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    • 10. 发明授权
    • Method for manufacturing a transmitting optical sub-assembly with a thermo-electric cooler therein
    • 用于制造其中具有热电冷却器的透射光学子组件的方法
    • US07144788B2
    • 2006-12-05
    • US11057412
    • 2005-02-15
    • Toshiaki KiharaHisao GoKiyoshi Kato
    • Toshiaki KiharaHisao GoKiyoshi Kato
    • H01L21/331
    • G02B6/4201G02B6/4204G02B6/4246G02B6/4271G02B6/4272G02B6/4279G02B6/4292H01S5/02216H01S5/02248H01S5/02276H01S5/02284H01S5/02415
    • The present invention relates to a method for manufacturing an optical transceiver that installs an optical transmitting assembly and an optical receiving assembly both are compact, inexpensive, and capable of operating at a high speed. The optical transmitting assembly of the present invention provides the metal bottom that installs the thermoelectric cooler thereon and the semiconductor optical device is mounted, via the insulating substrates, on the thermoelectric cooler. The first and second multi-layered ceramic substrates are provided to surround the thermoelectric cooler. The DC signal or the low-frequency signal for the thermoelectric cooler and the semiconductor optical device is supplied through the first ceramic substrate, while the high frequency signal for the semiconductor device, with the complementary signal having the opposite phase to the high frequency signal, is provided to the semiconductor device through the inner layer of the second ceramic substrate and the insulating substrate. The semiconductor light-receiving device, which monitors light emitted from the semiconductor light-emitting device, is mounted on the top layer of the second ceramic substrate. Thus, the transmission path for the high frequency signal from the drive circuit installed outside of the transmitting assembly to the light-emitting device becomes substantially linear.
    • 光收发器的制造方法技术领域本发明涉及一种光收发器的制造方法,所述光收发器安装光传输组件和光接收组件都是紧凑的,便宜的并且能够高速运行。 本发明的光传输组件提供了在其上安装热电冷却器的金属底座,并且半导体光学器件经由绝缘基板安装在热电冷却器上。 提供第一和第二多层陶瓷基板以包围热电冷却器。 用于热电冷却器和半导体光学器件的DC信号或低频信号通过第一陶瓷衬底提供,而具有与高频信号具有相反相位的互补信号的半导体器件的高频信号, 通过第二陶瓷基板的内层和绝缘基板被提供给半导体器件。 监视从半导体发光装置发出的光的半导体光接收装置安装在第二陶瓷基板的顶层上。 因此,来自安装在发射组件外部的驱动电路的高频信号的传输路径变得基本上是线性的。