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1. 发明授权

US06193803B1 Substrate holding apparatus for processing semiconductors 有权
标题翻译：用于处理半导体的基板保持装置
公开(公告)号：US06193803B1
公开(公告)日：2001-02-27
申请号：US09213582
申请日：1998-12-17
申请人： Kiyoshi Sato , Mikio Shimizu , Yukihiro Mori
发明人： Kiyoshi Sato , Mikio Shimizu , Yukihiro Mori
IPC分类号： C23C1600
CPC分类号： C23C16/4581
摘要： A substrate-holding apparatus for holding a semiconductor substrate in a semiconductor processor is characterized in that the apparatus includes a mount block made of an aluminum alloy wrought product and having a mount surface for mounting a semiconductor thereon, a heating block with a heater body embedded therein for heating the semiconductor substrate, and a shield member made of an aluminum alloy wrought product for housing the heating block. The mount plate is securely attached to the heating block by brazing or with bolts.
摘要翻译：用于将半导体基板保持在半导体处理器中的基板保持装置的特征在于，该装置包括由铝合金锻造产品制成的安装块，并具有用于在其上安装半导体的安装表面，加热块嵌入其中用于加热半导体衬底，以及由用于容纳加热块的铝合金锻造产品制成的屏蔽构件。安装板通过钎焊或螺栓牢固地附接到加热块。

2. 发明授权

US06159301A Substrate holding apparatus for processing semiconductor 失效
标题翻译：用于半导体处理的基板保持装置
公开(公告)号：US06159301A
公开(公告)日：2000-12-12
申请号：US213463
申请日：1998-12-17
申请人： Kiyoshi Sato , Mikio Shimizu , Toshihiko Hanamachi , Shinya Miyaji
发明人： Kiyoshi Sato , Mikio Shimizu , Toshihiko Hanamachi , Shinya Miyaji
IPC分类号： C23C16/44 , C23C16/458 , C23C16/46 , H01L21/00 , H01L21/205 , H01L21/683 , H01L21/687 , C23C16/00
CPC分类号： H01L21/68757 , C23C16/4581 , C23C16/4583 , C23C16/4586 , H01L21/67103 , H01L21/68785
摘要： A substrate-holding apparatus for holding a semiconductor substrate in a semiconductor processor is characterized in that the apparatus includes a mount block made of, e.g., aluminum nitrate with a high-frequency electrode embedded therein and a heating block made of, e.g., an aluminum alloy with a heating body embedded therein. The mount block is tightly attached to the heating block by engaging the bottom surface of the mount block with the top surface of the heating block, for example, by using a latching mechanism.
摘要翻译：用于将半导体基板保持在半导体处理器中的基板保持装置的特征在于，该装置包括由例如其中嵌入有高频电极的硝酸铝制成的安装块和由例如铝制成的加热块合金，其中嵌入有加热体。通过例如通过使用闭锁机构将安装块与加热块的顶表面接合，从而将安装块紧密地附接到加热块。

3. 发明申请

US20140020507A1 SCOTT RUSSELL MECHANISM DEVICE 有权
标题翻译：苏格兰俄罗斯机械设备
公开(公告)号：US20140020507A1
公开(公告)日：2014-01-23
申请号：US14008517
申请日：2011-03-30
申请人： Hiromichi Sasaki , Mikio Shimizu , Yasunori Ichikawa
发明人： Hiromichi Sasaki , Mikio Shimizu , Yasunori Ichikawa
IPC分类号： B25J9/04 , F16H21/44
CPC分类号： B25J18/00 , B25J9/04 , B25J9/106 , B25J17/00 , B25J18/005 , F16H21/44 , Y10S901/25 , Y10T74/18888 , Y10T74/20329
摘要： A tip end part of a main arm member of a Scott Russell mechanism is enabled to be brought close to a base end part of a sub arm member. A Scott Russell mechanism device is formed into a boomerang-like shape such that a main arm member coupled to a sub arm member is curved to detour a coupling position. Thus, when the coupling angle is changed so that a base end part of the main arm member and a base end part of the sub arm member are most separated from each other, a tip end part of the main arm member can be moved close to right beside the base end part of the sub arm member. With the Scott Russell mechanism device, a moving range of the tip end side of the main arm member can be enlarged.
摘要翻译：可以使Scott Russell机构的主臂部件的前端部靠近副臂部件的基端部。斯科特罗素机构装置形成为回旋镖形状，使得联接到副臂构件的主臂构件弯曲以绕开联接位置。因此，当连接角度变化使得主臂构件的基端部和副臂构件的基端部分彼此分离时，主臂构件的前端部能够靠近在副臂构件的基端部的旁边。利用Scott Russell机构装置，能够扩大主臂部件的前端侧的移动范围。

4. 发明授权

US07813544B2 Estimation device 有权
标题翻译：估计装置
公开(公告)号：US07813544B2
公开(公告)日：2010-10-12
申请号：US11642763
申请日：2006-12-20
申请人： Naoki Fukaya , Mikio Shimizu , Shin Ishii , Tomohiro Shibata , Takashi Bando
发明人： Naoki Fukaya , Mikio Shimizu , Shin Ishii , Tomohiro Shibata , Takashi Bando
IPC分类号： G06K9/00 , G06K9/62
CPC分类号： G06K9/00248
摘要： An estimation device estimates a hidden state of an estimation subject from an observable state in a manner of a time series. The observable state is observed from the hidden state of the estimation subject under a procedure that has a hierarchical structure, which includes the hidden state of the estimation subject, the observable state, and an intermediate hidden state therebetween. The estimation device includes an estimation subject hidden state predicting means, an intermediate hidden state predicting means based on the state transition structure of the hidden state of the estimation subject, an intermediate hidden state likelihood observing means, an intermediate hidden state estimating means, an estimation subject hidden state likelihood observing means, estimation subject hidden state estimating means, an intermediate hidden state predicting means based on the state transition structure of the intermediate hidden state, and the mixing means.
摘要翻译：估计装置以时间序列的方式估计估计对象的可观察状态的隐藏状态。从具有层次结构的程序的估计对象的隐藏状态观察可观察状态，其包括估计对象的隐藏状态，可观察状态和它们之间的中间隐藏状态。估计装置包括估计对象隐藏状态预测装置，基于估计对象的隐藏状态的状态转移结构的中间隐藏状态预测装置，中间隐藏状态似然观察装置，中间隐藏状态估计装置，估计被摄体隐藏状态似然观察装置，估计对象隐藏状态估计装置，基于中间隐藏状态的状态转移结构的中间隐藏状态预测装置和混合装置。

5. 发明授权

US07084516B2 Surface protection film 失效
标题翻译：表面保护膜
公开(公告)号：US07084516B2
公开(公告)日：2006-08-01
申请号：US10483270
申请日：2002-07-15
申请人： Atsushi Takei , Hisatsugu Tokunaga , Mikio Shimizu
发明人： Atsushi Takei , Hisatsugu Tokunaga , Mikio Shimizu
IPC分类号： H01L29/40
CPC分类号： C09J133/08 , C08L2666/36 , C09J7/22 , C09J7/38 , C09J2201/602 , C09J2433/00 , C09J2467/006 , G02F1/133502 , G02F2202/22 , G02F2202/28 , H01L2224/274 , H01L2924/01019 , H01L2924/09701
摘要： A surface protection film which comprises a substrate layer and an adhesive layer, and of which the electrostatic charge by peeling from an adherend is from +0.01 to −0.01 nC/mm2.
摘要翻译：一种表面保护膜，其包括基材层和粘合剂层，其中通过从被粘物剥离的静电电荷为+ 0.01至-0.01nC / mm 2。

6. 发明申请

US20050106371A1 Static electricity preventing method and method using the method 有权
标题翻译：静电防治方法及使用方法
公开(公告)号：US20050106371A1
公开(公告)日：2005-05-19
申请号：US10502808
申请日：2003-02-18
申请人： Hisatsugu Tokunaga , Atsushi Takei , Mikio Shimizu , Takeshi Nabeta
发明人： Hisatsugu Tokunaga , Atsushi Takei , Mikio Shimizu , Takeshi Nabeta
IPC分类号： B29C70/88 , B29C71/00 , B32B7/02 , B32B27/00 , B32B27/18 , B65D73/02 , C08J7/04 , H01B5/14 , H01L23/60
CPC分类号： B29C71/0081 , B29C70/882 , B29K2995/0005 , Y10T156/10 , Y10T156/1089 , Y10T156/1092 , Y10T428/24802 , Y10T428/24942 , Y10T428/2495 , Y10T428/24959 , Y10T428/24967 , Y10T428/24975 , Y10T428/24983 , Y10T428/24992
摘要： The present invention provides a new antistatic method and its application to members. The present invention is an antistatic method featured to mount multiple resin based composites with different triboelectric series order on the surface and members featured to have multiple resin based composites with different triboelectric series order on the surface. The members are resin based sheets, resin based films or resin molded materials. The resin based composites are adhesives, bonding agents, printing ink or paint.
摘要翻译：本发明提供了一种新的抗静电方法及其在成员中的应用。本发明是一种抗静电方法，其特征在于在表面上安装具有不同摩擦次数的多种树脂基复合材料，其特征在于具有表面上具有不同摩擦系列顺序的多种树脂基复合材料。构件是树脂基片，树脂基膜或树脂模制材料。树脂基复合材料是粘合剂，粘合剂，印刷油墨或油漆。

7. 发明授权

US5876632A Electroconductive resin composition, sheet, molded product and container 失效
公开(公告)号：US5876632A
公开(公告)日：1999-03-02
申请号：US917606
申请日：1997-08-26
申请人： Takeshi Miyakawa , Mikio Shimizu
发明人： Takeshi Miyakawa , Mikio Shimizu
IPC分类号： C08L23/02 , C08L23/04 , C08L25/04 , C08L25/06 , C08L25/10 , C08L51/00 , C08L53/00 , C08L71/12 , H01B1/24 , C08K3/04
CPC分类号： H01B1/24 , C08L23/04 , C08L25/06 , C08L71/123 , C08L23/02 , C08L25/04 , C08L25/10 , C08L51/00 , C08L53/00 , Y10T428/1352 , Y10T428/1386
摘要： An electroconductive resin composition comprising (A) at least one thermoplastic resin selected from the group consisting of a polyphenylene ether type resin, a polystyrene type resin and an ABS type resin, (B) carbon black, and (C) an olefin type resin, said electroconductive resin composition containing from 5 to 50 parts by weight of (B) the carbon black per 100 parts by weight of (A) the thermoplastic resin, and from 1 to 30 parts by weight of (C) the olefin type resin per 100 parts by weight of the total amount of (A) the thermoplastic resin and (B) the carbon black, and said electroconductive resin composition having a surface resistivity of from 10.sup.2 to 10.sup.10 .OMEGA..

8. 发明授权

US5707699A Electroconductive resin composition, sheet, molded product and container 失效
公开(公告)号：US5707699A
公开(公告)日：1998-01-13
申请号：US834297
申请日：1997-04-15
申请人： Takeshi Miyakawa , Mikio Shimizu
发明人： Takeshi Miyakawa , Mikio Shimizu
IPC分类号： C08L23/02 , C08L23/04 , C08L25/04 , C08L25/06 , C08L25/10 , C08L51/00 , C08L53/00 , C08L71/12 , H01B1/24 , B29D22/00 , C08K3/04
CPC分类号： H01B1/24 , C08L23/04 , C08L25/06 , C08L71/123 , C08L23/02 , C08L25/04 , C08L25/10 , C08L51/00 , C08L53/00 , Y10T428/1352 , Y10T428/1386
摘要： An electroconductive resin composition comprising (A) at least one thermoplastic resin selected from the group consisting of a polyphenylene ether type resin, a polystyrene type resin and an ABS type resin, (B) carbon black, and (C) an olefin type resin, said electroconductive resin composition containing from 5 to 50 parts by weight of (B) the carbon black per 100 parts by weight of (A) the thermoplastic resin, and from 1 to 30 parts by weight of (C) the olefin type resin per 100 parts by weight of the total amount of (A) the thermoplastic resin and (B) the carbon black, and said electroconductive resin composition having a surface resistivity of from 10.sup.2 to 10.sup.10 .OMEGA..

9. 发明授权

US08714777B2 Optical device 有权
标题翻译：光学装置
公开(公告)号：US08714777B2
公开(公告)日：2014-05-06
申请号：US13428524
申请日：2012-03-23
申请人： Mikio Shimizu , Yoshio Okazaki
发明人： Mikio Shimizu , Yoshio Okazaki
IPC分类号： F21V7/04 , F21V13/04
CPC分类号： F21V7/04 , F21V7/048 , F21V13/04
摘要： An optical device includes a high pressure discharge lamp, a concave condensing mirror placed so as to surround the high pressure discharge lamp while an optical axis stays extended along a direction of an arc of the high pressure discharge lamp, and an aspherical lens that is placed forward the light exit direction of the concave condensing mirror and that is rotationally symmetrical with respect to the optical axis of the concave condensing mirror, in which a reflecting surface of the concave condensing mirror is configured so as to have a shape set in connection with the shape of a light incident surface and the shape of a light exit surface of the aspherical lens.
摘要翻译：光学装置包括：高压放电灯，凹状聚光镜，放置在围绕高压放电灯的同时沿着高压放电灯的圆弧方向延伸的光轴;以及非球面透镜将凹形聚光镜的光出射方向向前延伸，并且相对于凹形聚光镜的光轴旋转对称，其中凹形聚光镜的反射面被构造成具有与光入射面的形状和非球面透镜的光出射面的形状。

10. 发明授权

US07014896B1 Packaging container for electronic part 失效
标题翻译：电子部件包装容器
公开(公告)号：US07014896B1
公开(公告)日：2006-03-21
申请号：US10030103
申请日：2000-11-27
申请人： Takeshi Miyakawa , Mikio Shimizu , Yuichi Kadoya , Masafumi Hiura , Minoru Oda
发明人： Takeshi Miyakawa , Mikio Shimizu , Yuichi Kadoya , Masafumi Hiura , Minoru Oda
IPC分类号： B29D22/00 , B29D23/00
CPC分类号： C08L67/02 , B32B27/36 , Y10T428/1352 , Y10T428/2817 , Y10T428/31507 , C08L69/00
摘要： An electronic component packaging container which comprises a multilayer polyester sheet having a base layer comprising a polyethylene terephthalate type resin and a polycarbonate type resin and a surface layer comprising a polycarbonate type resin, formed on at least one side of the base layer, wherein the base layer contains from 70 to 97 wt % of the polyethylene terephthalate type resin and from 3 to 30 wt % of the polycarbonate type resin based on the total amount of the polyethylene terephthalate type resin and the polycarbonate type resin, and the thickness of the surface layer is from 10 to 30% of the total thickness.
摘要翻译：一种电子部件包装容器，其包括形成在所述基底层的至少一侧上的具有包含聚对苯二甲酸乙二醇酯型树脂和聚碳酸酯型树脂的基层和包含聚碳酸酯型树脂的表层的多层聚酯片，其中，基于聚对苯二甲酸乙二醇酯型树脂和聚碳酸酯型树脂的总量，层包含70至97重量％的聚对苯二甲酸乙二醇酯型树脂和3至30重量％的聚碳酸酯树脂，并且表层的厚度为总厚度的10〜30％。

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