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    • 8. 发明授权
    • Common probe card for flip-chip devices
    • 用于倒装芯片的普通探针卡
    • US06639420B1
    • 2003-10-28
    • US10266457
    • 2002-10-08
    • Po-Chu ChenChao-Hsiang Yang
    • Po-Chu ChenChao-Hsiang Yang
    • G01R3102
    • G01R31/2886
    • A new method to test multiple integrated circuit device designs using a single, probe card design is achieved. The method compriseproviding a plurality of integrated circuit device designs each having a probe pad array comprising a fixed pitch. A first integrated circuit device having a first design is loaded on a probing stage. The first integrated circuit device is probed using a vertical probe card comprising a probe tip array. The probe tip array comprises the same fixed pitch. An automated tester is thereby coupled to the first integrated circuit device. The first integrated circuit device is tested with the automated tester. The steps of loading, probing, and testing are repeated on at least one other integrated circuit device having a differing design than the first integrated circuit device.
    • 实现了使用单个探针卡设计来测试多个集成电路器件设计的新方法。 该方法包括提供各自具有包括固定间距的探针焊盘阵列的多个集成电路器件设计。 具有第一设计的第一集成电路装置被装载在探测阶段。 使用包括探针头阵列的垂直探针卡探测第一集成电路器件。 探针尖端阵列包括相同的固定间距。 因此,自动化测试器耦合到第一集成电路器件。 第一个集成电路设备用自动测试仪进行测试。 装载,探测和测试的步骤在具有与第一集成电路装置不同的设计的至少一个其他集成电路装置上重复。