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    • 1. 发明授权
    • Method for the inspection of circuit board
    • 电路板检查方法
    • US5381104A
    • 1995-01-10
    • US9230
    • 1993-01-26
    • Kiyoshi KimuraYuiti HarutaKeikichi Yagii
    • Kiyoshi KimuraYuiti HarutaKeikichi Yagii
    • H01L21/66G01R31/02G01R31/28G01R1/073
    • G01R31/2812G01R31/2808
    • A method for the inspection of a circuit board, capable of precisely detecting deviation in position between the electrodes to be inspected of a circuit board and the inspection electrodes of a tester, thereby achieving fine alignment between the two, with high reliability. The method includes repeating, in two different axial directions, the measurement of conduction state between the electrodes to be inspected of a circuit board and the inspection electrodes of a tester each time changing, by a small distance, the relative position of the inspection electrodes portion of the tester and the circuit board, to detect a position of high conduction state and two positions of low conduction state which are distant from the position and located so that the position is held between them, in each of the two directions. From the information thus obtained, determining the desired connection position in which the inspection electrodes are to be in the highest conduction state in relation to the electrodes to be inspected in one or both of the directions. And then, moving the inspection electrodes portion relatively to the circuit board to place the inspection electrodes in the desired connection position.
    • 一种用于检查电路板的方法,其能够精确地检测待检查的电极与测试仪的检查电极之间的位置偏差,从而以高可靠性实现两者之间的精细对准。 该方法包括在两个不同的轴向方向上重复测量电路板的待检测电极与测试仪的检查电极之间的导通状态,每次每隔一段距离改变检查电极部分的相对位置 的测试器和电路板,以检测远离位置的高导通状态和低导通状态的两个位置并且被定位成使得位置保持在它们之间,在两个方向中的每一个方向上。 根据这样获得的信息,确定在一个或两个方向上相对于被检查电极的检查电极处于最高导通状态的期望的连接位置。 然后,将检查电极部分相对于电路板移动,以将检查电极放置在期望的连接位置。