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    • 1. 发明授权
    • Probe card having a conductive thin film on the surface of an insulating film behind each of the alignment marks each marks comprises a plurality of second bumps
    • 在每个对准标记之后的绝缘膜的表面上具有导电薄膜的探针卡每个标记包括多个第二凸块
    • US07589543B2
    • 2009-09-15
    • US11299656
    • 2005-12-13
    • Kenji YamadaYoshirou Nakata
    • Kenji YamadaYoshirou Nakata
    • G01R31/02
    • G01R31/2891G01R1/07314G01R1/0735G01R3/00Y10T29/49117Y10T29/49151
    • A probe card for a wafer level test of electrical characteristics of a plurality of semiconductor integrated circuit devices formed on a semiconductor wafer. The card has a thin film with bumps on which a plurality of bumps to be respectively brought into contact with all of inspection electrodes of the semiconductor integrated circuit devices are formed, and which is held on a rigid ceramic ring. An alignment mark constituted by a bump formed simultaneously with the bumps for contact is added to the thin film with bumps. The desired position of the alignment mark relative to the bumps for contact is maintained. Therefore, a change in position accuracy of the bumps for contact can be easily measured by an image processor with reference to the alignment mark. An optimum position for contact between the wafer to be inspected and the inspection electrodes on the wafer can be computed from the measurement result.
    • 一种用于形成在半导体晶片上的多个半导体集成电路器件的电特性的晶片级测试的探针卡。 该卡具有带有凸块的薄膜,多个凸起分别与半导体集成电路器件的所有检查电极接触,并且保持在刚性陶瓷环上。 由与凸起接触形成的凸起构成的对准标记被加到具有凸块的薄膜上。 保持对准标记相对于用于接触的凸块的期望位置。 因此,可以通过参照对准标记的图像处理器容易地测量用于接触的凸块的位置精度的变化。 可以从测量结果计算要检查的晶片与晶片上的检查电极之间的接触的最佳位置。
    • 2. 发明申请
    • Probe card, method of manufacturing the probe card and alignment method
    • 探针卡,制造探针卡的方法和对准方法
    • US20060132155A1
    • 2006-06-22
    • US11299656
    • 2005-12-13
    • Kenji YamadaYoshirou Nakata
    • Kenji YamadaYoshirou Nakata
    • G01R31/02
    • G01R31/2891G01R1/07314G01R1/0735G01R3/00Y10T29/49117Y10T29/49151
    • A probe card for a wafer level test of electrical characteristics of a plurality of semiconductor integrated circuit devices formed on a semiconductor wafer. The card has a thin film with bumps on which a plurality of bumps to be respectively brought into contact with all of inspection electrodes of the semiconductor integrated circuit devices are formed, and which is held on a rigid ceramic ring. An alignment mark constituted by a bump formed simultaneously with the bumps for contact is added to the thin film with bumps. The desired position of the alignment mark relative to the bumps for contact is maintained. Therefore, a change in position accuracy of the bumps for contact can be easily measured by an image processor with reference to the alignment mark. An optimum position for contact between the wafer to be inspected and the inspection electrodes on the wafer can be computed from the measurement result.
    • 一种用于形成在半导体晶片上的多个半导体集成电路器件的电特性的晶片级测试的探针卡。 该卡具有带有凸块的薄膜,多个凸起分别与半导体集成电路器件的所有检查电极接触,并且保持在刚性陶瓷环上。 由与凸起接触形成的凸起构成的对准标记被加到具有凸块的薄膜上。 保持对准标记相对于用于接触的凸块的期望位置。 因此,可以通过参照对准标记的图像处理器容易地测量用于接触的凸块的位置精度的变化。 可以从测量结果计算要检查的晶片与晶片上的检查电极之间的接触的最佳位置。
    • 3. 发明申请
    • PROBE CARD, METHOD OF MANUFACTURING THE PROBE CARD AND ALIGNMENT METHOD
    • 探针卡,制造探针卡和对准方法
    • US20090183363A1
    • 2009-07-23
    • US12412102
    • 2009-03-26
    • Kenji YamadaYoshirou Nakata
    • Kenji YamadaYoshirou Nakata
    • H01R43/00
    • G01R31/2891G01R1/07314G01R1/0735G01R3/00Y10T29/49117Y10T29/49151
    • A probe card for a wafer level test of electrical characteristics of a plurality of semiconductor integrated circuit devices formed on a semiconductor wafer. The card has a thin film with bumps on which a plurality of bumps to be respectively brought into contact with all of inspection electrodes of the semiconductor integrated circuit devices are formed, and which is held on a rigid ceramic ring. An alignment mark constituted by a bump formed simultaneously with the bumps for contact is added to the thin film with bumps. The desired position of the alignment mark relative to the bumps for contact is maintained. Therefore, a change in position accuracy of the bumps for contact can be easily measured by an image processor with reference to the alignment mark. An optimum position for contact between the wafer to be inspected and the inspection electrodes on the wafer can be computed from the measurement result.
    • 一种用于形成在半导体晶片上的多个半导体集成电路器件的电特性的晶片级测试的探针卡。 该卡具有带有凸块的薄膜,多个凸起分别与半导体集成电路器件的所有检查电极接触,并且保持在刚性陶瓷环上。 由与凸起接触形成的凸起构成的对准标记被加到具有凸块的薄膜上。 保持对准标记相对于用于接触的凸块的期望位置。 因此,可以通过参照对准标记的图像处理器容易地测量接触用凸块的位置精度的变化。 可以从测量结果计算要检查的晶片与晶片上的检查电极之间的接触的最佳位置。
    • 4. 发明授权
    • Probe card, method of manufacturing the probe card and alignment method
    • 探针卡,制造探针卡的方法和对准方法
    • US07982482B2
    • 2011-07-19
    • US12412102
    • 2009-03-26
    • Kenji YamadaYoshirou Nakata
    • Kenji YamadaYoshirou Nakata
    • G01R31/00
    • G01R31/2891G01R1/07314G01R1/0735G01R3/00Y10T29/49117Y10T29/49151
    • A probe card for a wafer level test of electrical characteristics of a plurality of semiconductor integrated circuit devices formed on a semiconductor wafer. The card has a thin film with bumps on which a plurality of bumps to be respectively brought into contact with all of inspection electrodes of the semiconductor integrated circuit devices are formed, and which is held on a rigid ceramic ring. An alignment mark constituted by a bump formed simultaneously with the bumps for contact is added to the thin film with bumps. The desired position of the alignment mark relative to the bumps for contact is maintained. Therefore, a change in position accuracy of the bumps for contact can be easily measured by an image processor with reference to the alignment mark. An optimum position for contact between the wafer to be inspected and the inspection electrodes on the wafer can be computed from the measurement result.
    • 一种用于形成在半导体晶片上的多个半导体集成电路器件的电特性的晶片级测试的探针卡。 该卡具有带有凸块的薄膜,多个凸起分别与半导体集成电路器件的所有检查电极接触,并且保持在刚性陶瓷环上。 由与凸起接触形成的凸起构成的对准标记被加到具有凸块的薄膜上。 保持对准标记相对于用于接触的凸块的期望位置。 因此,可以通过参照对准标记的图像处理器容易地测量用于接触的凸块的位置精度的变化。 可以从测量结果计算要检查的晶片与晶片上的检查电极之间的接触的最佳位置。
    • 10. 发明授权
    • Control device and control method for alternating-current motor
    • 交流电机控制装置及控制方法
    • US08536810B2
    • 2013-09-17
    • US13055610
    • 2009-07-08
    • Kenji Yamada
    • Kenji Yamada
    • H02P6/08
    • H02P27/04
    • When performing PWM control in accordance with an overmodulation mode, an ECU variably sets a switching determination value, which is used for determination of switching control modes between the overmodulation mode and a sinusoidal wave modulation mode, based on a switching state of an inverter at present. Then, the ECU compares the degree of modulation, which is calculated from voltage command values, with the switching determination value so as to determine whether to switch to the sinusoidal wave modulation mode or to maintain the overmodulation mode. In particular, when an influence of a dead time is likely to cause generation of a voltage command that requires switching to the overmodulation mode just after switching to the sinusoidal wave modulation mode, the switching determination value is variably set to prevent the transition from the overmodulation mode to the sinusoidal wave modulation mode. This prevents chattering in which the control modes are frequently switched therebetween.
    • 当根据过调制模式执行PWM控制时,ECU基于目前的逆变器的开关状态可变地设置用于确定过调制模式和正弦波调制模式之间的开关控制模式的开关判定值 。 然后,ECU将根据电压指令值计算的调制度与切换判定值进行比较,以便确定是切换到正弦波调制模式还是维持过调制模式。 特别地,当切换到正弦波调制模式之后,当死区时间的影响可能导致产生需要切换到过调制模式的电压指令时,切换判定值被可变地设置以防止过调制 模式到正弦波调制模式。 这防止其间经常切换控制模式的抖动。