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1. 发明申请

US20140148536A1 COMPOUND INCLUDING ORGANOPOLYSILOXANE OR SILSESQUIOXANE SKELETON HAVING ISOCYANURIC SKELETON, EPOXY GROUP AND SIH GROUP, THERMOSETTING RESIN COMPOSITION CONTAINING THE COMPOUND AS ADHESION-IMPARTING AGENT, HARDENED MATERIAL AND SEALING AGENT FOR OPTICAL SEMICONDUCTOR 有权
标题翻译：含有异氰酸酯基硅氧烷，环氧基和SIH组的有机聚硅氧烷或硅氧烷的化合物，含有作为粘合剂的化合物的热固性树脂组合物，用于光学半导体的硬化材料和密封剂
公开(公告)号：US20140148536A1
公开(公告)日：2014-05-29
申请号：US14130499
申请日：2012-06-28
申请人： Kiichi Kawabata , Akio Tajima , Takashi Matsuo , Yoshiko Watanabe , Koichi Ayama
发明人： Kiichi Kawabata , Akio Tajima , Takashi Matsuo , Yoshiko Watanabe , Koichi Ayama
IPC分类号： H01L33/56
CPC分类号： H01L33/56 , C07F7/21 , C08G59/306 , C08G77/045 , C08G77/12 , C08G77/388 , C08G77/54 , C08K5/1515 , C08K5/34924 , C09D163/00 , H01L2924/0002 , H01L2924/00 , C08L83/04
摘要： The invention provides an adhesion-imparting agent having heat-resistant transparency and a high refractive index best suited for an addition hardening type composition including a reaction product of silsesquioxane and organopolysiloxane. The invention relates to a compound obtained by allowing a hydrosilylation addition reaction of (A), (B), and when necessary, (C) as described below, and a compound including an organopolysiloxane or silsesquioxane skeleton including as an essential component an isocyanuric ring skeleton and an epoxy group, and having an SiH group residue: (A) a compound including an organopolysiloxane or silsesquioxane skeleton and having three or more SiH groups in one molecule; (B) an epoxy derivative having one aliphatic unsaturated group in one molecule; and (C) organopolysiloxane having two alkenyl groups in one molecule, and having a number average molecular weight of 100 to 500,000, or an isocyanurate compound having two alkenyl groups in one molecule.
摘要翻译：本发明提供一种具有耐热透明性和高折射率的粘合赋予剂，其最适合于包含倍半硅氧烷和有机聚硅氧烷的反应产物的加成硬化型组合物。本发明涉及通过如下所述进行（A），（B），必要时的（C）的氢化硅烷化加成反应得到的化合物和包含作为必需成分的有机聚硅氧烷或倍半硅氧烷骨架的化合物的异氰脲酸酯环骨架和环氧基，并且具有SiH基团残基：（A）包含有机聚硅氧烷或倍半硅氧烷骨架的化合物，并且在一个分子中具有三个或更多个SiH基团; （B）一分子中具有一个脂族不饱和基团的环氧衍生物; 和（C）在一个分子中具有两个烯基的数均分子量为100至500,000的有机聚硅氧烷，或在一个分子中具有两个烯基的异氰脲酸酯化合物。

2. 发明授权

US08987358B2 Compound including organopolysiloxane or silsesquioxane skeleton having isocyanuric skeleton, epoxy group and SiH group, thermosetting resin composition containing the compound as adhesion-imparting agent, hardened material and sealing agent for optical semiconductor 有权
标题翻译：包含具有异氰脲酸骨架，环氧基和SiH基的有机聚硅氧烷或倍半硅氧烷骨架的化合物，含有化合物作为粘合赋予剂的热固性树脂组合物，硬化材料和光学半导体密封剂
公开(公告)号：US08987358B2
公开(公告)日：2015-03-24
申请号：US14130499
申请日：2012-06-28
申请人： Kiichi Kawabata , Akio Tajima , Takashi Matsuo , Yoshiko Watanabe , Koichi Ayama
发明人： Kiichi Kawabata , Akio Tajima , Takashi Matsuo , Yoshiko Watanabe , Koichi Ayama
IPC分类号： H01L33/56 , C07F7/21 , C08G77/54 , C08G77/388 , C08G59/30 , C09D163/00
CPC分类号： H01L33/56 , C07F7/21 , C08G59/306 , C08G77/045 , C08G77/12 , C08G77/388 , C08G77/54 , C08K5/1515 , C08K5/34924 , C09D163/00 , H01L2924/0002 , H01L2924/00 , C08L83/04
摘要： The invention provides an adhesion-imparting agent having heat-resistant transparency and a high refractive index best suited for an addition hardening type composition including a reaction product of silsesquioxane and organopolysiloxane. The invention relates to a compound obtained by allowing a hydrosilylation addition reaction of (A), (B), and when necessary, (C) as described below, and a compound including an organopolysiloxane or silsesquioxane skeleton including as an essential component an isocyanuric ring skeleton and an epoxy group, and having an SiH group residue: (A) a compound including an organopolysiloxane or silsesquioxane skeleton and having three or more SiH groups in one molecule; (B) an epoxy derivative having one aliphatic unsaturated group in one molecule; and (C) organopolysiloxane having two alkenyl groups in one molecule, and having a number average molecular weight of 100 to 500,000, or an isocyanurate compound having two alkenyl groups in one molecule.
摘要翻译：本发明提供一种具有耐热透明性和高折射率的粘合赋予剂，其最适合于包含倍半硅氧烷和有机聚硅氧烷的反应产物的加成硬化型组合物。本发明涉及通过如下所述进行（A），（B），必要时的（C）的氢化硅烷化加成反应得到的化合物和包含作为必需成分的有机聚硅氧烷或倍半硅氧烷骨架的化合物的异氰脲酸酯环骨架和环氧基，并且具有SiH基团残基：（A）包含有机聚硅氧烷或倍半硅氧烷骨架的化合物，并且在一个分子中具有三个或更多个SiH基团; （B）一分子中具有一个脂族不饱和基团的环氧衍生物; 和（C）在一个分子中具有两个烯基的数均分子量为100至500,000的有机聚硅氧烷，或在一个分子中具有两个烯基的异氰脲酸酯化合物。

3. 发明授权

US08946357B2 Organosilicon compound, thermosetting resin composition containing the organosilicon compound, hardening resin and encapsulation material for optical semiconductor 有权
公开(公告)号：US08946357B2
公开(公告)日：2015-02-03
申请号：US13698279
申请日：2011-05-18
申请人： Kiichi Kawabata , Akio Tajima , Takashi Matsuo , Kiyoshi Sakai , Koichi Ayama
发明人： Kiichi Kawabata , Akio Tajima , Takashi Matsuo , Kiyoshi Sakai , Koichi Ayama
IPC分类号： C08F30/08 , C09D183/04 , C07F7/21 , C08G77/04 , H01L23/29 , C09K3/10 , C08G77/20 , C08G77/00 , H01L33/56
CPC分类号： C08F30/08 , C07F7/21 , C08G77/045 , C08G77/12 , C08G77/20 , C08G77/50 , C08G77/80 , C08K5/56 , C08L83/00 , C08L83/04 , C09D183/04 , C09K3/1018 , H01L23/296 , H01L33/56 , H01L2924/0002 , H01L2924/00
摘要： A solution is a liquid organosilicon compound represented by general formula (1) as described below: wherein, X is each independently a group represented by formula (I), formula (II) or formula (III) as described below, and when the number of the group represented by formula (I) per one molecule of the liquid organosilicon compound represented by general formula (1) is defined as a, the number of the group represented by formula (II) per one molecule thereof is defined as b, and the number of the group represented by formula (III) per one molecule thereof is defined as c, 0≦a≦3.5, 0≦b≦3.5, and 0≦c≦1 are obtained, and also a+b+2c=4 is obtained:

4. 发明申请

US20130096249A1 NEW ORGANOSILICON COMPOUND, THERMOSETTING RESIN COMPOSITION CONTAINING THE ORGANOSILICON COMPOUND, HARDENING RESIN AND ENCAPSULATION MATERIAL FOR OPTICAL SEMICONDUCTOR 有权
标题翻译：新有机硅化合物，含有机硅氧烷化合物的热固性树脂组合物，光学半导体的硬化树脂和封装材料
公开(公告)号：US20130096249A1
公开(公告)日：2013-04-18
申请号：US13698279
申请日：2011-05-18
申请人： Kiichi Kawabata , Akio Tajima , Takashi Matsuo , Kiyoshi Sakai , Koichi Ayama
发明人： Kiichi Kawabata , Akio Tajima , Takashi Matsuo , Kiyoshi Sakai , Koichi Ayama
IPC分类号： C08F30/08 , C09D183/04 , C07F7/21
CPC分类号： C08F30/08 , C07F7/21 , C08G77/045 , C08G77/12 , C08G77/20 , C08G77/50 , C08G77/80 , C08K5/56 , C08L83/00 , C08L83/04 , C09D183/04 , C09K3/1018 , H01L23/296 , H01L33/56 , H01L2924/0002 , H01L2924/00
摘要： A solution is a liquid organosilicon compound represented by general formula (1) as described below: wherein, X is each independently a group represented by formula (I), formula (II) or formula (III) as described below, and when the number of the group represented by formula (I) per one molecule of the liquid organosilicon compound represented by general formula (1) is defined as a, the number of the group represented by formula (II) per one molecule thereof is defined as b, and the number of the group represented by formula (III) per one molecule thereof is defined as c, 0≦a≦3.5, 0≦b≦3.5, and 0≦c≦1 are obtained, and also a+b+2c=4 is obtained:
摘要翻译：溶液是如下所述的由通式（1）表示的液体有机硅化合物：其中，X各自独立地为如下所述的式（I），式（II）或式（III）表示的基团，当数字由通式（I）表示的基团每一分子由通式（1）表示的液体有机硅化合物表示的基团定义为a，其每一分子中由式（II）表示的基团的数目定义为b，并且其每一分子由式（III）表示的基团的数目定义为c，0 @ a @ 3.5，0 @ b @ 3.5和0 @ c @ 1，并且a + b + 2c = 4 获得：

5. 发明申请

US20120149819A1 ORGANIC SILICON COMPOUND, THERMOSETTING COMPOSITION CONTAINING SAID ORGANIC SILICON COMPOUND, AND SEALING MATERIAL FOR OPTICAL SEMICONDUCTOR 有权
标题翻译：有机硅化合物，含有机硅化合物的热固化组合物和用于光学半导体的密封材料
公开(公告)号：US20120149819A1
公开(公告)日：2012-06-14
申请号：US13375894
申请日：2010-06-02
申请人： Daisuke Inoki , Kiichi Kawabata , Akio Tajima , Takashi Matsuo
发明人： Daisuke Inoki , Kiichi Kawabata , Akio Tajima , Takashi Matsuo
IPC分类号： C08K5/549 , C07F7/21
CPC分类号： C08G77/50 , C08G77/045 , C09D183/14 , C09K3/1018 , H01L23/296 , H01L2924/0002 , H01L2924/00
摘要： A liquid organosilicon compound comprising a structural unit represented by the following formula (1-a) and a structural unit represented by the following formula (1-b): In the above formula (1-a), R1 each independently is a group selected from an alkyl having 1 to 4 carbon atoms, cyclopentyl and cyclohexyl and in the above formula (1-b), R2 and R3 each independently are a group selected from an alkyl having 1 to 4 carbon atoms, cyclopentyl and cyclohexyl, and n is an integer of 2 to 50. When a mole fraction of the structural unit represented by the formula (1-a) in the liquid organosilicon compound is α and a mole fraction of the structural unit represented by the formula (1-b) in the liquid organosilicon compound is β, the ratio of α and n×β (α:n×β) meets 1:3 to 1:100.
摘要翻译：包含由下式（1-a）表示的结构单元和由下式（1-b）表示的结构单元的液体有机硅化合物：在上述式（1-a）中，R 1各自独立地为选自从具有1至4个碳原子的烷基，环戊基和环己基，在上式（1-b）中，R 2和R 3各自独立地是选自具有1至4个碳原子的烷基，环戊基和环己基，n是液体有机硅化合物中由式（1-a）表示的结构单元的摩尔分数为α，式（1-b）表示的结构单元的摩尔分数为液体有机硅化合物的比例为α和n×＆bgr; （α：n×＆bgr）满足1：3〜1：100。

6. 发明授权

US08952108B2 Organic silicon compound, thermosetting composition containing said organic silicon compound, and sealing material for optical semiconductor 有权
标题翻译：有机硅化合物，含有有机硅化合物的热固性组合物和光学半导体用密封材料
公开(公告)号：US08952108B2
公开(公告)日：2015-02-10
申请号：US13375894
申请日：2010-06-02
申请人： Daisuke Inoki , Kiichi Kawabata , Akio Tajima , Takashi Matsuo
发明人： Daisuke Inoki , Kiichi Kawabata , Akio Tajima , Takashi Matsuo
IPC分类号： G01N1/28 , C08G77/50 , C08G77/04 , C09D183/14 , C09K3/10 , H01L23/29
CPC分类号： C08G77/50 , C08G77/045 , C09D183/14 , C09K3/1018 , H01L23/296 , H01L2924/0002 , H01L2924/00
摘要： A liquid organosilicon compound comprising a structural unit represented by the following formula (1-a) and a structural unit represented by the following formula (1-b): In the above formula (1-a), R1 each independently is a group selected from an alkyl having 1 to 4 carbon atoms, cyclopentyl and cyclohexyl and in the above formula (1-b), R2 and R3 each independently are a group selected from an alkyl having 1 to 4 carbon atoms, cyclopentyl and cyclohexyl, and n is an integer of 2 to 50. When a mole fraction of the structural unit represented by the formula (1-a) in the liquid organosilicon compound is α and a mole fraction of the structural unit represented by the formula (1-b) in the liquid organosilicon compound is β, the ratio of α and n×β (α:n×β) meets 1:3 to 1:100.
摘要翻译：包含由下式（1-a）表示的结构单元和由下式（1-b）表示的结构单元的液体有机硅化合物：在上述式（1-a）中，R 1各自独立地为选自从具有1至4个碳原子的烷基，环戊基和环己基，在上式（1-b）中，R 2和R 3各自独立地是选自具有1至4个碳原子的烷基，环戊基和环己基，n是液体有机硅化合物中由式（1-a）表示的结构单元的摩尔分数为α，式（1-b）表示的结构单元的摩尔分数为液体有机硅化合物的比例为α和n×＆bgr; （α：n×＆bgr）满足1：3〜1：100。

7. 发明授权

US06310169B1 Polymerizable terminal group-containing polyorganosiloxane and production process for the same 有权
标题翻译：可聚合末端基团的聚有机硅氧烷及其制备方法相同
公开(公告)号：US06310169B1
公开(公告)日：2001-10-30
申请号：US09519855
申请日：2000-03-06
申请人： Kiichi Kawabata , Youichi Kimae
发明人： Kiichi Kawabata , Youichi Kimae
IPC分类号： C08G7726
CPC分类号： C08G77/46 , C08G77/38 , C08L83/08
摘要： The present invention relates to polymerizable terminal group-containing polyorganosiloxane having a number average molecular weight of 500 to 100000 represented by the following Formula (1): wherein R1, R2, R3, R4 and R5 each represent a linear or branched alkyl group having 1 to 20 carbon atoms, a cycloalkyl group having 4 to 10 carbon atoms or an aryl-containing group having 6 to 10 carbon atoms; R6 represents a hydrogen atom, a linear or branched alkyl group having 1 to 5 carbon atoms or an aryl-containing group having 6 to 10 carbon atoms; n represents 1 or more and m represents 0 or more, in which n+m represents an average polymerization degree and is 4 to 1100; X represents an alkylene group having 2 to 20 carbon atoms; Y represents —OCH2CH2—, —OCH(CH3)CH2— or —OCH2CH(CH3)—; p represents 3 or more; and Z represents an alkylene group having 1 to 20 carbon atoms.
摘要翻译：本发明涉及由下式（1）表示的数均分子量为500〜100000的含可聚合端基的聚有机硅氧烷：其中R1，R2，R3，R4和R5各自表示具有1个至20个碳原子，具有4-10个碳原子的环烷基或含有6-10个碳原子的芳基; R6表示氢原子，碳原子数1〜5的直链或支链烷基或碳原子数6〜10的含芳基的基团。 n表示1以上且m表示0以上，n + m表示平均聚合度，为4〜1100。 X表示碳原子数2〜20的亚烷基。 Y表示-OCH 2 CH 2 - ， - OCH（CH 3）CH 2 - 或-OCH 2 CH（CH 3） - ; p表示3以上; Z表示碳原子数1〜20的亚烷基。

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