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1. 发明授权

US08111194B2 Mobile telecommunication terminal 失效
标题翻译：移动电信终端
公开(公告)号：US08111194B2
公开(公告)日：2012-02-07
申请号：US11944573
申请日：2007-11-23
申请人： Ki Won Chang , Jeong Sik Seo , Hyun Do Park , Jae Suk Sung
发明人： Ki Won Chang , Jeong Sik Seo , Hyun Do Park , Jae Suk Sung
IPC分类号： H01Q1/36 , H01Q1/48
CPC分类号： H01Q1/2283 , H01Q1/243 , H01Q9/42 , H05K1/0243 , H05K2201/10636 , Y02P70/611
摘要： There is provided a mobile telecommunication terminal comprising: a chip antenna, and a printed circuit board having the chip antenna mounted on one surface thereof, the printed circuit board comprising a tuning ground pattern formed on a surface opposing the one surface of the printed circuit board to have one end connected to a ground part so as to be used for tuning frequency characteristics of the chip antenna.
摘要翻译：提供了一种移动通信终端，包括：芯片天线和其一个表面上安装有芯片天线的印刷电路板，印刷电路板包括形成在与印刷电路板的一个表面相对的表面上的调谐接地图案将一端连接到接地部分，以便用于调谐芯片天线的频率特性。

2. 发明授权

US08054227B2 Chip antenna 失效
标题翻译：芯片天线
公开(公告)号：US08054227B2
公开(公告)日：2011-11-08
申请号：US11944575
申请日：2007-11-23
申请人： Ki Won Chang , Jeong Sik Seo , Hyun Do Park , Jae Suk Sung
发明人： Ki Won Chang , Jeong Sik Seo , Hyun Do Park , Jae Suk Sung
IPC分类号： H01Q1/38
CPC分类号： H01Q1/2283 , H01Q1/243 , H01Q9/42 , H05K1/0243 , H05K2201/10636 , Y02P70/611
摘要： There is provided a chip antenna including: a dielectric block; a first conductive pattern formed on at least one surface of the dielectric block to connect to an external feeding part; a second conductive pattern spaced apart from the first conductive pattern at a certain distance so as to be capacitively coupled to the first conductive pattern to act as a radiator, the second conductive pattern having one end connected to an external ground part; and a third conductive pattern spaced apart from the first conductive pattern at a certain distance so as to be capacitively coupled to the first conductive pattern to enable impedance matching of the antenna, the third conductive pattern having one end connected to the external ground part.
摘要翻译：提供了一种芯片天线，包括：介质块; 形成在介质块的至少一个表面上以连接到外部馈电部分的第一导电图案; 第二导电图案，其间隔一定距离与第一导电图案间隔开，以便电容耦合到第一导电图案以用作散热器，第二导电图案的一端连接到外部接地部分; 以及第三导电图案，其以一定距离与第一导电图案间隔开，以便电容耦合到第一导电图案，以使得天线的阻抗匹配，第三导电图案的一端连接到外部接地部分。

3. 发明申请

US20080129604A1 MOBILE TELECOMMUNICATION TERMINAL 失效
标题翻译：移动通信终端
公开(公告)号：US20080129604A1
公开(公告)日：2008-06-05
申请号：US11944573
申请日：2007-11-23
申请人： Ki Won CHANG , Jeong Sik Seo , Hyun Do Park , Jae Suk Sung
发明人： Ki Won CHANG , Jeong Sik Seo , Hyun Do Park , Jae Suk Sung
IPC分类号： H01Q1/38 , H01Q9/04
CPC分类号： H01Q1/2283 , H01Q1/243 , H01Q9/42 , H05K1/0243 , H05K2201/10636 , Y02P70/611
摘要： There is provided a mobile telecommunication terminal comprising: a chip antenna, and a printed circuit board having the chip antenna mounted on one surface thereof, the printed circuit board comprising a tuning ground pattern formed on a surface opposing the one surface of the printed circuit board to have one end connected to a ground part so as to be used for tuning frequency characteristics of the chip antenna.
摘要翻译：提供了一种移动通信终端，包括：芯片天线和其一个表面上安装有芯片天线的印刷电路板，印刷电路板包括形成在与印刷电路板的一个表面相对的表面上的调谐接地图案将一端连接到接地部分，以便用于调谐芯片天线的频率特性。

4. 发明申请

US20080122713A1 PRINTED CIRCUIT BOARD 有权
标题翻译：印刷电路板
公开(公告)号：US20080122713A1
公开(公告)日：2008-05-29
申请号：US11944571
申请日：2007-11-23
申请人： Ki Won CHANG , Jeong Sik Seo , Hyun Do Park , Jae Suk Sung
发明人： Ki Won CHANG , Jeong Sik Seo , Hyun Do Park , Jae Suk Sung
IPC分类号： H01Q9/00
CPC分类号： H01Q1/2283 , H01Q1/243 , H01Q9/42 , H05K1/0243 , H05K2201/10636 , Y02P70/611
摘要： There is provided a printed circuit board comprising: a mounting area of a chip antenna provided on one surface thereof, and a tuning ground pattern formed on a surface opposing the one surface of the printed circuit board to have one end connected to a ground part so as to be used for tuning frequency characteristics of the chip antenna.
摘要翻译：提供了一种印刷电路板，包括：设置在其一个表面上的芯片天线的安装区域和形成在与印刷电路板的一个表面相对的表面上的调谐接地图案，以使其一端连接到接地部分用于调谐芯片天线的频率特性。

5. 发明授权

US07791541B2 Printed circuit board 有权
标题翻译：印刷电路板
公开(公告)号：US07791541B2
公开(公告)日：2010-09-07
申请号：US11944571
申请日：2007-11-23
申请人： Ki Won Chang , Jeong Sik Seo , Hyun Do Park , Jae Suk Sung
发明人： Ki Won Chang , Jeong Sik Seo , Hyun Do Park , Jae Suk Sung
IPC分类号： H01Q1/38
CPC分类号： H01Q1/2283 , H01Q1/243 , H01Q9/42 , H05K1/0243 , H05K2201/10636 , Y02P70/611
摘要： There is provided a printed circuit board comprising: a mounting area of a chip antenna provided on one surface thereof, and a tuning ground pattern formed on a surface opposing the one surface of the printed circuit board to have one end connected to a ground part so as to be used for tuning frequency characteristics of the chip antenna.
摘要翻译：提供了一种印刷电路板，包括：设置在其一个表面上的芯片天线的安装区域和形成在与印刷电路板的一个表面相对的表面上的调谐接地图案，以使其一端连接到接地部分用于调谐芯片天线的频率特性。

6. 发明申请

US20080122722A1 CHIP ANTENNA 失效
标题翻译：芯片天线
公开(公告)号：US20080122722A1
公开(公告)日：2008-05-29
申请号：US11944575
申请日：2007-11-23
申请人： Ki Won CHANG , Jeong Sik Seo , Hyun Do Park , Jae Suk Sung
发明人： Ki Won CHANG , Jeong Sik Seo , Hyun Do Park , Jae Suk Sung
IPC分类号： H01Q1/50 , H01Q1/38 , H01Q9/04
CPC分类号： H01Q1/2283 , H01Q1/243 , H01Q9/42 , H05K1/0243 , H05K2201/10636 , Y02P70/611
摘要： There is provided a chip antenna including: a dielectric block; a first conductive pattern formed on at least one surface of the dielectric block to connect to an external feeding part; a second conductive pattern spaced apart from the first conductive pattern at a certain distance so as to be capacitively coupled to the first conductive pattern to act as a radiator, the second conductive pattern having one end connected to an external ground part; and a third conductive pattern spaced apart from the first conductive pattern at a certain distance so as to be capacitively coupled to the first conductive pattern to enable impedance matching of the antenna, the third conductive pattern having one end connected to the external ground part.
摘要翻译：提供了一种芯片天线，包括：介质块; 形成在介质块的至少一个表面上以连接到外部馈电部分的第一导电图案; 第二导电图案，其间隔一定距离与第一导电图案间隔开，以便电容耦合到第一导电图案以用作散热器，第二导电图案的一端连接到外部接地部分; 以及第三导电图案，其以一定距离与第一导电图案间隔开，以便电容耦合到第一导电图案，以使得天线的阻抗匹配，第三导电图案的一端连接到外部接地部分。

7. 发明申请

US20090015486A1 CHIP ANTENNA AND MOBILE-COMMUNICATION TERMINAL HAVING THE SAME 失效
标题翻译：芯片天线和移动通信终端
公开(公告)号：US20090015486A1
公开(公告)日：2009-01-15
申请号：US12170999
申请日：2008-07-10
申请人： Chang Mok Han , Ki Won Chang , Duk Woo Lee , Dae Kyu Lee , Jeong Sik Seo , Hyun Do Park
发明人： Chang Mok Han , Ki Won Chang , Duk Woo Lee , Dae Kyu Lee , Jeong Sik Seo , Hyun Do Park
IPC分类号： H01Q9/04
CPC分类号： H01Q1/38 , H01Q9/0407
摘要： There are provided a chip antenna and a mobile telecommunication terminal having the chip antenna. The chip antenna includes: a dielectric block having opposing top and bottom surfaces and a plurality of side surfaces connecting the top and bottom surfaces; a first conductive pattern formed on at least one of the surfaces of the dielectric block and connected to an external feeding part; a second conductive pattern formed on at least one of the surfaces of the dielectric block to connect to the first conductive pattern, and having one end connected to an external ground part; and a third conductive pattern formed on at least one of the surfaces of the dielectric block, and spaced apart from the first and second conductive patterns to be capacitively coupled to the first and second conductive patterns, respectively, the third conductive pattern having a lower end connected to the external ground part.
摘要翻译：提供了具有芯片天线的芯片天线和移动电信终端。芯片天线包括：具有相对的顶表面和底表面的介质块和连接顶表面和底表面的多个侧表面; 形成在介质块的至少一个表面上并连接到外部馈电部分的第一导电图案; 形成在所述介电块的至少一个表面上以连接到所述第一导电图案并且具有连接到外部接地部分的一端的第二导电图案; 以及形成在所述介质块的至少一个表面上并且与所述第一和第二导电图案间隔开以分别电容耦合到所述第一和第二导电图案的第三导电图案，所述第三导电图案具有下端连接到外部接地部分。

8. 发明授权

US08159400B2 Chip antenna and mobile-communication terminal having the same 失效
标题翻译：芯片天线和具有相同功能的移动通信终端
公开(公告)号：US08159400B2
公开(公告)日：2012-04-17
申请号：US12170999
申请日：2008-07-10
申请人： Chang Mok Han , Ki Won Chang , Duk Woo Lee , Dae Kyu Lee , Jeong Sik Seo , Hyun Do Park
发明人： Chang Mok Han , Ki Won Chang , Duk Woo Lee , Dae Kyu Lee , Jeong Sik Seo , Hyun Do Park
IPC分类号： H01Q1/24 , H01Q1/38
CPC分类号： H01Q1/38 , H01Q9/0407
摘要： There are provided a chip antenna and a mobile telecommunication terminal having the chip antenna. The chip antenna includes: a dielectric block having opposing top and bottom surfaces and a plurality of side surfaces connecting the top and bottom surfaces; a first conductive pattern formed on at least one of the surfaces of the dielectric block and connected to an external feeding part; a second conductive pattern formed on at least one of the surfaces of the dielectric block to connect to the first conductive pattern, and having one end connected to an external ground part; and a third conductive pattern formed on at least one of the surfaces of the dielectric block, and spaced apart from the first and second conductive patterns to be capacitively coupled to the first and second conductive patterns, respectively, the third conductive pattern having a lower end connected to the external ground part.
摘要翻译：提供了具有芯片天线的芯片天线和移动电信终端。芯片天线包括：具有相对的顶表面和底表面的介质块和连接顶表面和底表面的多个侧表面; 形成在介质块的至少一个表面上并连接到外部馈电部分的第一导电图案; 形成在所述介电块的至少一个表面上以连接到所述第一导电图案并且具有连接到外部接地部分的一端的第二导电图案; 以及形成在所述介质块的至少一个表面上并且与所述第一和第二导电图案间隔开以分别电容耦合到所述第一和第二导电图案的第三导电图案，所述第三导电图案具有下端连接到外部接地部分。

9. 发明授权

US08933844B2 Antenna pattern frame, electronic device case provided with antenna pattern frame and electronic device including electronic device case 有权
标题翻译：天线图案框架，设置有天线图案框架的电子设备壳体和包括电子设备壳体的电子设备
公开(公告)号：US08933844B2
公开(公告)日：2015-01-13
申请号：US13032365
申请日：2011-02-22
申请人： Ha Ryong Hong , Sung Eun Cho , Tae Sung Kim , Duk Woo Lee , Dae Kyu Lee , Chan Gwang An , Jae Suk Sung , Ki Won Chang , Chang Mok Han , Hyun Do Park
发明人： Ha Ryong Hong , Sung Eun Cho , Tae Sung Kim , Duk Woo Lee , Dae Kyu Lee , Chan Gwang An , Jae Suk Sung , Ki Won Chang , Chang Mok Han , Hyun Do Park
IPC分类号： H01Q1/24 , B29C45/14 , H01Q1/40 , B29L31/34
CPC分类号： H01Q1/243 , B29C45/14065 , B29C45/14639 , B29L2031/3431 , B29L2031/3456 , H01Q1/40
摘要： There is provided an antenna pattern frame according to an exemplary embodiment of the present invention, including: a film radiator that includes a protective film supporting one surface or both surfaces of a radiator provided with an antenna pattern part; and a radiator frame that is an injection molded part to which the film radiator is fixed and embeds the antenna pattern part in the electronic device case.
摘要翻译：提供了根据本发明的示例性实施例的天线图案框架，包括：薄膜辐射器，其包括支撑设置有天线图案部分的散热器的一个表面或两个表面的保护膜; 以及散热器框架，其是胶片辐射器固定到其上的注塑部件，并将天线图案部分嵌入电子设备壳体中。

10. 发明授权

US08618989B2 Electronic device case, method and mold for manufacturing the same, and mobile communications terminal 有权
标题翻译：电子设备案例，制造方法和模具以及移动通信终端
公开(公告)号：US08618989B2
公开(公告)日：2013-12-31
申请号：US12608818
申请日：2009-10-29
申请人： Jae Suk Sung , Sung Eun Cho , Ha Ryong Hong , Dae Kyu Lee , Dae Seong Jeon , Ki Won Chang , Tae Sung Kim , Dae Ki Lim , Hyun Do Park , Nam Il Seo
发明人： Jae Suk Sung , Sung Eun Cho , Ha Ryong Hong , Dae Kyu Lee , Dae Seong Jeon , Ki Won Chang , Tae Sung Kim , Dae Ki Lim , Hyun Do Park , Nam Il Seo
IPC分类号： H01Q1/24
CPC分类号： B29D99/006 , B29C45/14065 , B29C45/14639 , B29L2031/3456 , H01Q1/243 , H01Q1/40 , H01Q1/42 , H01Q9/0421 , H04M1/026 , H04W88/02
摘要： An electronic device case having an antenna pattern embedded therein according to an aspect of the invention may include: a radiator having an antenna pattern portion transmitting and receiving a signal and a connection terminal portion allowing the signal to be transmitted to and received from a circuit board of an electronic device; a connection portion partially forming the radiator and connecting the antenna pattern portion and the connection terminal portion to be arranged in different planes; a radiator frame manufactured by injection molding on the radiator so that the antenna pattern portion of the radiator is provided on one side of the radiator frame and the connection terminal portion is provided on the other side thereof; and a case frame covering the one side of the radiator frame on which the antenna pattern portion is provided so that the antenna pattern portion is embedded between the case frame and the radiator frame.
摘要翻译：根据本发明的一个方面的具有嵌入其中的天线方向图的电子设备壳体可以包括：具有发送和接收信号的天线图案部分的散热器和允许信号被发送到电路板并从电路板接收的连接端子部分的电子设备; 连接部，其部分地形成所述散热器，并将所述天线图案部分和所述连接端子部分连接在不同的平面内; 散热器框架，其通过在散热器上注射成型而制造，使得散热器的天线图案部分设置在散热器框架的一侧，并且连接端子部分设置在其另一侧上; 以及壳体框架，其覆盖设置有天线图案部分的辐射体框架的一侧，使得天线图案部分嵌入在壳体框架和散热器框架之间。

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