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    • 6. 发明申请
    • CHEMICAL VAPOR DEPOSITION APPARATUS AND PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION APPARATUS
    • 化学蒸气沉积装置和等离子体增强化学气相沉积装置
    • US20080295772A1
    • 2008-12-04
    • US12122904
    • 2008-05-19
    • Yong-Woo PARKKyoung-Bo KimMoo-Jin Kim
    • Yong-Woo PARKKyoung-Bo KimMoo-Jin Kim
    • C23C16/44
    • C23C16/4401H01J37/32623H01J37/32697
    • A chemical vapor deposition (CVD) apparatus and a plasma enhanced chemical vapor deposition (PECVD) apparatus that reduce the number of fine particles inside a chamber. The CVD and the PECVD apparatuses each include a chamber; a gas injection unit that injects a gas into the chamber; a gas exhaust unit that exhausts the gas to the outside of the chamber, and is positioned facing the gas injection unit; a film formation unit that incorporates a film formation region on which a film is formed from the gas, and is positioned between the gas injection unit and the gas exhaust unit; and a electrostatic induction unit, which is positioned around a region corresponding to the film formation region in order not to overlap with the film formation region, and is connected to a voltage source that is insulated from the chamber.
    • 化学气相沉积(CVD)装置和等离子体增强化学气相沉积(PECVD)装置,其减少室内细颗粒的数量。 CVD和PECVD装置各自包括室; 气体注入单元,其将气体注入到所述室中; 气体排出单元,其将气体排出到室的外部,并且被定位成面向气体注入单元; 成膜单元,其包括从气体形成有膜的成膜区域,并且位于气体注入单元和排气单元之间; 以及静电感应单元,其被设置在与成膜区域相对应的区域周围,以便不与成膜区域重叠,并且连接到与腔室绝缘的电压源。