) is described, the cooling system having a closed flow path for circulating a cooling fluid, the flow path having a pressure that is reduced to below atmospheric pressure. The cooling fluid is circulated along the flow path to provide cooling of the power module. The flow path is delimited from the exterior environment by a space provided between the flow path and the exterior environment, said space being sealed off from the cooling flow path, and said space being sealed off towards the exterior environment. The flow path has a pressure below atmospheric pressure and the space between the flow path and the exterior environment is evacuated and typically has a pressure lower than the pressure in the flow path.
摘要翻译：描述了用于功率模块（或一些其他电力电子设备）的冷却系统，该冷却系统具有用于使冷却流体循环的封闭流动路径，该流动路径具有降低到低于大气压力的压力。冷却流体沿着流动路径循环以提供功率模块的冷却。流动路径通过设置在流路和外部环境之间的空间从外部环境界定，所述空间与冷却流路密封，并且所述空间朝向外部环境密封。流动路径具有低于大气压力的压力，并且流动路径和外部环境之间的空间被抽真空并且通常具有低于流动路径中的压力的压力。

8. 发明授权

US08451609B2 Cooling device for a plurality of power modules 有权
标题翻译：用于多个功率模块的冷却装置
公开(公告)号：US08451609B2
公开(公告)日：2013-05-28
申请号：US12990007
申请日：2009-04-27
申请人： Klaus Kristen Olesen , Lars Paulsen , Jens Klinghagen
发明人： Klaus Kristen Olesen , Lars Paulsen , Jens Klinghagen
IPC分类号： H05K7/20 , F28F7/00
CPC分类号： H05K7/20254 , H01L23/473 , H01L2924/0002 , H05K7/20927 , H01L2924/00
摘要： The invention relates to a cooling device for a plurality of power modules (16), comprising a heat-conducting body (15) through which a coolant flows. The cooling device comprises external cooling ribs (14) on a first housing shell of the body through which a coolant flows for receiving the plurality of power modules adjacent to each other. Each individual cooling rib is aligned to come into fixed heat-conducting contact on at least one upper or lower side of one of the plurality of power modules, and the housing shell, on the inner side in the region of the respective cooling rib(s), comprises means for the fluidic communication with the volume of the coolant in the inside the body through which the coolant flows.
摘要翻译：本发明涉及一种用于多个功率模块（16）的冷却装置，其包括冷却剂流过的导热体（15）。冷却装置包括在主体的第一壳体壳体上的外部冷却肋（14），冷却剂通过该外部冷却肋流动以接收彼此相邻的多个功率模块。每个单独的冷却肋对准以在多个功率模块中的一个的至少一个上侧或下侧上进入固定的导热接触，并且壳体壳体在相应冷却肋（s）的区域中的内侧）包括用于与冷却剂流过的主体内部的冷却剂的体积流体连通的装置。

9. 发明授权

US07835151B2 Flow distribution module and a stack of flow distribution modules 有权
标题翻译：流量分配模块和一组流量分配模块
公开(公告)号：US07835151B2
公开(公告)日：2010-11-16
申请号：US11719766
申请日：2005-11-22
申请人： Klaus Kristen Olesen
发明人： Klaus Kristen Olesen
IPC分类号： H05K7/20 , H01L23/36
CPC分类号： H01L23/473 , H01L25/117 , H01L2924/0002 , H05K7/20927 , H01L2924/00
摘要： A flow distribution module (5) for distributing a flow of cooling fluid across a surface. Is adapted to be connected to another at least substantially identical module (5). Makes it possible to provide a cooling unit which may be customized to meet specific cooling needs without requiring special adaptation of the ‘building blocks’. Thereby provides a flexible, yet simple, system. Furthermore a stack of flow distribution modules (5). Provides a very compact cooling unit when cooling is needed for several surfaces, no need for a cooling unit having a large surface area because the modules may be stacked in stead of positioned side-by-side.
摘要翻译：一种用于分布冷却流体流过表面的流量分配模块（5）。适于连接到另一个至少基本相同的模块（5）。可以提供可以定制的冷却单元，以满足特定的冷却需求，而不需要对“构件”进行特殊的调整。从而提供一个灵活但简单的系统。此外，一组流量分配模块（5）。在几个表面需要冷却时，提供非常紧凑的冷却单元，不需要具有大表面积的冷却单元，因为模块可以被并排定位并排。

10. 发明申请

US20090146293A1 FLOW DISTRIBUTION MODULE AND A STACK OF FLOW DISTRIBUTION MODULES 有权
标题翻译：流量分配模块和流量分布模块堆栈
公开(公告)号：US20090146293A1
公开(公告)日：2009-06-11
申请号：US11719766
申请日：2005-11-22
申请人： Klaus Kristen Olesen
发明人： Klaus Kristen Olesen
IPC分类号： H01L23/34
CPC分类号： H01L23/473 , H01L25/117 , H01L2924/0002 , H05K7/20927 , H01L2924/00
摘要： A flow distribution module (5) for distributing a flow of cooling fluid across a surface. Is adapted to be connected to another at least substantially identical module (5). Makes it possible to provide a cooling unit which may be customized to meet specific cooling needs without requiring special adaptation of the ‘building blocks’. Thereby provides a flexible, yet simple, system. Furthermore a stack of flow distribution modules (5). Provides a very compact cooling unit when cooling is needed for several surfaces, no need for a cooling unit having a large surface area because the modules may be stacked in stead of positioned side-by-side.
摘要翻译：一种用于分布冷却流体流过表面的流量分配模块（5）。适于连接到另一个至少基本相同的模块（5）。可以提供可以定制的冷却单元，以满足特定的冷却需求，而不需要对“构件”进行特殊的调整。从而提供一个灵活但简单的系统。此外，一组流量分配模块（5）。在几个表面需要冷却时，提供非常紧凑的冷却单元，不需要具有大表面积的冷却单元，因为模块可以被并排定位并排。

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