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    • 1. 发明授权
    • Lateral high-breakdown-voltage transistor
    • 横向高击穿电压晶体管
    • US06707104B2
    • 2004-03-16
    • US10277744
    • 2002-10-23
    • Kiminori WatanabeKeisuke MatsuokaTakao Ito
    • Kiminori WatanabeKeisuke MatsuokaTakao Ito
    • H01L2978
    • H01L29/7816H01L29/0696H01L29/0847H01L29/0878H01L29/1083H01L29/1095H01L29/7393H01L29/7801H01L29/7835
    • A lateral high-breakdown-voltage transistor comprises an n− drain region and an n+ source region formed in a p− silicon substrate, separated from each other, a gate electrode formed on a channel, insulated from the substrate, an n+ drain contact region formed in the drain region, drain wiring electrically connected to the drain region via the drain contact region, a p+ substrate contact region formed in contact with the source region, and source wiring electrically connected to the source region and also connected to the semiconductor layer via the substrate contact region. The transistor is characterized in that the substrate contact regions have respective portions made to be in contact with the source wiring, and accordingly laterally extend from inside the contact surface of the source wiring to outside the contact surface.
    • 横向高击穿电压晶体管包括彼此分离的在p型硅衬底中形成的n +漏极区域和n +源极区域,形成在与衬底绝缘的沟道上的栅极电极 ,形成在漏极区域中的n +漏极接触区域,经由漏极接触区域与漏极区域电连接的漏极布线,与源极区域形成的ap +衬底接触区域,以及与源极区域电连接的源极布线 并且还经由衬底接触区域连接到半导体层。 晶体管的特征在于,衬底接触区域具有与源极布线接触的相应部分,并且因此从源极布线的接触表面的内侧横向延伸到接触表面的外部。
    • 3. 发明授权
    • Lateral high-breakdown-voltage transistor
    • 横向高击穿电压晶体管
    • US06489653B2
    • 2002-12-03
    • US09746223
    • 2000-12-26
    • Kiminori WatanabeKeisuke MatsuokaTakao Ito
    • Kiminori WatanabeKeisuke MatsuokaTakao Ito
    • H01L2978
    • H01L29/7816H01L29/0696H01L29/0847H01L29/0878H01L29/1083H01L29/1095H01L29/7393H01L29/7801H01L29/7835
    • A lateral high-breakdown-voltage transistor comprises an n− drain region and an n+ source region formed in a p− silicon substrate, separated from each other, a gate electrode formed on a channel, insulated from the substrate, an n+ drain contact region formed in the drain region, drain wiring electrically connected to the drain region via the drain contact region, a p+ substrate contact region formed in contact with the source region, and source wiring electrically connected to the source region and also connected to the semiconductor layer via the substrate contact region. The transistor is characterized in that the substrate contact regions have respective portions made to be in contact with the source wiring, and accordingly laterally extend from inside the contact surface of the source wiring to outside the contact surface.
    • 横向高击穿电压晶体管包括形成在p硅衬底中的n沟道区和n +源极区,其彼此分离,形成在与衬底绝缘的沟道上的栅电极,n +漏极接触区域 形成在所述漏极区域中的漏极布线,经由所述漏极接触区域电连接到所述漏极区域的漏极布线,与所述源极区域接触形成的p +基板接触区域以及与所述源极区域电连接并且还连接到所述半导体层通孔 基板接触区域。 晶体管的特征在于,衬底接触区域具有与源极布线接触的相应部分,并且因此从源极布线的接触表面的内侧横向延伸到接触表面的外部。
    • 5. 发明授权
    • Conductivity-modulation metal oxide semiconductor field effect transistor
    • 电导率调制金属氧化物半导体场效应晶体管
    • US4980743A
    • 1990-12-25
    • US160277
    • 1988-02-25
    • Akio NakagawaYoshihiro YamaguchiKiminori Watanabe
    • Akio NakagawaYoshihiro YamaguchiKiminori Watanabe
    • H01L29/78H01L27/04H01L29/06H01L29/08H01L29/40H01L29/68H01L29/739H01L29/745
    • H01L29/405H01L29/0696H01L29/0834H01L29/402H01L29/7393H01L29/7395H01L29/7396H01L29/7455
    • A conductivity-modulation MOSFET employs a substrate of an N type conductivity as its N base. A first source layer of a heavily-doped N type conductivity is formed in a P base layer formed in the N base. A source electrode electrically conducts the P base and the source. A first gate electrode insulatively covers a channel region defined by the N.sup.+ source layer in the P base. A P drain layer is formed on an opposite substrate surface. An N.sup.+ second source layer is formed in a P type drain layer by diffusion to define a second channel region. A second gate electrode insulatively covers the second channel region, thus providing a voltage-controlled turn-off controlling transistor. A drain electrode of the MOSFET conducts the P type drain and second source. When the turn-off controlling transistor is rendered conductive to turn off the MOSFET a "shorted anode structure" is temporarily formed wherein the N type base is short-circuited to the drain electrode, whereby case, the flow of carriers accumulated in the N type base into the drain electrode is facilitated to accelerate dispersion of carriers upon turn-off of the transistors.
    • 导电调制型MOSFET采用N型导电性基板作为N基极。 在形成在N基底中的P基底层中形成重掺杂N型导电性的第一源极层。 源极电极导电P基极和源极。 第一栅极绝缘地覆盖由P基底中的N +源层限定的沟道区域。 在相对的基板表面上形成P漏极层。 通过扩散在P型漏极层中形成N +第二源极层,以限定第二沟道区。 第二栅电极绝缘地覆盖第二沟道区,从而提供电压控制关断控制晶体管。 MOSFET的漏电极导通P型漏极和第二源极。 当关断控制晶体管导通以关断MOSFET时,暂时形成“短路阳极结构”,其中N型基极短路到漏极,由此情况下,累积在N型的载流子 有助于在晶体管关断时加速载流子的散射。
    • 10. 发明授权
    • Conductivity-modulation metal oxide semiconductor field effect transistor
    • 电导率调制金属氧化物半导体场效应晶体管
    • US5124773A
    • 1992-06-23
    • US563720
    • 1990-08-07
    • Akio NakagawaYoshihiro YamaguchiKiminori Watanabe
    • Akio NakagawaYoshihiro YamaguchiKiminori Watanabe
    • H01L29/06H01L29/08H01L29/40H01L29/739H01L29/745
    • H01L29/405H01L29/0696H01L29/0834H01L29/402H01L29/7393H01L29/7395H01L29/7396H01L29/7455
    • A conductivity-modulation MOSFET employs a substrate of an N type conductivity as its N base. A first source layer of a heavily-doped N type conductivity is formed in a P base layer formed in the N base. A source electrode electrically conducts the P base and the source. A first gate electrode insulatively covers a channel region defined by the N.sup.+ source layer in the P base. A P drain layer is formed on an opposite substrate surface. An N.sup.+ second source layer is formed in a P type drain layer by diffusion to define a second channel region. A second gate electrode insulatively covers the second channel region, thus providing a voltage-controlled turn-off controlling transistor. A drain electrode of the MOSFET conducts the P type drain and second source. When the turn-off controlling transistor is rendered conductive to turn off the MOSFET a "shorted anode structure" is temporarily formed wherein the N type base is short-circuited to the drain electrode, whereby case, the flow of carriers accumulated in the N type base into the drain electrode is facilitated to accelerate dispersion of carriers upon turn-off of the transistor.
    • 导电调制型MOSFET采用N型导电性基板作为N基极。 在形成在N基底中的P基底层中形成重掺杂N型导电性的第一源极层。 源极电极导电P基极和源极。 第一栅极绝缘地覆盖由P基底中的N +源层限定的沟道区域。 在相对的基板表面上形成P漏极层。 通过扩散在P型漏极层中形成N +第二源极层,以限定第二沟道区。 第二栅电极绝缘地覆盖第二沟道区,从而提供电压控制关断控制晶体管。 MOSFET的漏电极导通P型漏极和第二源极。 当关断控制晶体管导通以关断MOSFET时,暂时形成“短路阳极结构”,其中N型基极短路到漏极,由此情况下,累积在N型的载流子 有助于在晶体管截止时加速载流子的分散。